Austriamicrosystems Ag

Ams Ag

Austria Mikro Systeme International Aktiengesellschaft

Manfred Brandl

Josef Janisch

Gerald Wiednig

Teijo Viljanen

Sébastien Poirier

Marcel Urban

Robert Csernicska

Sudhakar Singamala

Vijay Ele

V Veeresh Babu

Gernot Hehn

Jean Marc Lucchini

Sandeep Vernekar

Sari Abwa

Bernd Gessner

Walter Draxler

Rajesh Tiruvuru

Jose Vinau

The invention relates to a cell balancing module, particularly for voltage balancing of a stack of batteries. The cell balancing module comprises an interface (SPI, VrefH, VrefL) to input a coded reference voltage (Vref) and input nodes (In, . . . , InN) for connecting a stack of energy storage cells (BAT, . . . , BATn). A switching unit (SW) is connected to each of the input nodes (In, . . . , InN) and a local balancing unit (loc) coupled to the switching unit (SW) and the interface (SPI, VrefH, VrefL). The local balancing unit (loc) is designed to compare the coded reference voltage (Vref) with cell voltages (VBAT, . . . , VBATn) of the stack of energy storage cells (BAT, . . . , BATn) to be connected and to charge balance the stack of energy storage cells (BAT, . . . , BATn) to be connected depending on the comparison of coded reference voltage (Vref) and cell voltages (VBAT, . . . , VBATn). The invention also relates to a voltage balancing device and method for cell balancing, particularly for voltage balancing of a stack of batteries.

Cell balancing module and method in voltage balancing device for a stack of batteries which compares the cell voltages to a coded reference voltage derived from at least two reference voltages

An arrangement for operating a sensor, in particular a bridge sensor, comprises a sensor input (Vin, Vin) for connecting the sensor (Brdg) and a clocked signal generator (Osc), which is coupled to the sensor input (Vin, Vin). Furthermore an amplifier (Amp) is provided for detecting sensor signals (Sn, Sn+1), which is connected on the input side to a signal input (IN+, IN&#x2212;) for connecting the sensor (Brdg), wherein the detection takes place depending on the clock pulse of the signal generator (Osc). A signal processing device (PROC) is connected to an output (AOUT+, AOUT&#x2212;) of the amplifier (Amp) and is arranged to demodulate the sensor signals (Sn, Sn+1) that follow one another according to the clock pulse.

Arrangement and method for operating a sensor, in particular a bridge sensor, and a sensor arrangement

The invention relates to a spring (), in particular for a push button, for fixing to a carrier () and for registering a vertical force (F). The spring () is designed in such a way that when actuated it converts a vertical movement into a horizontal movement that can be detected by sensor means ().

Spring, particularly for a push button

A magnetic field sensor arrangement () comprises a stacked arrangement () with a first magnetic field sensor body () and a second magnetic field sensor body (). The first magnetic field sensor body () has a first main surface (), on which is arranged a first magnetic field sensitive element (), and a second main surface (), which is approximately parallel to the first main surface (). The second magnetic field sensor body () has similarly a first main surface (), on which is arranged a second magnetic field sensitive element (), and a second main surface (), which is approximately parallel to the first main surface ().

Magnetic field sensor arrangement and method for non-contact measurement of a magnetic field

In a method for transmitting data, the step of transmitting the data representing a measured pressure or pressure variation is repeated with a first repetition rate if no pressure variation has been detected or repeated with a second repetition rate if a specific pressure variation has been detected. The second repetition rate is higher than the first repetition rate. The different repetition frequencies can be used in a method for determining a tire position in a tire pressure measurement system to switch between a first mode of operation and a second mode of operation. The method for determining a tire position evaluates the repetition rate between the received data packets of transmitted data and extracts a pressure variation out of the received data packets.

Method for determining a tire position in a tire pressure measurement system

The present invention describes a microsensor with a sensor element () and an integrated circuit (), containing a semiconductor body () with an intergrated circuit (), the sensor element () being positioned on a main surface () of the semiconductor body () and there being a eutectic connection () formed between the semiconductor body () and the sensor element ().

Micro-sensor

To expose a submerged bondable terminal pad in a component that includes at least two substrates which are joined with each other, it is proposed that grooves of relatively shallow depth be provided on the connecting surface of the second substrate before the two substrates are joined. After the two substrates are joined, incisions are made opposite the grooves which open the grooves from the back side. The cutouts to be removed are defined between two grooves.

Method for producing an electrical component

In a microsensor with a micro-electromechanical sensor element and an integrated circuit for measuring, calibration and compensation electronics, whereby the sensor is connected electrically to the integrated circuit (IC), the micro-electromechanical sensor element is arranged directly on the integrated circuit with accurate positioning, and is connected with electric conductivity via a circulating soldered joint.

Microsensor having a sensor device connected to an integrated circuit by a solder joint

A method for housing sensors in a package and, in particular, housing chemical sensors, flow sensors or optical sensors in a synthetic package. In a first step, the active sensor surface of a semiconductor or IC sensor is provided with a cap forming a hollow space above the active sensor surface and the sensor is connected with contacts and bond wires. In a second method step, the package is formed by molding, in particular injection molding. In a third method step, or simultaneously with the second method step, the hollow space formed above the active sensor surface is opened.

Growing community of inventors

Gratwein, Austria

Manfred Brandl