Renesas Electronics Corporation

Nec Electronics Corporation

Manabu Okamoto

Shintaro Yamamichi

Tomohiro Nishiyama

Hirokazu Honda

Hiroki Shibuya

Kiyoshi Mori

Takuo Funaya

Norikazu Motohashi

An electronic apparatus is provided which, even when the electronic apparatus configuring a node is implanted in the body of an object animal, makes the object animal hard to feel stress and can acquire effective data about the natural behavior and state of the object animal. As shown in FIG., a module unit and a battery are arranged separated from each other. That is, an electronic apparatus according to the present embodiment 1 adopts a case including a first capacity part and a second capacity part both arranged separated from each other to thereby accommodate the module unit in an internal space of the first capacity part and accommodate the battery in an internal space of the second capacity part.

Electronic apparatus and manufacturing method therefor

To achieve the reduction in size of an electronic device. The electronic device serving as an element of a wireless communication system includes a module unit, a battery that supplies electric power to the module unit, and a coupling part that electrically couples the module unit and the battery. The module unit includes a sensor that detects a physical quantity, and a wireless communication unit configured to transmit the data based on an output signal from the sensor.

Electronic device

This invention prevents a substrate of a semiconductor chip that has through-silicon vias collectively arranged in a specific area thereof from becoming cracked. When a direction in parallel with a long side of a first semiconductor chip is defined as a row direction and a direction perpendicular to the long side of the first semiconductor chip is defined as a column direction, each one of the first through-silicon vias is arranged on any one of grid points arranged in m rows and n columns (m&#x3e;n). In addition, as viewed in a cross section taken along a short side of the first semiconductor chip, the center of a through-silicon via area, which is defined by coupling the outermost grid points arranged in m rows and n columns, is off center of the short side of the first semiconductor chip in a first direction.

Semiconductor device

A charger of the present invention includes a charging transistor and a charging integrated circuit. The charging transistor is series-connected with a secondary battery to supply a charging current to the secondary battery. The charging integrated circuit is incorporated into a package having a higher heat releasability than that of the charging transistor. The charging integrated circuit controls the charging transistor and besides, supplies a charging current to the secondary battery. For this purpose, the charging integrated circuit includes a current source supplying this charging current. The charging current from the current source is supplied to the secondary battery together with the charging current from the charging transistor to charge the secondary battery.

Charger and integrated circuit having first and second charging currents

A charging control circuit according to an embodiment of the present invention includes a detecting circuit and a charging transistor control unit for controlling a charging transistor supplying a first current, a current source for supplying a second current, and a current source control unit for controlling the current source. For example, if a secondary battery is charged using an adaptor endowed with a current-limiting function, during a constant-current charging period in which a charging voltage of the secondary battery reaches 3.2 V to 4.2 V, the secondary battery is charged with the first current I, and during a constant-voltage charging period after the voltage reaches 4.2 V, the secondary battery is charged with the first charging current and the second charging current.

Growing community of inventors

Kanagawa, Japan

Manabu Okamoto