Infineon Technologies Ag

Siemens Aktiengesellschaft

Other

Manfred Fries

Reinhard Fischbach

Detlef Houdeau

Thomas Mueller

Horst Theuss

Klaus Elian

Guenther Ruhl

Jochen Dangelmaier

Mathias Vaupel

Franz-Peter Kalz

Florian Brandl

Josef Mundigl

J&uuml;rgen Fischer

Frank P&uuml;schner

Juergen Hoegerl

Georg Meyer-Berg

Peter Stampka

Franz Michael Darrer

Stefan Paulus

Wolfgang Friess

Thies Janczek

Martin Petz

Frank Puschner

Tue Fatt David Wee

Matthias Rose

Jurgen Fischer

Thomas M&uuml;nch

Stephan Auer

Sie Boo Chiang

Thomas Münch

Jürgen Fischer

Annemarie Seidl

Manfred Zaeske

A semiconductor device and a method of manufacturing the same are provided such that a microelectromechanical systems (MEMS) element is protected at an early manufacturing stage. A method for protecting a MEMS element includes: providing at least one MEMS element, having a sensitive area, on a substrate; and depositing, prior to a package assembly process, a protective material over the sensitive area of the at least one MEMS element such that the sensitive area of at least one MEMS element is sealed from an external environment, where the protective material permits a sensor functionality of the at least one MEMS element.

Deposition of protective material at wafer level in front end for early stage particle and moisture protection

A sensor arrangement according to an embodiment includes a substrate, and at least one sensor and a control circuit mounted on the substrate, wherein the at least one sensor and the control circuit are located on the substrate to be mountable inside a battery cell and outside the battery cell, respectively.

Sensor arrangement, battery cell and energy system

An apparatus for determining a state of a rechargeable battery or of a battery has a sensor device and an evaluation device. The sensor device brings about an interaction between an optical signal and a part of the rechargeable battery or of the battery, which part indicates optically acquirable information about a state of the rechargeable battery or of the battery, and detects an optical signal caused by the interaction. The sensor device furthermore provides a detection signal having information about the detected optical signal. The evaluation device determines information about a state of the rechargeable battery or of the battery on the basis of the information of the detection signal. Furthermore, the evaluation device provides a state signal having the information about the determined state.

Apparatus for determining a state of a rechargeable battery or of a battery, a rechargeable battery or a battery, and a method for determining a state of a rechargeable battery or of a battery

This application relates to a semiconductor device comprising multiple separate leads molded in a molded structure, and a chip attached to the molded structure over at least two of the multiple separate leads.

Semiconductor device

An optoelectronic component with an optoelectronic transducer is produced with the novel method. The optoelectronic component has a coupling region, which is formed in a radiation-transparent molding of the optoelectronic component. On the base of a clearance of the coupling region, the optoelectronic component has a radiation-optical functional surface, which is formed from the housing material and introduced into the molding with the aid of a profile milling cutter.

Method for producing an optoelectronic component

A product label includes a semiconductor chip and an antenna. The semiconductor chip stores information about a product. The antenna transmits the information about the product to a reading device. The antenna has a predetermined breaking point at which the antenna can be destroyed during the reading operation by energy introduced by the reading device so that the product label can be read only for a specific number of read cycles. A method of producing product labels and a method for a contactless, forgery-proof identification of products are also provided.

Product label, method of producing product labels and method for identifying products in a contactless and forgery-proof manner

A configuration of a flat carrier with a chip module in a padded envelope, which can be transported in a transport device in the direction of one of the envelope's side edges, includes disposing the chip module in the padded envelope such that wire connections in the chip module extend over a side of the semiconductor chip that runs parallel to the transport device. Such a configuration is made possible by the fact that the flat carrier is applied in a standard way to a further carrier, which is folded in a suitable way.

Configuration of a flat carrier with a chip module in a padded envelope and method of arranging the configuration

In a smart card module for biometric sensors for installation in smart cards, a support has at least one through opening or window in the region of a sensor chip. The sensor chip is mounted on the support such that an active surface of the sensor chip is directed toward the support and is situated in the region of the window, so that it can be accessed through the window in the support.

Smart card module for biometric sensors

In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.

Method of producing a biometric sensor

A housing for biometric sensor chips and a method for producing such a housing includes a freely accessible fingerprint checking area on a sensor chip, a mount substrate with contact outer surfaces thereon, the mount substrate being a mounting strip with perforated edges, on which the contact outer surfaces are disposed partially outside a housing frame, and the sensor chip is positioned within the housing frame.

Housing for biometric sensor chips and method for producing the housing

A portable data carrier includes a card-shaped body having a recess for receiving a chip module. The chip module includes at least one semiconductor chip on a first main side of a chip carrier connected to the card-shaped body, and a metallization layer disposed on a second main side of the chip carrier and having contact lugs. The chip carrier has desired bending points which, upon the occurrence of bending stresses, reduce forces on the semiconductor chip and wire connections.

Portable data carrier

A housing assembly forms a package for an electronic device. The housing assembly has the electronic device, an external carrier and a housing frame. A capillary-acting epoxy resin is filled into the assembled housing assembly via a filling-in opening and, on account of its capillary action, closes the interspaces between the semiconductor chip and the housing frame.

Housing assembly for an electronic device and method of packaging an electronic device

Biometric sensor and method for its production

A flat carrier having a power supply, for example in the form of a coil. The carrier is characterized by an electroluminescent device that contains two flat electrodes lying above one another and an electroluminescent paste located between the electrodes. The electrodes of the electroluminescent device are connected to terminals of the power supply, which can be implemented, for example, as a coil or battery.

Growing community of inventors

Hunderdorf, Germany

Manfred Fries