Seiko Epson Corporation

Manabu Kondo

Yasuhiko Yoshihisa

Norihito Matsukawa

Yohei Nunokawa

Kenji Hayashi

Kensaku Isohata

Takayuki Tanaka

Hitoshi Igarashi

Hiroshi Ito

Tetsuya Otsuki

Makoto Sato

Matsutaro Naito

Kazuhiko Shimodaira

Shiro Murakami

Manabu Shiraki

Mitsuhiro Wada

Tomohiro Arai

Muneyoshi Hama

An oscillator includes: an outer package having an accommodation space; an inner package accommodated in the accommodation space and fixed to the outer package via a heat insulating member; a vibration element accommodated in the inner package; a heat generation element accommodated in the accommodation space and fixed to the inner package; an oscillation circuit configured to oscillate the vibration element; a control circuit disposed outside the accommodation space and configured to control the heat generation element; and a conductive wire electrically coupling the outer package and the inner package.

Oscillator

An oscillator includes a second container as a container in which a vibrator is accommodated, a base substrate on which the second container is mounted, three or more protruding portions provided on the base substrate at positions overlapping the second container in a plan view, and a bonding member configured to bond the second container and at least one of the protruding portions.

Temperature stabilized oscillator

An oscillator includes a first resonator element, a first package that accommodates the first resonator element, a relay substrate on which the first package is mounted, a heater element that is attached to the first package or the relay substrate, a second package that accommodates the first package, and a heat insulating member that is provided at least between the second package and the relay substrate or between the relay substrate and the first package.

An oscillator includes: an outer package; an inner package accommodated in the outer package and fixed to the outer package via a heat insulating member; a vibration element accommodated in the inner package; a temperature sensor; a first circuit element accommodated in the inner package and including an oscillation circuit configured to oscillate the vibration element and generate a temperature-compensated oscillation signal based on the temperature sensor; and a second circuit element fixed to the outer package and including a frequency control circuit configured to control a frequency of the oscillation signal.

An oscillator includes a board having a first surface, and provided with a housing section opening on the first surface, a resonator including a resonator element and a resonator package configured to house the resonator element, a heat generator attached to the resonator, electrically connected to the resonator package, and disposed inside the housing section, and a plurality of lead terminals connected to the board, and configured to support the resonator.

Oscillator, electronic apparatus and vehicle

An electro-optical apparatus has an element substrate that is provided with a mirror and a sealing member which seals the mirror, and the sealing member includes a light-transmitting cover which faces the mirror opposite from the element substrate. An infrared cut filter is laminated on the light-transmitting cover.

Electro-optical device, manufacturing method of electro-optical device, and electronic apparatus

An oscillator includes a first package including a first base, and a first lid bonded to the first base, a first temperature controller housed in the first package, and mounted on the first base, a second temperature controller housed in the first package, and mounted on the first base, and a circuit element housed in the first package, mounted on the first base, and including at least a part of an oscillation circuit, the circuit element is disposed between the first temperature controller and the second temperature controller in a planar view.

Oscillator, an electronic apparatus, and a vehicle

An oscillator includes a case that has a base and a cap connected to the base; a first substrate accommodated in the case; a lead terminal electrically connected to the first substrate; and a resonator module electrically connected to the lead terminal and supported by the lead terminal with a gap with respect to the first substrate between the first substrate and the base.

Oscillator and electronic device

A quartz crystal oscillator as an electronic component includes a base section as a first substrate having a lower surface as a first surface, a first lead terminal connected to the first surface, and a second lead terminal connected to the first surface, and the first lead terminal and the second lead terminal intersect each other when viewed in a first direction along the first surface.

Electronic component and electronic apparatus

An oscillator includes a container, a first heater disposed in a first area of the container, a second heater disposed in a second area of the container that is different from the first area, a vibrator disposed between the first area and the second area when viewed in the direction perpendicular to a surface on which the first heater is disposed, and a layer that is disposed between the vibrator and the container with at least part of the layer overlapping with the first heater, the second heater, and the vibrator when viewed in the direction perpendicular to the surface on which the first heater is disposed, and the thermal conductivity of the layer is higher than the thermal conductivity of the first and second areas.

Oscillator and electronic apparatus

An electric field generating unit that forms an electric field between a nozzle forming surface of a recording head and a medium support section that faces the nozzle forming surface by applying a voltage to a conductive member includes the conductive member, forms an electric field, and, during borderless recording in which ink is ejected on inside and outside of an edge of a paper sheet, applies an increased voltage in an ink discarded region outside the edge compared to a voltage applied in a recording region other than the ink discarded region.

Recording apparatus

An oscillator includes a first package, an oscillation element housed in the first package, a first temperature controller housed in the first package, a second package adapted to house the first package, and a second temperature controller disposed outside the first package, and housed in the second package.

Oscillator, electronic apparatus, and vehicle

An electronic device includes a base material, a first metal film disposed on the base material and containing nitrogen and chromium, and a second metal film disposed on the first metal film and containing gold. In the first metal film, the number of nitrogen atoms may be between 20% to 100% of the number of chromium atoms. Further, the distribution of nitrogen atoms in the first metal film is larger in a third region sandwiched between a first region on the base material side of the first metal film and a second region on the second metal film side than in the first region and in the second region.

Electronic device, method for producing electronic device, electronic apparatus, and moving object

An electronic device includes: an electronic component including an external connection terminal; and a lead frame (metal member) connected to the external connection terminal. The lead frame is disposed with a pad. The pad overlaps the external connection terminal in plan view, and at least a portion of the pad is located outside the external shape of the electronic component in plan view. The pad and the external connection terminal are connected by means of a conductive bonding member. The pad and the electronic component are bonded together with a resin. The resin extends to a region of the pad located outside the external shape of the electronic component in plan view.

Electronic device, electronic apparatus, moving object, and method for manufacturing electronic device

A resonator device includes a resonator element, a package that accommodates the resonator element, a temperature control element arranged on a first surface of the package, and a circuit part arranged on a second surface of the package that faces away from the first surface.

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Matsumoto, Japan

Manabu Kondo