Hitachi, Ltd.

Hitachi Microcomputer Engineering, Ltd.

Manabu Shibata

Akira Uragami

Yoji Nishio

Fumio Murabayashi

Shoichi Kotoku

Fumiaki Matsuzaki

Yoshitatsu Kojima

Yukio Suzuki

Shinji Kadono

A semiconductor integrated circuit device with a built-in memory circuit group is disclosed, wherein wiring is started from a data terminal position near a data exchange portion of a memory circuit group to reduce the length of a wiring. Accordingly, an operation speed can be improved by the reduction of wiring capacitance and a ratio of unwired wirings can be reduced by reduction of an occupying ratio of wiring channels.

Semiconductor integrated circuit device with built-in memory circuit

In a semiconductor integrated circuit device adopting a master slice system, a plurality of lattice points of an X-Y lattice-shaped channel region set by an automatic arrangement and routing system correspond to one input/output terminal of a prescribed basic cell (or logic circuit), thereby a plurality of signal wirings can be connected to the one input/output terminal.

Semiconductor integrated circuit device and manufacturing method of the

A semiconductor integrated circuit is so designed that it is possible to form any one of the three different kinds of circuit configuration, that is, an inverter circuit, a Schmitt circuit and a common-mode circuit, as desired, by employing circuit elements prepared in advance and by changing wiring. Also disclosed is a semiconductor integrated circuit having these circuit configurations. The output stage of any one of the three kinds of circuit is constituted by a bipolar transistor, and the other portions are constituted by MOS field-effect transistors.

Semiconductor integrated circuit

A semiconductor integrated circuit device, in which a system including a plurality of modules (functional blocks) such as a microprocessor unit and a memory unit is integrated on the main surface of a single semiconductor substrate, and each module of the system is connected through its corresponding interface circuits to the external terminals. The external terminals and the interface circuits are provided on the main surface of said semiconductor substrate, and are connected through an internal bus line commonly used between said modules. Also, and commonly use or internal bus line is connected directly to said external terminals to permit connection to a common external bus line.

Semiconductor integrated circuit device with bus lines

An integrated circuit having the circuit construction wherein a plurality of each of input and output circuits are formed in such a manner as to form pairs and to correspond to a plurality of external connection pads, respectively, and are used selectively to replace the function of an internal circuit. A signal transmission path of an input circuit formed so as to correspond to an external connection pad to which an external input signal is applied at an input portion and at least part of a signal transmission path of an output circuit formed so as to correspond to the external connection pad are connected in series between the external connection pad and an input terminal of the internal circuit in order to use the signal transmission function of the output circuit as the function of the internal circuit. At an output portion, on the other hand, at least part of the signal transmission path of an input circuit formed so as to correspond to an external connection pad for delivering an output signal to the outside and a signal transmission path of an output circuit formed so as to correspond to the external connection pad are connected in series between the output terminal of the internal circuit and the external connection pad in order to use the signal transmission function of the input circuit as the function of the internal circuit.

Growing community of inventors

Takasaki, Japan

Manabu Shibata