Schering Aktiengesellschaft

Manfred Kallweit

Horst Blasing

The apparatus for treating and/or cleaning an object, especially a circuit board, with a flood flow of fluid comprises means for moving the object along a path in the apparatus and a number of flood flow devices past which the object is moved on the path, all of which are located above the path. A fluid damming means, preferably a pressing roll contacting the path, may be provided on each of the long sides (the sides transverse to the feed direction) of each flood flow device so that in operation a fluid pool arises around each flood flow device. The flood flow device advantageously comprises a plurality of fluid feed pipes, a fluid receiving chamber of a larger diameter than the feed pipes receiving fluid from them, a perforated mask located downstream in the fluid receiving chamber provided with a plurality of through-going holes and a distributor chamber provided with an outlet mouth located downstream of the perforated mask, the distributor chamber with the outlet mouth and the path defining a flooded space above the path. The fluid receiving chamber, the distributor chamber, the outlet mouth and the flooded space extend substantially over the entire length L of the flood flow device.

Apparatus and method for treating and/or cleaning of objects,

A device for cleaning or chemically treating workpieces, particularly printed circuit boards with solutions applied to the workpieces by nozzles comprises a two-part housing, the lower portion of which is supplied with a treatment solution and is communicated with the upper part which is subdivided into two chambers by a separating wall. Each chamber is limited from the upper wall of the housing by a flat perforated wall through which the solution flows to the nozzles formed by elongated slots.

Device for cleaning or chemical treatment or workpieces

An arrangement is disclosed for the galvanic deposition of metal at relatively greater speed and with controllable layer-thickness distribution, of the type composed of an electrolysis tank with overflow, electrodes, nozzles, connecting conduit tubes, pumps, control system means and dosaging system means as well as electrical appurtenances, wherein a cathodically-connected work piece to be galvanized is arranged between two nozzles which are each formed from two chambers located one above the other and having separate entrance and exitways, the upper chamber contains an electrolyte exit opening provided as a longitudinal slit and the lower chamber defines an anode niche displaying at the height of the slit a vertically-adjustable opening. Also disclosed is a method for the electrolytical deposition of metal, employing substantially the above described arrangement and particularly for depositing nickel- or gold-coatings on plug contacts of printed circuits.

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Berlin, Germany

Manfred Kallweit