Canon Kabushiki Kaisha

Manabu Otsuka

Tetsushi Ishikawa

Yasuaki Tominaga

Tamaki Sato

Ryotaro Murakami

Nobuhiko Sato

Tomoyuki Hiroki

Akira Yamamoto

Kazuhiro Yamada

Seiichiro Karita

Keiji Watanabe

Akio Saito

Shingo Okushima

Shuzo Iwanaga

Keiji Matsumoto

Kazuhiro Asai

Noriyasu Nagai

Takatsuna Aoki

Jun Yamamuro

Toshiaki Yoshikawa

Takuro Yamazaki

Masahiro Fushimi

Satoru Shiobara

Masaya Uyama

Zentaro Tamenaga

Seiji Mashimo

Masahisa Watanabe

Tatsurou Mori

Kaoru Okamoto

Yuzo Tokunaga

Kunihito Uohashi

Junya Tamaki

Toshihide Kimura

Naoto Fukuda

Kazuhisa Okano

Shigeru Kido

Tatsuya Masukawa

Provided is a joined substrate in which a first substrate, a second substrate, and a third substrate are joined in this order with an adhesive agent therebetween, the joined substrate comprising: one or more grooves formed in a groove region of a surface of the first substrate not facing the second substrate; and a bulging portion formed in a back region of a surface of the second substrate not facing the first substrate, the bulging portion bulging in a thickness direction, the back region corresponding to the groove region in a plane direction.

Joined substrate, droplet ejection head, and method of manufacturing joined substrate

An object is to provide a wafer, and a liquid ejection chip which are capable of preventing a decrease in yield. To that end, an adhesive agent accumulation portion is provided at which an adhesive agent coming out of a gap between a first channel substrate and a second channel substrate accumulates and stays away from a bottom of a groove.

Wafer, and liquid ejection chip

A flow path member includes a first substrate, a second substrate, bonding adhesive, and recessed portions. The first substrate has a first surface formed with an opening of a flow path. The second substrate has a second surface facing the first surface. The bonding adhesive bonds the first and second surfaces together. The recessed portions are formed in at least one of the first surface of the first substrate and the second surface of the second substrate. Each recessed portion is a hole configured to take up excess bonding adhesive and, as a non-through hole, does not extend through the entire thickness of a substrate. Each of the recessed portions extends into the first substrate or the second substrate as a rectangular column or an elliptical column and, when a shape of each recessed portion is viewed from the direction orthogonal to the first surface, the shape is approximately isotropic.

Flow path member and liquid discharge head

A liquid ejection head includes a first substrate having a first surface and a second surface opposite the first surface, the first surface having a structure, a second substrate having a second surface facing the first surface of the first substrate, and a third substrate having a first surface facing the second surface of the first substrate. The first, second, and third substrates are joined together by an adhesive. The second surface of the first substrate has an opening located in a region on a rear side of the structure and having corners each having a curvature radius R. The second surface of the second substrate has an opening in a region facing the structure and having corners each having a curvature radius R. The curvature radii Rand Rsatisfy R<R

Liquid ejection head

A flow path member includes a first substrate having a first surface that has a flow path, and includes a second substrate having a second surface opposing the first surface. In the flow path member in which the first and second substrates are joined together with adhesive provided between the first and second surfaces, a groove is formed in at least one of the first and second surfaces. When the first substrate is viewed from a direction orthogonal to the first surface, the flow path is disposed on a groove inner side. The groove has a first portion having a first depth and a second portion having a second depth shallower than the first depth. The second portion is that portion of the groove existing inside a region surrounded by an outer edge of the first surface and extension lines of two sides that form a flow path corner.

The present invention provides a liquid replenishment container that replenishes a liquid tank including a liquid supply portion protruding in a first direction with a liquid. The container includes: a container main body capable of storing a liquid; a liquid replenishment nozzle including a first side wall and mountable on the liquid supply portion, the first side wall defining an internal space communicating with the container main body; and a valve body provided in the internal space and causing the liquid supply portion to communicate with the internal space when the liquid replenishment nozzle is mounted. The internal space has a first liquid replenishment flow path formed between the valve body and the first side wall and being constant in cross-section in the first direction, and a second liquid replenishment flow path formed inside the first liquid replenishment flow path and being continuous in the first direction.

Liquid replenishment container

A method for manufacturing a substrate having a resin layer, including, in this order: (1) providing the resin layer formed on a support, the support being larger than the outer size of the substrate; (2) bonding the resin layer supported on the support to the substrate; (3) removing an end portion of the resin layer disposed on the end portion of the support and in no contact with the substrate, by a solvent capable of dissolving the resin layer; and (4) peeling off the support from the resin layer.

Method for manufacturing substrate and liquid ejection head substrate

A method of producing a structure having a through substrate includes: forming a protective member having an atmosphere communication layer having a structure communicating with the through hole by permeation from at least a part of a layer side surface part to the through hole, and a gas-impermeable protective layer in this order, on the second surface of the through substrate; forming a dry film resist layer having a resin layer and a support member in this order, on the first surface of the through substrate; and peeling the support member from the resin layer, the support member being peeled from the resin layer in a state that the through hole of the through substrate is communicated with atmosphere by at least the atmosphere communication layer, in the peeling.

Method of producing structure, protective substrate, and method of producing protective substrate

Provided is a method of manufacturing a liquid ejection head, which is capable of patterning a dry film while suppressing deformation of the dry film caused by a pressure. The method of manufacturing a liquid ejection head includes: preparing a substrate including an ejection orifice member on a first surface; forming, on an ejection orifice surface of the ejection orifice member, a protection film having communicating holes for allowing ejection orifices to communicate to outside; closing an opening of a supply port on a second surface on a side opposite to the first surface of the substrate with a dry film; and patterning the dry film by irradiating the dry film with light under a state in which the protection film is formed on the ejection orifice surface.

Method of manufacturing a liquid ejection head

A method of manufacturing a structure including a substrate and a photosensitive resin layer provided on the substrate includes irradiating a region of the photosensitive resin layer with light in a state where a layer is provided on a surface of the substrate, the region being located above a space surrounded by the substrate and the photosensitive resin layer, and the surface facing the space, and removing a portion of the photosensitive resin layer located above the space to form a hole, wherein the provided layer has a reflectance of 40% or less with respect to the light.

Method of manufacturing structure and method of manufacturing liquid ejection head

A method for manufacturing a structure includes, preparing a substrate with a recessed portion provided therein, attaching a film including a photosensitive resin layer containing photosensitive resin therein and a support layer to the substrate to cover the recessed portion with the photosensitive resin layer, irradiating the photosensitive resin layer covering the recessed portion with light via the support layer to form a latent image pattern on the photosensitive resin layer, heating the photosensitive resin layer at 30 degrees Celsius or higher and X degrees Celsius or lower for one minute or longer, wherein a softening point of the photosensitive resin is X degrees Celsius (X&#x2265;30), separating the support layer from the photosensitive resin layer, heating the photosensitive resin layer at X+10 degrees Celsius or higher, and carrying out development on the photosensitive resin layer.

Method for manufacturing structure

A liquid ejection head capable of suppressing a change in pressure of a pressure chamber, a liquid ejection apparatus, and a manufacturing method are provided. For that reason, a lid member is formed on a wafer-shaped element board and the element board is cut into chips to manufacture a print element board.

Liquid ejection head, liquid ejection apparatus, and manufacturing method

A method for manufacturing a light-emitting device includes a step of forming an etching resistant protection layer on a substrate provided with an organic planarizing layer, a step of forming a plurality of electrodes on the etching resistant protection layer, a step of forming an organic compound layer on the substrate provided with the plurality of electrodes, a step of forming a resist layer on the organic compound layer formed on parts of electrodes among the plurality of electrodes using a photolithographic method, and a step of removing the organic compound layer in a region not covered with the resist layer by dry etching, wherein an entire surface of the organic planarizing layer on the substrate on which steps up to the step of forming the plurality of electrodes have been performed is covered with at least one of the etching resistant protection layer and the electrode.

Method for manufacturing organic light-emitting device

Provided is a display device including: a substrate; and multiple pixels provided on the substrate, the pixels each having an organic EL element obtained by laminating a lower electrode provided on the substrate, an organic compound layer, and an upper electrode in the stated order, and the lower electrode including an electrode independently placed for each of the pixels, in which: the lower electrode is formed of a first lower electrode layer provided on the substrate and a second lower electrode layer provided on the first lower electrode layer; the organic compound layer and the upper electrode cover the first lower electrode layer and the second lower electrode layer; and charge injection property from the second lower electrode layer into the organic compound layer is larger than charge injection property from an end portion of the first lower electrode layer into the organic compound layer.

Display device

The method of manufacturing an organic electroluminescence display device includes the steps of: forming an organic compound layer on a first electrode; forming a sacrificial layer soluble in a polar solvent on the organic compound layer; forming an intermediate layer formed of a water-soluble polymer on the sacrificial layer; patterning the sacrificial layer, the intermediate layer, and the organic compound layer; removing the intermediate layer and a layer formed thereon; and removing the sacrificial layer, in which the step of removing the sacrificial layer includes a step of performing a contacting step of bringing the sacrificial layer and the polar solvent into contact with each other a plurality of times.

Growing community of inventors

Kawasaki, Japan

Manabu Otsuka