Hitachi, Ltd.

Hitachi Vlsi Engineering Corp.

Hitachi Ulsi Systems Co., Ltd.

Other

Hitachi Hokkai Semiconductor Ltd.

Hitachi Vsli Engineering Corp.

Manabu Tsunozaki

Kazuhiko Kajigaya

Masashi Horiguchi

Kazuyoshi Oshima

Jun Etoh

Hiroshi Yoshioka

Makoto Morino

Shinji Udo

Sinichi Miyatake

Akira Endo

Ryoichi Hori

Takashi Yamazaki

Kazuyuki Miyazawa

Yuji Sakai

Yasunori Yamaguchi

Tetsurou Matsumoto

Yasuhiro Kasama

Shinichi Ikenaga

Eiji Miyamoto

Mitsuhiro Takano

Jiro Sawada

Hirokazu Saito

Atsushi Kumata

Kyoko Ishii

Kiyoo Itoh

Masakazu Aoki

Tetsu Udagawa

Yoshihisa Koyama

Shin'ichi Ikenaga

Hidetomo Aoyagi

Koichi Nozaki

Akihiko Hoshida

A semiconductor memory device formed on a semiconductor chip includes first memory arrays, a plurality of second memory arrays, a first voltage generator, and first bonding pads. The semiconductor chip is divided into first, second and third rectangle regions and the third rectangle region is arranged between the first rectangle region and the second rectangle region. The first memory arrays are formed in the first rectangle region. The second memory arrays are formed in the second rectangle region. The voltage generator and first bonding pads are arranged in the third rectangle region. The first bonding pads are arranged between the first rectangle region and the voltage generator and no bonding pads are arranged between the voltage generator and the second memory arrays.

Semiconductor memory device and defect remedying method thereof

A semiconductor memory device formed on a semiconductor chip comprises a plurality of first memory arrays, a plurality of second memory arrays, a first voltage generator, and a plurality of first bonding pads. The semiconductor chip is divided into a first rectangle region, a second rectangle region, and a third rectangle region and the third rectangle region is arranged between the first rectangle region and the second rectangle region. The plurality of first memory arrays are formed in the first rectangle region. The plurality of second memory arrays are formed in the second rectangle region. The voltage generator and the plurality of first bonding pads are arranged in the third rectangle region. The plurality of first bonding pads are arranged between the first rectangle region and the voltage generator and no bonding pads are arranged between the voltage generator and the plurality of second memory arrays.

A semiconductor memory device, in which peripheral circuits are arranged in a cross area of a semiconductor chip composed of the longitudinal center portions and the transverse center portions, and in which memory arrays are arranged in the four regions which are divided by the cross area. This structure in which the peripheral circuits are arranged at the center portion of the chip permits the longest signal transition paths to be shortened to about one half of the chip size to speed up the DRAM which is intended to have a large storage capacity.

A semiconductor memory device, in which peripheral circuits are arranged in a cross area of a semiconductor chip composed of the longitudinal center portions and the transverse center portions, and in which memory arrays are arranged in the four regions which are divided by the cross area. A benefit of this structure in which the peripheral circuits are arranged at the center portion of the chip, is that the longest signal transmission paths can be shortened to about one half of the chip size to speed up the DRAM which is intended to have a large storage capacity.

Semiconductor device formed in a rectangle region on a semiconductor substrate including a voltage generating circuit

Herein disclosed is a semiconductor memory device, in which peripheral circuits are arranged in a cross area of a semiconductor chip composed of the longitudinal center portions and the transverse center portions, and in which memory arrays are arranged in the four regions which are divided by the cross area. Thanks to this structure in which the peripheral circuits are arranged at the center portion of the chip, the longest signal transmission paths can be shortened to about one half of the chip size to speed up the DRAM which is intended to have a large storage capacity.

Semiconductor memory device having zigzag bonding pad arrangement

A semiconductor integrated circuit device constituted by a plurality of sets each of which having a pair of memory mats and each memory mat having a plurality of memory cells arranged in a matrix and a sense amplifier, I/O lines for transmitting signals provided by the sense amplifiers, selecting circuitry for selecting either a condition for sending out the signals provided by the sense amplifiers on the I/O lines or a condition for not sending out the same on the I/O lines, and Y-selection lines for transmitting the selection signals. A decoder connected with selection is disposed substantially at the middle of the Y-selection lines. X- and Y-address buffers are disposed close to each other nearer to the center of the chip than X- and Y-redundant circuits. A reference voltage generating circuit is disposed nearer to the edge of the chip than an output buffer circuit. A relief selecting circuit of each memory mat is formed adjacent to a redundant line selecting circuits included in the same memory mat. At least some of wiring lines connected to each sense amplifier are formed in a wiring layer in which Y-selection lines are formed. The Y-selection lines are extended in gaps between the sense amplifiers.

Semiconductor integrated circuit device

Growing community of inventors

Ohme, Japan

Manabu Tsunozaki