Dow Toray Co., Ltd.

Dow Corning Toray Silicone Company Limited

Dow Corning Toray Company, Ltd.

Dow Corning Corporation

Dupont Toray Specialty Materials Kabushiki Kaisha

Manabu Sutoh

Toyohiko Fujisawa

Yoshito Ushio

Nohno Toda

Tadashi Okawa

Katsutoshi Mine

Tomohiro Iimura

Masayuki Onishi

Hiroji Enami

Koji Nakanishi

Dorab Edul Bhagwagar

Hiroshi Fukui

Ryosuke Yamazaki

Satoshi Onodera

Kazuhiro Nishijima

Kouichi Ozaki

Toru Imaizumi

Yoshinori Taniguchi

A curable organopolysiloxane composition having rheological properties suitable for precision application and fine pattern formation by a fine droplet coating apparatus such as a jet dispenser, along with a method for forming a pattern using the same, and an electronic component using the same, is provided herein. The curable organopolysiloxane composition is hydrosilylation reaction curable and can be precisely applied by a jet dispenser, etc. The composition has a viscosity at a strain speed of 1,000 (1/s) of 2.0 Pa·s or less, while the viscosity at a strain speed of 0.1 (1/s) is a value 50.0-fold or more the viscosity at a strain speed of 1,000 (1/s). The content of silicon atom-bonded aromatic functional groups in the composition is within a range of from 1.0 to 6.0 mass %.

Curable organopolysiloxane composition having excellent cold resistance, and a pattern forming method

Provided is: a layered body wherein a sheet surface has slight adhesiveness, enabling easy temporary securing of a semiconductor chip, or the like, that has been diced, onto a semiconductor substrate, and wherein permanent adhesion to an adhered object is expressed through post-curing; a layered body that includes the same; a semiconductor device that uses the same; and a method for manufacturing the semiconductor device. A silicone-based adhesive sheet is disclosed herein, wherein, prior to heating, the delamination mode of the adhesive surface from a non-adhesive substrate is interfacial delamination, and after heating of the adhesive surface in a range of between 50 and 200° C., the delamination mode of the adhesive surface from another non-adhesive substrate changes to cohesive fracturing, and exhibits permanent adhesion.

Silicone-based adhesive sheet, multilayer structure including same, and method for producing semiconductor device

An electronic component, or a precursor thereof, that comprises a curable organopolysiloxane composition or a cured product thereof is disclosed. The curable organopolysiloxane composition is generally curable through a hydrosilylation reaction and can be applied to at least one area by a microdroplet application device. The curable organopolysiloxane composition has a viscosity of no more than 2.0 Pa&#xb7;s at a strain rate of 1,000 (1/s), and a viscosity at a strain rate of 0.1 (1/s) being a value no less than 50.0 times the viscosity at a strain rate of 1,000 (1/s). In particular, the area of application generally is a substantially circular area that fits within a frame no more than 1000 &#x3bc;m in diameter, a linear area no more than 1000 &#x3bc;m in line width, or a pattern configured from a combination of these areas.

Electronic component or precursor thereof, and method for manufacturing same

Provided are a curable organopolysiloxane composition, and a pattern forming method using the curable organopolysiloxane composition. The curable organopolysiloxane composition generally has hydrosilylation reaction curing properties, may be precisely applied using, for example, a jet dispenser, and has a viscosity at a strain rate of 1,000 (1/s) of 2.0 Pa&#xb7;s or less, and a viscosity at a strain rate of 0.1 (1/s) of at least 50.0 times the viscosity at a strain rate of 1,000 (1/s). The curable organopolysiloxane composition has rheological properties suitable for precision application and micropattern formation using a microdroplet coating device such as a jet dispenser.

Curable organopolysiloxane composition, and pattern forming method

The present invention pertains to a curable organopolysiloxane composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per module, (B) an organopolysiloxane resin represented by average unit formula: (RSiO)(RSiO)(RSiO)(SiO). In the formula, R's are the same or different from each other, and represent a hydrogen atom or a monovalent hydrocarbon group not having an aliphatic unsaturated carbon bond but at least two of the R's per molecule represent hydrogen atoms, Rrepresents a monovalent hydrocarbon group not having an aliphatic unsaturated bond, and a, b, and c are numbers satisfying 0&#x3c;a&#x3c;1, 0&#x3c;b&#x3c;1, and 0&#x2264;c&#x2264;0.2, and 0&#x3c;d&#x3c;1, respectively, but are also numbers satisfying 0.6&#x2264;a/d 1.5, 1.5&#x2264;b/d&#x2264;3, and a+b+c+d=1, and (C) a catalyst for hydrosilylation reaction. This composition has excellent adhesiveness to a semiconductor element, and can form a cured product in which only a small number of bubbles are produced.

Curable organopolysiloxane composition and semiconductor device

The present invention relates to microparticles comprising: at least one type of a platinum-based catalyst; and a thermoplastic polyolefin resin with a Z-average (Mz) of a weight average molecular weight (Mw) of at least 2500 and Mz/Mw of not more than 2.0, wherein the platinum-based catalyst is dispersed in the thermoplastic polyolefin resin. The microparticles make it possible to obtain a one-component curable organopolysiloxane composition having characteristics such as excellent storage stability.

Microparticles and curable organopolysiloxane composition containing the same

A hot-melt silicone adhesive comprising: (A) an organopolysiloxane resin with a softening point in the range of 40 to 250&#xb0; C.; (B) an organopolysiloxane that at 25&#xb0; C. is liquid or in the state of a crude rubber, which contains in one molecule at least two alkenyl groups; (C) a composition selected from a mixture of (i) an organopolysiloxane that contains silicon-bonded hydrogen atoms and (ii) an organic silicon compound that contains a silicon-bonded alkoxy group; or (iii) an organopolysiloxane that contains silicon-bonded hydrogen atoms and a silicon-bonded alkoxy group; (D) a hydrosilylation catalyst; and (E) a hydrosilylation-reaction inhibitor, demonstrates good gap-filling ability during thermo-compressive bonding to adherends with high surface roughness, even at low pressures, and that provides strong adhesion to the adherend after cross-linking.

Hot-melt silicone adhesive

A silicone-based adhesive sheet has either a layer of clay-like curable silicone composition on one side and a layer of slower curing clay-like curable silicone composition than the first composition layer on the other side, or a cured silicone layer on one side and a layer of clay-like curable silicone composition on the other side. The silicone-based adhesive sheet may be used in a method for bonding semiconductor chip and a chip attachment component. A semiconductor device may be prepared by the method.

Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device

A heat-conductive silicone composition comprising at least (A) an organopolysiloxane, (B) a heat-conductive filler, and (C) a specific organosiloxane. The silicone composition is excellent in handleability, even when it contains a large amount of a heat-conductive filler for the purpose of attaining higher heat conductivity.

Heat-conductive silicone composition

This invention provides foam-covered rolls comprising silicone foam layer over a metal core and a fluororesin film laminated over the foam layer. The cured foam layer is obtained by using as the blowing agent the hydrogen gas generated by the reaction of an organohydrogenpolysiloxane with a compound containing at least one hydroxyl group per molecule. The resultant rolls are very durable, highly toner-releasing and are free of creases on the roll surface. Using the fabrication method that constitutes one embodiment of the present invention, foam covered rolls can be produced very efficiently.

Growing community of inventors

Ichihara, Japan

Manabu Sutoh