Intel Corporation

Mandy G Terhaar

George Hsieh

Cheryl M Floyde

Michael Kochanowski

A substrate, such as a printed circuit board (PCB), has pairs of pads to which terminals of electronic components, such as capacitors, can be mounted. The pads have perimeters, for example, in the shape of rectangles, circles, or ovals. In one embodiment, to reduce asymmetrical, lateral, surface-tension forces that can cause the components to tombstone due to uneven heating of solder fillets on the pads during solder reflow, the edge of the perimeter of each pad opposite the inter-pad region contains one or more notches or indentations. Also described are an electronic assembly, an electronic system, and various methods of fabrication.

Anti-tombstoning structures and methods of manufacture

A heatsink which includes a body having a first arm and a second arm and having a mounting area between the first arm and the second arm. The mounting area is dimensioned to hold a heat generating electronic component. The mounting area is dimensioned so that when the component is located within the mounting area, the first arm and the second arm apply opposing forces against the component so that the component is held within the mounting area by the first arm and the second arm.

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Tualatin, OR, United States of America

Mandy G Terhaar