Atotech Deutschland Gmbh

Manfred Maurer

Horst Blasing

Lorenz Kopp

Rolf Schroder

Ralf-Peter Wachter

Jens-Eric Geisler

A method and an apparatus are described for regulating the concentration of metal ions in an electrolytic fluid, which is used for the deposition of metal with insoluble anodes and additionally contains compounds of an electrochemically reversible redox system. With the oxidized form of said system, metal is dissolved in an ion generator , traversed by the fluid, so that these compounds are thereby reduced. For the deposition of metal, the dissolved metal ions on the item to be treated are reduced. The compounds of the redox system in the reduced form are oxidized again on the insoluble anodes in the electroplating system . In order to keep the concentration of the metal ions in the electrolytic fluid constant, at least a portion of the electrolytic fluid, contained in the electroplating system, is conducted through one or a plurality of electrolytic auxiliary cells

Method and device for regulating the concentration of substances in electrolytes

The circuit arrangement and method for supplying pulsed current to electrolytic cells according to the invention are used in electroplating systems. To supply current to each electrolytic cell, there are provided two galvanic rectifiers,and one change-over switch,with respectively two individual switches,, one output of the rectifiers being connected via a first electric line,with the one terminal of the electrolytic cell, the respective other outputs of the rectifiers being connected each via a second electric line,with the inputs of the change-over switches, and the output,of the change-over switch being connected with the other terminal of the electrolytic cell, a capacitor,being respectively connected, in addition, between the first electric line and the second electric lines. Periodic pulse sequences are generated by alternate opening and closing said separate switches.

Circuitry and method for an electroplating plant or etching plant pulse power supply

Method for controlling the work cycle of electroplating plants

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Heideck, Germany

Manfred Maurer