Semitec Corporation

Hirosaki University

National Institute of Technology

Manabu Orito

Tadashi Matsudate

Yutaro Tabata

Masaya Higashi

Takashi Nonaka

Takuma Kogawa

Shigenao Maruyama

Yuya Iseki

Yasushi Hosokawa

Takahiro Okabe

Toshinori Nakajima

A temperature measurement device () comprises: a thermosensitive unit () that senses temperature; a thin film thermosensitive element () for measurement capable of measuring the temperature by bringing the thermosensitive unit () into contact with a subject; a thin film thermosensitive element () for protective heating disposed to enable heat exchange with the thin film thermosensitive element () via an insulating layer (S), and controlled so that the temperature thereof is equal to the temperature of the thin film thermosensitive element (); a temperature control element () capable of causing the thin film thermosensitive element () to be in a temperature state in which the temperature thereof is a certain degree lower than the temperature of the subject; and a control processing unit () controlling the thin film thermosensitive element (), the thin film thermosensitive element (), and the temperature control element ().

Temperature measurement device, temperature measurement method, and temperature attenuation measurement method

Provided is a pressure sensor that is compact, ensures insulation, and is highly reliable. A pressure sensor () comprises: a sensor body (); a pressure sensor element () provided on one surface side of the sensor body (); a through hole () which is formed from the one surface side of the sensor body () toward another surface side of the sensor body, and through which a lead wire () electrically connected to the pressure sensor element () is passed; and an insulation layer () formed in the inner wall of the through hole (). Passed through the through hole () is a conducting body core part (), which is a part of the lead wire () from which an insulation coating has been removed.

Pressure sensor

Provided are: a contact force sensor which has high accuracy and sensitivity and is capable of ensuring strength; and a device provided with the contact force sensor. The present invention comprises: a sensor body () manufactured by processing a semiconductor material, wherein the sensor body () is provided with: a ring-shaped portion (); a central portion () formed substantially in the center of the ring-shaped portion (); a spoke portion () connected to the ring-shaped portion () from the central portion () toward the outside; and stress-electricity conversion elements () which are disposed at positions facing each other on the front side and the back side of the spoke portion (), and convert the displacement of the spoke portion () into an electric signal.

Contact force sensor and device provided with contact force sensor

Growing community of inventors

Tokyo, Japan

Manabu Orito