Cisco Technology, Inc.

Mandy Hin Lam

M Baris Dogruoz

Rakesh Chopra

Mark C Nowell

Toan N Nguyen

Jimmy C Leung

Joel Richard Goergen

Vic Hong Chia

Saeed Seyed

Hong Huynh

Yi Tang

Pirooz Tooyserkani

Robert Gregory Twiss

Keith Frank Tharp

Michael Chern

Phillip S Ting

Susheela Nanjunda Rao Narasimhan

Frank S Jun

Frans Kusnadi

Jonathan Lee Smith

Kamran Esmaily

Jimmy Che-Kin Leung

Ravi Eda

Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows.

Thermal management of high capacity optics in dense arrangements

A network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis. A coolant is delivered to a first group of the plurality of modules with a first flow control valve in a first cooling loop and the coolant is delivered to a second group of the plurality of modules with a second flow control valve in a second cooling loop. The network communication device further includes a plurality of sensors for monitoring a temperature in the first cooling loop and the second cooling loop and a control system for controlling delivery of the coolant to the first group and the second group, where the control system controls transmitting a signal to one of the first flow control valve and the second flow control valve to modify a flow of the coolant.

Liquid cooling distribution in a modular electronic system

In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.

Localized immersion cooling enclosure with thermal efficiency features

In one embodiment, an apparatus is configured for insertion into a network device and includes a printed circuit board, at least one electronic component mounted on the printed circuit board and configured for direct air-cooling, and an enclosure comprising a plurality of electronic components, an electrical connector, a fluid inlet connector, and a fluid outlet connector. A dielectric liquid is disposed within the enclosure for immersion cooling of said plurality of electronic components during operation of the network device.

Localized immersion cooling enclosure

Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.

Air cooled cage design

In one embodiment, a network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis, at least a portion of the modules each comprising a connector for receiving coolant for cooling components on the module, a controller for controlling coolant distribution to the modules, and a leak detection system for identifying a leak of the coolant and transmitting an indication of the leak to the controller.

According to one aspect, an apparatus includes a first component, a plurality of line card slots, a fan array, and a sensor arrangement. The first component has a first opening defined therein and a second opening defined therein. The first component includes a first configurable line card flapper is arranged to at least partially cover the first opening and a second configurable line card flapper is arranged to at least partially cover the second opening. The plurality of line card slots includes a first line card slot associated with the first opening and a second line card slot associated with the second opening. The fan array includes a plurality of fans. The sensor arrangement includes at least one sensor arranged to monitor at least one condition. The first and second configurable line card flappers are arranged to be configured using information obtained from the sensor arrangement.

Configurable line card flapper

An apparatus includes a cage structure and a cooling plate configured to contain a cooling liquid to cool the cage structure. The cage structure has a front end, a top surface adjacent to the front end, a first opening at the front end, and a second opening on the top surface. The first opening is configured to receive a pluggable optical module. The cooling plate is disposed on top of the second opening of the cage structure. The apparatus may further include a deformable pad disposed at the second opening of the cage structure and beneath the cooling plate.

Liquid cooled optical cages for optical modules

In one embodiment, an optical module cage includes a first opening for slidably receiving an optical module, a second opening positioned adjacent to the first opening for slidably receiving a riding heatsink separate from the optical module or an integrated heatsink connected to the optical module, and a guide rail interposed between the first opening and the second opening, wherein the guide rail is configured to support the riding heatsink and not interfere with insertion of the integrated heatsink.

Optical module cage with configurable heatsink

In one embodiment, an apparatus includes a frame for attaching to a module with contacts of the module exposed for mating with a connector operable to couple the module to a printed circuit board, the frame comprising a seal for positioning on opposing faces of the module adjacent to the contacts to protect a module to connector interface from contaminants passing through a network device with the module installed in the network device.

Contamination protection for module and connector interface in a network device

In one embodiment, an apparatus includes a chassis comprising a plurality of slots for receiving a plurality of modules, a first group of the modules received in a first orientation and a second group of the modules received in a second orientation orthogonal to said first orientation, and a coolant distribution module inserted into one of the slots in the first orientation for distributing coolant to at least one of the modules in the second group of modules. A method for distributing coolant to the modules is also disclosed herein.

In one embodiment, an apparatus includes a line card ejector configured to engage with a chassis to retain the line card within a slot in the chassis in a closed position, a locking member movable between a locked position in which the ejector is locked in its closed position and an unlocked position in which the ejector may be moved to an open position to remove the line card from the chassis, and an actuation device for moving the locking member from its locked position to its unlocked position. The locking member comprises an accessible release lever for moving the locking member from its locked position to its unlocked position without use of the actuation device for emergency release and removal of the line card. A method for emergency release of the line card is also disclosed herein.

Growing community of inventors

Fremont, CA, United States of America

Mandy Hin Lam