Panasonic Intellectual Property Management Co., Ltd.

Manabu Tasaki

Seiji Tokii

A mounting structure for an electronic component and a method for mounting the electronic component are provided with a sufficient reinforcing effect for the relatively tall electronic component raised from a substrate. The mounting structure and the mounting method can easily respond to a change of the shape of the electronic component. In a mounting structure, a substrateand an electronic componentraised on the substrateare joined with bonding metaland a reinforcing resin bodyis bonded to the substrateand the electronic component. The reinforcing resin bodyincludes a plurality of reinforcing resin layers. The reinforcing resin layersconstituting the reinforcing resin bodyare stacked in the height direction of the raised electronic componentalong a sideof the electronic componentso as to be raised from the substrate

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Osaka, Japan

Manabu Tasaki