Kaneka Corporation

Nichia Corporation

Manabu Tsumura

Katsuya Ouchi

Masafumi Kuramoto

Tomohide Miki

Masahito Ide

Kazunori Yokoyama

Ikuya Nii

Michinori Tsukamoto

Harumi Sakamoto

A light-shielding paste which contains a thermoplastic resin and an inorganic member as essential components or which contains a thermosetting resin and an inorganic member as essential components is provided. A curable composition and light-shielding paste comprising the composition are provided which contains, as essential components, (A) an organic compound comprising an organic main chain containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, (E) a silanol condensation catalyst, and (F) an inorganic member. The curable composition can further contain (G) silica. Also provided is a method of forming a light-shielding resin layer on a LED package having an aperture comprising a bottom and sidewalls. The curable composition is excellent in light-shielding ability.

Curable composition and method of preparing same, light-shielding paste, light-shielding resin and method of forming same, light-emitting diode package and semiconductor device

The invention aims at a curing agent, curable compositions or compositions for optical materials, capable of providing for cured artifacts having laudable heat resistance, optical transparency, and light resistance; optical materials and methods for their production; and liquid crystal displays and LED's made by using the materials. A curing agent, which comprises at least two SiH groups, is obtainable by subjecting an aliphatic organic compound (&#x3b1;1) and an acyclic and/or cyclic polyorganosiloxane (&#x3b2;1) to hydrosilylation reaction. The curing agent is also obtainable by subjecting an organic compound (&#x3b1;2) and a cyclic polyorganosiloxane (&#x3b2;2) to hydrosilylation reaction.

Curing agent, curable compositions, compositions for optical materials, optical materials, their production and liquid crystal displays and LED's made by using the materials

A curable composition comprising: component (A), which is an aliphatic organic compound including at least two carbon-carbon double bonds within one molecule, the at least two carbon-carbon double bonds having reactivity with an SiH group; component (B), which is a compound including at least two SiH groups within one molecule; and component (C), which is a hydrosilylation catalyst. The curable composition can be made into an optical material by being previously mixed so as to allow the carbon-carbon double bonds having reactivity with an SiH group to react with some or all of the SiH groups in the composition, thereby causing curing. There is provided a curable composition having a high heat-resistance, a low birefringence, a small coefficient of photoelasticity, a high optical transparency, and toughness; an optical material; a method for producing the same; and a liquid crystal display device incorporating the same.

Curable composition, composition for optical material, optical material, liquid-crystal display device, transparent conductive film, and process for producing the same

The present invention provides a curable composition providing a curing product having excellent adhesive properties and high transparency, or a curing product having high toughness and transparency. A curable composition which contains (A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, and (E) a silanol condensation catalyst. A light-emitting diode sealed with a curing product obtainable by curing said curable composition.

Growing community of inventors

Settsu, Japan

Manabu Tsumura