Ems Inventa Ag

Ems-patent Ag

Ems-chemie Ag

Ens-inventa Ag

Manfred Hewel

Andreas Bayer

Botho Hoffmann

Hans Dalla Torre

Nikolai Lamberts

Thomas Wiedemann

Ulrich Presenz

Ornulf Rexin

Georg Stoeppelmann

Georg Stoppelmann

Oliver Thomas

Arda Alkan

Andri Cadalbert

Jean-Jacques Linster

Georg St&ouml;ppelmann

Eduard Schmid

Heinz G Hoff

Philipp Harder

Georg Stöppelmann

Ralph Kettl

Sepp Bass

Friedrich S Buehler

Lorenz Meier

Renato Nay

Annette Lavalette

Frank Annighofer

Martin Sütterlin

Martina Hirayama

Viacheslav Vertlib

Daniel Capaul

Lothar Michael Ploetze

Hans-Jorg Caluori

Bettina Vetterli

Hans-Dalla Torre

Heinz Hoff

Martin SÜTTERLIN

The present invention relates to the use of a polyamide molding compound for application purposes in which a high resistance to hypochlorous acid is decisive. The molding compound is thus used in accordance with the invention for molds that are suitable for contact with aqueous solutions containing hypochlorous acid.

Method of manufacturing a mold that is resistant to hypochlorite

The present invention relates to the use of a polyamide molding compound for application purposes in which high resistance to hypochlorous acid is crucial. The molding compound is thus used according to the invention for molded bodies suitable for being in contact with aqueous; hypochlorous acid-containing solutions.

Polyamide molding compounds for hypochlorite-resistant applications

A polyamide moulding composition in particular for use for components in the drinking water sector, made of the following constituents:

Polyamide moulding composition, in particular for the production of mouldings in the drinking water sector

The invention relates to a method for storage and for transport of polyamide granulate which comprises at least one amorphous or microcrystalline polyamide. By means of this novel method, yellowing during further processing to form the moulded article can be avoided or at least reduced. Likewise, the invention relates to a corresponding container in which the polyamide granulate is stored. The invention also relates to correspondingly stored or transported polyamide granulate and also moulded articles produced therefrom.

Method and container for storage and transport of polyamide granulates and correspondingly stored or transported polyamide granulate and also moulded articles produced therefrom

A polyamide moulding composition with particularly good tensile strain at break consisting of the following constituents: (A) 50 to 100% by weight of at least one transparent polyamide composed of: (a1) 55 to 77 mol % of acyclic, aliphatic diamine having 5-10 carbon atoms; (a2) 23 to 45 mol % of cycloaliphatic diamine having 6-36 C atoms, where the proportions of (a1) and (a2) are based on the entirety of the diamines used; (a3) 40 to 80 mol % of aromatic dicarboxylic acid or a mixture of such dicarboxylic acids; and (a4) 20 to 60 mol % of acyclic, aliphatic dicarboxylic acid having 8 to 16 carbon atoms, or a mixture of such dicarboxylic acids, where the proportions of (a3) and (a4) are based on the entirety of the dicarboxylic acids used; and (B) 0-50% by weight of additives; where the entirety of components (A) and (B) gives 100% by weight.

Transparent polyamide moulding compositions with high tensile strain at break

A molding compound consisting of the components: (A)-(E), wherein the sum of (A)-(E) makes up 100 wt. %. Component A is 40-70 wt. % of at least one partially crystalline polyamide, made up of: (a1) 60-75 wt. % of 6T units; (a2) 20-35 wt. % of 6I units; (a3) 3-15 wt. % of 612 units; (a4) 0-5 wt. % of one of the following units: 66; 68; 69; 610; 6; or a mixture of such units; wherein the sum of (a1) to (a4) makes up 100 wt. % of (A). Component (B) is 30-60 wt. % of fibrous reinforcing materials. Component (C) is 0-30 wt. % of particulate fillers different from (B), (D) and (E). Component (D) is 0-2.0 wt. % of heat stabilizers, and component (E) is 0-6 wt. % of auxiliary agents and/or additives, different from (A)-(D).

High temperature-resistant polyamide moulding compounds and uses thereof especially in the automotive sector

The invention relates to copolyamides which are formed from a diamine component, a dicarboxylic acid component and possibly a lactam- and/or &#x3c9;-amino acid component. Furthermore, the invention relates to a polyamide moulding compound which comprises at least one of these copolyamides. Moulded articles produced from these moulding compounds are used in the automobile field, in the domestic field, in measuring-, regulating- and control technology or in mechanical engineering.

Copolyamides, moulding compounds comprising these and moulded articles produced therefrom

The present invention relates to heat-aging resistant polyamide molding materials based on partially crystalline, partially aromatic polyamides as well as to moldings manufactured therefrom.

Polyamide molding material and moldings manufactured from same

A polyamide molding composition and uses thereof, and moldings produced therefrom, comprising the following components:

Polyamide moulding compositions, process for production thereof and use of these polyamide moulding compositions

The invention relates to polyamide sheet silicate compositions, containing an untreated clay mineral and a water-soluble polyamide, the concentration of the clay material being greater than 30% by weight. Furthermore the invention relates to nanocomposites which contain clay minerals distributed homogeneously in a water-insoluble thermoplastic matrix. These nanocomposites are produced by mixing the polyamide sheet silicate composition and a water-insoluble thermoplastic in the melt.

Polyamide sheet silicate compositions

The present invention relates to reinforced polyamide molding materials which can be prepared from a polyamide blend and, for example, by compounding with cut fibers or continuous filaments on twin-screw extruders and have mechanical properties which are usually not compatible with one another, namely a combination of exceptionally high rigidity and strength and at the same time good toughness. Furthermore, a high heat distortion temperature (HDT) is achieved according to the invention. The thermoplastic polyamide molding materials according to the invention are suitable for the production of moldings or other semifinished products or finished articles, which can be produced, for example, by extrusion, injection molding, direct methods or direct compounding, in which the compounded polyamide molding material is processed directly by injection molding, or other deformation techniques.

Reinforced polyamide moulding materials

An unreinforced, halogen-free polyamide moulding composition having the following composition: (A) 62-87% by weight of a partially aromatic, partially crystalline copolyamide having a melting point of 270&#xb0; C. to 320&#xb0; C. and made up of 100% by weight of diacid fraction composed of: 50-100% by weight of terephthalic acid (TPA) and/or naphthalenedicarboxylic acid; 0-50% by weight of isophthalic acid (IPA), and 100% by weight of diamine fraction; (B) 5-15% by weight of ionomer; (C) 8-18% by weight of flame retardants; (D) 0-5% by weight of additives; where the components (A)-(D) add up to 100% by weight.

Partially aromatic polyamide moulding compositions and their uses

What is described is a polyamide molding material based on semicrystalline polyamides for production of LED housings or housing components with high strength, high long-term reflectivity and low blistering tendency. The polyamide moulding material proposed consists of the following components The percentages by weight of components (A) to (D) together add up to 100%, with the proviso that components (B), (C) and (D) meet the following conditions: (B)+(C)+(D)=20 to 60% by weight; weight ratio of (C)/(D) in the range from 0.25 to 1.5, where the polyamide molding material may optionally comprise customary additives (E) in addition to components (A) to (D), and where the amount thereof is in addition to the sum of components (A) to (D).

Polyamide moulding material and use thereof for production of LED housing components

A polyamide molding composition with the following constitution is described: Uses of this type of molding composition are also described, in particular for the production of a fuel line, cooling line, oil line or urea line for the automobile sector, as also are production processes to give moldings.

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Domat/Ems, Switzerland

Manfred Hewel