Seiko Epson Corporation

Manabu Nagawatari

Yoshihiro Takemura

Minoru Usui

Noriaki Okazawa

Kazunaga Suzuki

Kazumi Kamoi

Hiromi Mimura

A liquid ejecting head including a pressure generating chamber which is in communicating with a nozzle orifice, a piezoelectric element having an active portion which is supplied a drive signal and an inactive portion which is not supplied the drive signal, and a film wiring substrate including an active wiring layer which is electrically connected to an individual connecting terminal of the active portion and an inactive wiring layer which is electrically connected to an individual connecting terminal of the inactive portion.

Liquid ejecting head and liquid ejecting apparatus

A liquid ejecting head that includes a plurality of pressure generating chambers, a plurality of piezoelectric elements, and a film wiring substrate. The piezoelectric elements each have a lower electrode, a piezoelectric layer and an upper electrode. Each of the piezoelectric elements is provided in an area opposite to the associated pressure generating chamber. The wiring substrate includes wiring layers, each of which is electrically connected to the associated upper electrode so as to supply electricity to the piezoelectric element. The piezoelectric elements include active piezoelectric elements and inactive piezoelectric elements. Each of the active wiring layers is electrically connected to the associated active piezoelectric element. Each of the inactive wiring layers is electrically connected to the associated inactive piezoelectric element.

An ink jet recording head having high printing quality which is achieved independently of ambient temperature changes. An overhang portion (22) is formed on a surface of a frame (20) in such a manner that the overhang portion extends close to an island portion (9) of a resilient plate. A front end (17) of a fixed board (14) is fixed to the overhang portion (22) so that a gap (23) is interposed between a lateral side of the fixed board (14) and the frame (20). The piezoelectric vibration elements (8) are secured to the opposite end of the fixed board and abut against each of the island portions. The thickness (L0) of the overhang portion (22) affects that thermal expansion differential derived from a difference in the materials of the frame (20) and the piezoelectric vibration element. Since the thickness is minimized, the thermal expansion differential between the frame (20) and the piezoelectric vibration elements (8) is correspondingly minimized.

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Matsumoto, Japan

Manabu Nagawatari