Other

Meiko Electronics Co., Ltd.

Sulfur Chemical Laboratory Inc.

Mori, Kunio

Manabu Miyawaki

Kunio Mori

Shigeru Michiwaki

Katsuhito Mori

Takahiro Kudo

Yusuke Matsuno

Kouichi Kamiyama

Hitomi Chiba

Yasuyuki Masuda

Shuukichi Takii

Masanori Yanai

A surface treatment agent including a compound (&#x3b1;) is provided. The compound (&#x3b1;) has one or more M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; wherein said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.

Surface treatment agent and novel compound

A surface treatment technique having excellent adhering function, excellent reacting function and rich diversity is provided. The surface treatment includes applying a solution containing compound (&#x3b1;) to a substrate and thus providing compound (&#x3b1;) thereon, wherein: the compound (&#x3b1;) is at least one of Formula [IV] and Formula [V]: 

Surface treatment method, surface treatment agent, and novel compound

The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (&#x3b1;) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (&#x3b1;) by a wet-mode plating technique, wherein the compound (&#x3b1;) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.

Process for forming metal film, and product equipped with metal film

Growing community of inventors

Ayase, Japan

Manabu Miyawaki