Motorola Corporation

Motorla, Inc.

Motorolr, Inc.

Manes Eliacin

Robert B Lempkowski

Ke Keryn Lian

Aroon V Tungare

Keryn Lian

Junhua Liu

Jovica Savic

Claudia Gamboa

Marc Kenneth Chason

Tomasz L Klosowiak

Robert H Terbrueggen

Robert T Croswell

Krishna D Jonnalagadda

Shawn O'Rourke

Daniel J Sadler

Lih-Tyng Hwang

Spencer A Lane

An embedded assembly () and method for fabricating the same is provided. The embedded assembly includes an organic substrate () and at least one movable element (). The embedded assembly also includes at least one antenna element (). The method includes providing () the organic substrate, and embedding () the at least one moveable element on the organic substrate. The method also includes embedding () the at least one antenna element on the organic substrate.

Embedded assembly including moveable element and antenna element

A first and second capacitor plate are provided (and). Each capacitor plate has an opening disposed therethrough with the second capacitor plate being disposed substantially opposite the first capacitor plate. A first electrically conductive path interface is then disposed () in one of these openings as is at least a second electrically conductive path interface ().

Apparatus and methods relating to electrically conductive path interfaces disposed within capacitor plate openings

A meso-electromechanical system () includes a substrate (), a standoff () disposed on a surface of the substrate, a first electrostatic pattern () disposed on the surface of the substrate, and a glass beam (). The glass beam () has a fixed region () attached to the standoff and has a second electrostatic pattern () on a cantilevered location of the glass beam. The second electrostatic pattern is substantially co-extensive with and parallel to the first electrostatic pattern. The second electrostatic pattern has a relaxed separation () from the first electrostatic pattern when the first and second electrostatic patterns are in a non-energized state. In some embodiments, a mirror is formed by the electrostatic materials that form the second electrostatic pattern. The glass beam may be patterned using sandblasting ().

Meso-microelectromechanical system having a glass beam and method for its fabrication

Circuit boards () and methods for fabricating circuit boards that include conduits () are provided. The conduits formed by patterning a metal layer () are lined by inert coating () and caped by a photodefinable polymer layer () that is affixed to the inert coating by with the help of an initially uncured polymer layer (). Holes are formed by patterning the photodefinable polymer layer for admitting and removing fluid from the conduit.

Conduits integrated in circuit board and method of manufacture

An organic semiconductor device () can be embedded within a printed wiring board (). In various embodiments, the embedded device () can be accompanied by other organic semiconductor devices () and/or passive electrical components (). When so embedded, conductive vias () can be used to facilitate electrical connection to the embedded device. In various embodiments, specific categories of materials and/or processing steps are used to facilitate the making of organic semiconductors and/or passive electrical components, embedded or otherwise.

Organic semiconductor device and method

A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board () at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (), an insulating member () formed on the first metal layer, and a second metal layer () situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover () on the package to provide an environmental seal.

Meso-microelectromechanical system package

Circuit boards ( ) and methods for fabricating circuit boards that include heaters for maintaining temperature sensitive components at an operating temperature are provided. Resistive traces ( ) are included in the circuit boards proximate temperature sensitive apparatus ( ). Thermally conductive patches ( ) are interposed between the resistive traces and the temperature sensitive components. The thermally conductive patches establish zones of relatively uniform temperatures. According to a preferred embodiment of the invention the temperature sensitive apparatus comprises a fluid conduit ( ).

Heater for temperature control integrated in circuit board and method of manufacture

A meso-scale MEMS device having a movable member ( ) is formed using standard printed wiring board and high density interconnect technologies and practices. In one embodiment, sacrificial material disposed about the movable member ( ) is removed through openings ( ) as formed through a cover ( ) to form a cavity ( ) that retains and limits the freedom of movement of the movable member ( ). The movable member can support a reflective surface ( ) to thereby provide a mechanism that will support a projection display and/or image scanner (such as a bar code scanner).

Micro electro-mechanical system with one or more moving parts method and apparatus

A meso-scale MEMS device having a cantilevered beam is formed using standard printed wiring board and high density interconnect technologies and practices. The beam includes at least some polymer material to constitute its length, and in some embodiments also comprises a conductive material as a load-bearing component thereof. In varying embodiments, the beam is attached at a location proximal to an end thereof, or distal to an end thereof.

Growing community of inventors

Buffalo Grove, IL, United States of America

Manes Eliacin