Taiyo Yuden Co., Ltd.

Manabu Ozawa

Norihiro Arai

Takeshi Nosaki

Jyouji Ariga

Hiroyuki Moteki

Masumi Ishii

Kazuya Maekawa

A method of manufacturing a multilayer ceramic capacitor includes: forming a multilayer body by alternately stacking a green sheet and a conductive paste for forming an internal electrode layer, the green sheet being mainly composed of a ceramic material having a perovskite structure that includes Ca and Zr and is expressed by a general expression ABOand containing an alkali metal, the conductive paste being mainly composed of Cu, containing a ceramic co-material and no alkali metal; and baking the multilayer body to obtain a ceramic multilayer body.

Method of manufacturing multilayer ceramic capacitor and multilayer ceramic capacitor

A ceramic electronic device includes: a multilayer chip having a first and a second internal electrode layers; a first and a second external electrodes covering a first a second regions of a surface of the multilayer chip, wherein: a mark is shifted on a side of one of two end faces on an upper face; the first internal electrode layer is exposed to the first region and connected to the first external electrode; the second internal electrode layer is exposed to the second region and connected to the second external electrode; the second internal electrode is shifted further on a side of the lower face than on a side of the upper face; the second internal electrode layer is shifted further on a side of the lower face than the upper face; the second region is a region of a half of the surface on the lower face side.

Multilayer ceramic capacitor, package of multilayer ceramic capacitor and component mounting circuit substrate

A multilayer ceramic capacitor includes: a ceramic multilayer structure designated to have ceramic dielectric layers and internal electrode layers alternately stacked, the internal electrode layers being mainly composed of a transition metal other than an iron group, end edges of the internal electrode layers being alternately exposed to a first end face and a second end face; and a pair of external electrodes provided on the first end face and the second end face, wherein: the external electrodes have a base conductive layer and a first plated layer; the base conductive layer directly contacts the ceramic multilayer structure; a main component of the base conductive layer is a noble metal or a transition metal other than an iron group; and a total concentration of Si and B in a second-phase not contacting the ceramic multilayer structure is 0.3 wt % or less, in the base conductive layer.

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Takasaki, Japan

Manabu Ozawa