Ebara Corporation

Manao Hoshina

Makoto Kashiwagi

Kenichi Kobayashi

Asagi Matsugu

Mitsuru Miyazaki

Masaya Seki

Junji Kunisawa

Masayuki Nakanishi

Kenichi Akazawa

Akihiro Yazawa

Fong-Jie Du

A substrate holding apparatus which can enhance the efficiency of processing of a substrate, such as a wafer, is disclosed. The substrate holding apparatus for holding a substrate and rotating the substrate, includes: rollers capable of contacting a periphery of the substrate; a roller rotating mechanism configured to rotate the rollers; and eccentric shafts coupling the rollers and the roller rotating mechanism, the eccentric shafts having first shaft portions and second shaft portions, the second shaft portions being eccentric relative to the first shaft portions, the first shaft portions being secured to the roller rotating mechanism, and the rollers being secured to the second shaft portions, respectively.

Substrate holding apparatus, substrate processing apparatus having substrate holding apparatus, and substrate processing method

A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.

Polishing apparatus

There is disclosed a substrate processing apparatus which can align a center of a substrate with a central axis of a process stage with high accuracy to prevent a defective substrate from being produced. The substrate processing apparatus includes: an eccentricity detecting mechanism configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, held on the centering stage, from a central axis of the centering stage; and an aligner configured to align the center of the substrate with a central axis of a process stage. The aligner obtains, after the substrate is transferred from the centering stage to the process stage, an amount of eccentricity and an eccentricity direction of the center of the substrate from the central axis of the process stage by use of the eccentricity detecting mechanism; and confirms that the obtained amount of eccentricity of the center of the substrate from the central axis of the process stage is within a predetermined allowable range.

Substrate processing apparatus and substrate processing method

An elastic member that includes a plurality of pressure chambers is manufactured without using a mold having a complicated shape. According to one embodiment, a laminated membrane used in a substrate holder of a substrate processing apparatus is provided. Such a laminated membrane includes a first sheet material and a second sheet material disposed on the first sheet material. A part of the first sheet material is secured to a part of the second sheet material.

Laminated membrane, substrate holder including laminated membrane, and substrate processing apparatus

According to one embodiment, there is provided a top ring for holding a substrate. The top ring comprises a substrate supporting surface, a retainer member disposed to surround an outer periphery of the substrate supporting surface, and a retainer guiding device configured to guide the retainer member so as to allow the retainer member to be displaced in a direction perpendicular to the substrate supporting surface, and support the retainer member so as to inhibit the retainer member from being displaced in a direction parallel to and away from the substrate supporting surface. The retainer guiding device is disposed in an inner side of the retainer member surrounding the substrate supporting surface.

Top ring for holding a substrate and substrate processing apparatus

A polishing head having a simple construction and a compact size is disclosed. The polishing head includes: a polishing-tool pressing member for supporting a polishing tool; a movable shaft coupled to the polishing-tool pressing member; a housing which houses the movable shaft therein; and a diaphragm which forms a pressure chamber between an end portion of the movable shaft and the housing, the diaphragm including a central portion in contact with the end portion of the movable shaft, an inner wall portion connecting with the central portion and extending along a side surface of the movable shaft, a folded-back portion connecting with the inner wall portion and having a curved cross section, and an outer wall portion connecting with the folded-back portion and located outside the inner wall portion.

Polishing head and polishing apparatus

Provided is a jig for assisting the dismounting and mounting of a top ring. One embodiment provides a jig for mounting/dismounting at least a part of the top ring for holding a substrate. The jig comprises a movable plate for supporting at least a part of the top ring, which is in a dismounted state, a plurality of posts for positioning the jig at a predetermined position relative to the top ring, the plurality of posts being configured to be engaged with the top ring, and a drive mechanism for moving the movable plate in a direction toward and away from the top ring.

Jig for a polishing apparatus

Substrate holding parts

Disclosed is a reversing machine that reverses a substrate upside down. The reversing machine includes: a first arm pair configured to mount a substrate thereon; a second arm pair facing the first arm pair; an opening/closing mechanism configured to open/close the second arm pair so as to grip the substrate mounted on the first arm pair; and a rotating mechanism configured to rotate the first arm pair and the second arm pair around a predetermined axis that is set inside the first arm pair and the second arm pair and extends along an extension direction of the first arm pair and the second arm pair such that the substrate is reversed upside down.

Reversing machine and substrate polishing apparatus

The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a wafer, and more particularly to a polishing apparatus and a polishing method for polishing an edge portion of a wafer with use of a polishing tape. The polishing apparatus includes a substrate holder () configured to hold and rotate a substrate (W), and a polishing unit () configured to polish an edge portion of the substrate (W) with use of a polishing tape (). The polishing unit () includes: a disk head () having a circumferential surface for supporting the polishing tape (); and a head moving device () configured to move the disk head () in a tangential direction of the substrate (W) and to bring the polishing tape () on the circumferential surface of the disk head () into contact with the edge portion of the substrate (W).

Growing community of inventors

Tokyo, Japan

Manao Hoshina