Fujitsu Corporation

Kabushiki Kaisha Toshiba

Fujitsu Semiconductor Limited

Kioxia Corporation

Toshiba Energy Systems & Solutions Corporation

Spansion Llc.

Fujitsu Optical Components Limited

Fujistu Limited

Fujitsu Interconnect Technologies Limited

Manabu Watanabe

Kenji Fukuzono

Masateru Koide

Yasushi Sugaya

Norifumi Shukunami

Takashi Kanda

Kiyokazu Moriizumi

Shunji Baba

Miki Onaka

Etsuko Hayashi

Daisuke Mizutani

Jun Hanari

Fumio Sato

Akihiro Matsuzaki

Kazuaki Satoh

Norikazu Ozaki

Tomoyuki Akahoshi

Hiroaki Kuwahara

Seigo Yamawaki

Kei Fukui

Hitoshi Katayama

Yuki Hoshino

Fujio Terai

Yuichiro Gunji

Shinya Inagaki

Tomoaki Takeyama

Kenji Ueda

Hitoshi Kanai

Makoto Suwada

Shunichi Kikuchi

Keiko Sasaki

Hisashi Takamatsu

Kaoru Moriya

Misao Umematsu

Takashi Satou

Kenichiro Yamada

Naoki Mukoyama

Koji Mametsuka

Masaharu Furuyama

Hidehiko Fujisaki

Yasushi Hasegawa

Hiroyuki Morozumi

Hiromitsu Kobayashi

Zhiyi Song

Yutaka Nakano

Mitsuharu Kurashige

Youichi Hoshikawa

Sueki Itoyama

Takami Sasahara

Ushio Jimbo

Daisuke Sonoda

A transmission device includes an encoding circuit and a modulation circuit. The encoding circuit is configured to encode first and second data stream portions of a transmission data stream in accordance with first and second encoding protocols, respectively, convert each M bit of the encoded second data stream portion into a high-resolution value of N bit, and generate a baseband data stream including the encoded first data stream portion and the converted second data stream portion. The modulation circuit is configured to perform a 2-level pulse amplitude modulation with respect to each N bit of the encoded first data stream portion in the baseband data stream and each N bit of the converted second data stream portion in the baseband data stream, to generate a transmission signal. M is an integer equal to or greater than 1 and N is an integer greater than M.

Transmission device and reception device

A communication system includes a controller, a plurality of devices, and a communication channel to which the controller and the plurality of devices are connected in a ring, and over which a communication frame including a plurality of packets is transmitted as differential signals. Each device monitors a data transmission amount per unit time, and is configured to determine whether or not the monitored data transmission amount exceeds a threshold value, and insert data into one of the packets in the communication frame when the monitored data transmission amount is equal to or less than the threshold value.

Communication system, device, and communication method

According to one embodiment, an inspection system includes an illuminator, an imager, and a processor. The illuminator irradiates light into an interior of a hole. The imager acquires a first image by imaging the interior of the hole where the light is irradiated. The processor detecting a blockage of at least a portion of the hole based on a luminance of the hole inside the first image.

Inspection system and inspection method

According to one embodiment, a communication system includes a controller and a plurality of devices serially connected to the controller by a communication path. Each device has a different identifying address from each other device. The communication path connects the controller to the plurality of devices in a loop. The communication path is configured to transmit a communication frame as a differential serial signal. The communication frame includes a plurality of packets. Each packet in the plurality of packets has a fixed data length. Each device is configured to insert data into, and extract data from, a packet in the communication frame.

Communication system, memory device, and communication method

A circuit board includes: an insulating layer; a capacitor which is provided in the insulating layer and which includes a dielectric layer, a first conductor layer provided on a first surface of the dielectric layer and including an opening part, and a second conductor layer provided on a second surface opposite to the first surface of the dielectric layer and including a recess part at a position corresponding to the opening part; and a conductor via provided in the insulating layer, penetrating the dielectric layer, the opening part and the recess part, being in contact with the recess part, and being smaller than the opening part in plan view.

Circuit board, method of manufacturing circuit board, and electronic device

A Mach-Zehnder optical modulator creates a first driving signal to be applied to a first section, and a second driving signal to be applied to a second section, and includes a generator, an optical modulator, and a setting unit. The generator generates a first dither signal and a second dither signal. The optical modulator optical modulates an optical signal into a quaternary or more value optical modulation signal by applying the first driving signal superimposed by the first dither signal, and by applying the second driving signal superposed by the second dither signal. The setting unit sets, when a length of the second section is n times as long as the first section, the first dither signal and the second dither signal to have a same phase, and sets such that an amplitude of the first dither signal is n times as large as that of the second dither signal.

Mach-zehnder optical modulator and optical modulation method

According to an embodiment, an inspection device comprises a moving body that includes; a moving main body which moves in contact with a first structure; arms attached to the moving main body; an arm driver to drive the arms; and a detector attached to the moving main body or the arms to inspect the second structure. The arms each can selectively take a pressed position and a detached position. When the moving body is moved, at least one of the arms are in the pressed position and pressed to the second structure, and the moving body is supported by the first and second structures.

Inspection device and inspection method

According to an embodiment, an inspection system comprises: a moving body including a moving main body movable along a structure; a detector attached to the moving main body; a shape information storage unit for storing shape information indicating shape and size of the structure; an inspection location information storage unit for storing information of inspection locations to be inspected; an inspection item information storage unit for storing information of inspection items to be inspected; a moving body location detecting unit for detecting moving body location information indicating location of the moving body; a moving control unit for controlling movement of the moving body; and an inspection control unit for inspection.

A board includes a plate-shaped member having a first wiring pattern, a first resin layer formed on a first surface of the plate-shaped member, the first surface having the first wiring pattern, a second resin layer stacked on the first resin layer, and a component fixed to the second resin layer in which a second wiring pattern formed on a second surface of the component is buried.

Method of manufacturing board

A package substrate includes a substrate, a first connection terminal mounted over the substrate, the first connection terminal including a first land and a second land on the substrate, a first solder resist surrounding the first land and the second land, and a first solder ball formed straddling the first land and the second land; and a second connection terminal which is mounted over the substrate and disposed adjacent to the first connection terminal, the second connection terminal including a third land and a fourth land on the substrate, a second solder resist surrounding the third land and the fourth land, and a second solder ball formed straddling the third land and the fourth land.

Package substrate and method of manufacturing package substrate

A printed wiring board assembly includes a first board including a first surface; a second board including a second surface and facing the first surface; a plurality of first electrodes formed on a bottom surface of a recess formed in one of the first and the second surfaces; a plurality of second electrodes formed on the one of the first surface and the second surface and positioned outside the recess; a plurality of first solders each coupled to a respective one of the plurality of first electrodes; and a plurality of second solders each coupled to a respective one of the plurality of second electrodes, wherein the plurality of first electrodes are formed at a larger pitch than a pitch at which the plurality of second electrodes are formed, and a size of each the plurality of first solders is larger than a size of the plurality of second solders.

Printed wiring board assembly, electrical device, and method for assembling printed wiring board assembly

A package mounting structure includes: a first substrate having wiring; a second substrate having wiring; at least one cooling unit having a first face and a second face different from the first face; at least one power supply unit that is mounted on the first substrate and is joined to the first face of the cooling unit; and at least one electronic component that is mounted on the second substrate and is joined to the second face of the cooling unit, wherein the power supply unit supplies power to the electronic component through the wiring of the first substrate, the cooling unit, and the wiring of the second substrate.

Package mounting structure

According to one embodiment, a video processing apparatus includes a video data output device which outputs a data packet signal obtained by packetizing a data enable signal and a synchronization packet signal obtained by packetizing a synchronization signal, a transmission device which transmits the data packet signal and the synchronization packet signal, the data packet signal being delayed by a first delay amount and the synchronization packet signal being delayed by a second delay amount, and a timing controller which generates the data enable signal and the synchronization signal so as to set a pulse of the synchronization signal within a blanking period of the data enable signal based on the data packet signal and the synchronization packet signal.

Video processing apparatus

A semiconductor apparatus includes: a package substrate on which a semiconductor device is disposed; a mounting board over which the package substrate is mounted; a first restraint that penetrates through the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are separated from each other; and a second restraint that is disposed between the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are closer to each other.

Semiconductor apparatus and manufacturing method thereof

Growing community of inventors

Yokohama, Japan

Manabu Watanabe