Canon Kabushiki Kaisha

Screen Semiconductor Solutions Co., Ltd.

Manabu Nakanishi

Kazuhiro Saito

Hirofumi Totsuka

Nobuyoshi Takehara

Seiji Kurokami

Takashi Matsushita

Katsumi Hashimoto

Each of substrates which are sequentially loaded into an apparatus is transferred to one of empty (available) cooling units, and the cooling unit is reserved as a unit to be used for performing a cooling treatment after a post-exposure bake process for the substrate and the reservation information is stored. After one of the cooling units is reserved in advance before the post-exposure bake process, the substrate is transferred from the cooling unit to one of heating units without being subjected to a cooling treatment and is subjected to a post-exposure bake process therein. After the post-exposure bake process, the substrate is transferred from the heating unit to the reserved cooling unit which is reserved in advance and subjected to a cooling treatment therein.

Substrate processing apparatus and substrate processing method for performing heat treatment on substrate

In order to suppress a variation of a signal held by each signal holding unit, a solid-state imaging apparatus of the present invention is characterized in that, when a clamp operation of a pixel output signal is performed in the signal holding unit, a time changing rate of an amplitude of a drive pulse supplied to the selecting unit for turning from a non-conducting state to a conducting state is not larger than a time changing rate of the amplitude of the drive pulse supplied to the selecting unit for turning from the conducting state to the non-conducting state.

Solid-state imaging apparatus

A photoelectric conversion apparatus which includes a plurality of sensor chips wherein each sensor chip is arranged into a plurality of unit blocks each having plural photoreceiving elements. A common signal reading line is provided, through which signals are read out from the plurality of photoreceiving elements of the plurality of sensor chips. After sequentially reading out signals from first photoreceiving elements included in each of the plurality of unit blocks in a first sensor chip, and before sequentially reading out signals from photoreceiving elements other than the first photoreceiving elements included in unit blocks of the first sensor chip, signals are read out to the common signal reading line from the photoreceiving elements included in the unit blocks in sensor chips other than the first sensor chip. Thus, a multi-chip type image sensor having a smaller chip size with desired performance is provided.

Photoelectric conversion apparatus and driving method thereof

Control means is provided, in which the whole of the phase difference of a power waveform of each phase is matched to a value dividing a cycle of the power waveform into n-equal portions, and at the same time, the whole of the power value of each phase is controlled to be identical, so that the power conversion unit having a n-alternating current output (n is an integer numeral serving as n&#x2267;2) connected to the direct current power source and smoothing means provided between the direct current power source and the power conversion unit are made small in capacity.

Growing community of inventors

Ebina, Japan

Manabu Nakanishi