Senju Metal Industry Co., Ltd.

Azbil Corporation

Yamatake Corporation

Nitta Corporation

Manabu Muraoka

Kaichi Tsuruta

Junichi Matsuda

Masanori Anzai

Takeo Saitoh

Takashi Hagiwara

Hiroyuki Yamasaki

Hiroki Oshima

Naoto Kameda

Kota Kikuchi

Masaki Seo

Takashi Obayashi

Shigeyuki Sekine

Minoru Seto

Shinichiro Kawahara

Koji Yamashita

Junzou Kimura

Satoshi Ishitani

Masahiko Matsushita

Motoi Kanzaki

Toshinori Fujita

Katsusuke Shimada

Nobuyuki Fukuura

Takeo Saito

A solder-ball-supplying method, a solder-ball-supplying device and a solder-bump-forming method, which are flux-less and capable of being also applied to electrodes having a fine pitch. A substrate on which a resist with openings is positioned on electrode(s), which has a diameter of 10 through 30 &#x3bc;m, of the substrate is prepared. Next, plural solder balls SBL each having a grain diameter of 1 through 10 &#x3bc;m are shaken down to the opening(s) of the resist from a hopper and filled therein. Next, by sliding and moving a squeegee on an upper surface of the resist along X-Y direction, the solder balls SBL shaken down to the resist other than the openings are scrapped and removed and the solder balls SBL in the openings and around them are pushed into the openings by the squeegee.

Solder ball supplying method, solder ball supplying device, and solder bump forming method

A flux applying device for applying flux to a surface of solder, wherein the flux applying device includes: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.

Flux applying device

In the flux applying device, a control portion controls conveying rollers or the like so that thickness of flux applied to solder is controlled. The winding roller rotates so that the solder is conveyed at the conveying speed. The drawing-out roller applies any load (back tension) to the solder backward along the conveying direction of the solder when drawing out the solder. The solder is conveyed at the predetermined speed and dipped into the flux tank containing flux. The solder is pulled up from the flux tank at the conveying speed vertically. By pulling up the solder from the flux tank at the constant conveying speed vertically, the interfacial tension acts on the solderand the flux, so that the flux having a uniform thickness according to the conveying speed remains on the surface and back surface of the solder.

Liquid coating device

Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheetA includes a base material, an adhesive layerformed on the surface of the base material, a solder powder-containing adhesive layerformed on the surface of the adhesive layer, and a solder powder layerformed on the surface of the solder powder-containing adhesive layer. In the solder powder layer, particles of solder powderare arranged in a one-layer sheet form. In the solder powder-containing adhesive layer, solder powderand an adhesive componentare mixed so as to have such a thickness that two or more layers of the solder powderare stacked.

Solder transfer sheet, solder bump, and solder precoating method using solder transfer sheet

A body section having a main channel through which a fluid to be measured flows and sections for shunting the fluid to be measured from the main channel, and a fluid measuring section provided removably from the body section and measuring the flow rate of the fluid to be measured flowing through the main channel based on the detection results of the fluid to be measured introduced from the shunting section. The fluid measuring section is fixed to the body section and shunt ratio data, i.e. the adjustment data about measurement processing inherent to the constitution of the body section, is registered in the fluid measuring section before adjusting measurement processing.

Flow meter adjusting method, flow rate measuring device and adjustment data controlling system

A thermal flow meter has a sensor chip, a heater, first and second flow rate calculators, and an output controller. The heater increases the ambient temperature in the vicinity of a pair of temperature-sensing elements on the sensor chip by a particular temperature above a temperature of a fluid flowing along the sensor chip. The first flow rate calculator calculates a flow rate of the fluid from a temperature difference detected by the pair of temperature-sensing elements. The second flow rate calculator calculates a flow rate of the fluid from a driving energy of the heater. The output controller outputs the flow rate calculated by the second flow rate calculator, instead of the flow rate calculated by the first flow rate calculator, when the flow rate calculated by the first flow rate calculator exceeds a flow rate threshold value that is set in advance.

Thermal flow meter measuring flow rate based on temperature difference measurement and driving energy of the heater

A flow meter includes: a body portion comprising a main flow path wherein flows a fluid to be measured, a first branch flow portion wherein the fluid to be measured branches and flows from the main flow path, a second branch flow portion wherein the fluid to be measured, which branches and flows from the first branch flow portion, flows into the main flow path, and narrow portions for restricting the flow of the fluid to be measured, provided in a primary flow path between the branch flow portions, a branched flow path structuring portion through which flows the fluid to be measured, connected to the branch flow portions; and a fluid measuring portion provided with a sensor disposed facing a flow path that is provided in the branched flow path structuring portion, wherein the sensor measures the fluid based on the detection results of the fluid introduced from the branch flow portions.

Flow meter

A flowmeter includes a flow sensor capable of measuring instantaneous flow rates of forward and backward flows of a fluid, smoothing means for smoothing the measured instantaneous flow rate, an integrating counter for integrating the smoothed flow rate and outputting an integrated flow rate, determination means for monitoring the smoothed flow rate to determine whether or not the fluid is fluctuating, an auxiliary counter for integrating, in place of the integrating counter, the smoothed flow rate while the fluid is judged to be fluctuating by the determination means and when fluctuation of the fluid is detected, and control means for adding an integrated flow rate held by the auxiliary counter to that held by the integrating counter when it is judged by the determination means that the fluid has begun to flow regularly, and causing the integrating counter to restart integrating the smoothed flow rate.

Flowmeter

Growing community of inventors

Tokyo, Japan

Manabu Muraoka