Kabushiki Kaisha Toshiba

Toshiba Memory Corporation

Kioxia Corporation

Manabu Matsumoto

Naoki Kimura

Toyota Morimoto

Hayato Masubuchi

Isao Ozawa

Katsuya Murakami

Akira Tanimoto

Yasumasa Toyoda

Hiroki Nakata

Koichi Nagai

Yuji Karakane

Tadashi Shimazaki

Katsumi Izawa

A memory system includes a nonvolatile memory, a controller configured to control the nonvolatile memory, a connector that is capable of electrically connecting the controller and a host, a first rigid substrate on which the nonvolatile memory and the controller are mounted, a second rigid substrate on which the connector is mounted, and a flexible substrate that is flexible and electrically connects the first rigid substrate and the second rigid substrate, wherein a thickness of the first rigid substrate is less than a thickness of the second rigid substrate.

Memory system

According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.

Semiconductor memory system

A semiconductor device includes a first substrate on which an interface unit connectable to a host device is provided, a first memory module on the first substrate, and a first controller on the first substrate. The first controller includes a control unit that controls the first memory module, and a switching unit that switches an operation mode in response to a command from the host device. A first connecting portion is provided on the first substrate and is electrically connected to the first memory module and the first controller. The first controller can directly access a second memory module through the first connecting portion. Thus, for example the first controller can read data stored in the second memory module depending on operation mode.

Semiconductor device

A semiconductor device package includes a substrate including, on an edge thereof, a connector that is connectable to a host, a nonvolatile semiconductor memory device disposed on a surface of the substrate, a memory controller disposed on the surface of the substrate, an oscillator disposed on the surface of the substrate and electrically connected to the memory controller, and a seal member sealing the nonvolatile semiconductor memory device, the memory controller, and the oscillator on the surface of the substrate.

Semiconductor device package having an oscillator and an apparatus having the same

A semiconductor package includes a board, a plurality of semiconductor memory chips, a controller chip, and a sealing resin portion. The plurality of semiconductor memory chips are stacked in a thickness direction of the board. The controller chip is disposed between the board and the plurality of semiconductor memory chips or on a side of the plurality of semiconductor chips opposite to the board. The sealing resin portion seals the plurality of semiconductor memory chips and the controller chip. The plurality of semiconductor memory chips include at least one through via that penetrates one or more semiconductor memory chips of the plurality of semiconductor memory chips in the thickness direction of the board to be connected to the controller chip.

Semiconductor package

A semiconductor device includes a printed circuit board having a first surface and a second surface on a side opposite to the first surface. First pads are on the first surface of the printed circuit board. An interface part is mounted on the printed circuit board via the first pads and is configured to transfer a signal between the interface part and a host device. Second pads are also on the first surface and insulated from the interface part. A semiconductor memory and a controller are mounted on the first surface. First solder balls electrically connect the first pads and the controller. Second solder balls electrical connect the second pads and the controller. A plurality of third pads are disposed on the second surface and electrically connected to the second pads allowing direct connections to the controller and memory via the second pads.

According to one embodiment, a semiconductor device includes, for example, a circuit board, a plurality of elements, a plurality of controllers, and a first signal line. The elements are provided on the circuit board. The elements each include a memory. The controllers each are configured to control read of data from the memory. The controllers each are configured to control write of data into the memory. A control signal is transmitted through the first signal line. The first signal line is used in common by the controllers.

Semiconductor device and electronic device

A storage device includes a base board and a memory chip package. The base board includes, on a first edge, a connector that is connectable to a host device and through which the storage device communicates with the host device, on a second edge that is opposite to the first edge, a first engaging portion by which the base board is fixable to the host device, and in an intermediate portion that is located between the first edge and the second edge, a second engaging portion by which the base board is fixable to the host device when an end portion of the base board between the second edge and the intermediate portion is removed. The memory chip package is disposed on a surface of the base board and between the first edge and the intermediate portion.

Growing community of inventors

Kanagawa, Japan

Manabu Matsumoto