Mitsubishi Chemical Corporation

Mitsubishi Rayon Company, Limited

Konica Minolta Ij Technologies, Inc.

Konica Corporation

Mitsubishi Heavy Industries Limited

Konica Minolta, Inc.

Konica Minolta Business Technologies, Inc.

Konica-minolta Holdings, Inc.

Manabu Kaneko

Takayuki Kobayashi

Shuichi Sugita

Atsushi Nakajima

Kenichi Watanabe

Hidenobu Ohya

Yasuhiro Fukuhara

Hisato Kato

Tadao Samejima

Shinri Tanaka

Takuya Teranishi

Masahiro Ichino

Kazutami Mitani

Masayuki Ushiku

Kiharu Numata

Shuji Kida

Masashi Ikeda

Takatugu Suzuki

Hirotaka Iijima

Noriya Hayashi

Makoto Kaga

Akio Maeda

Naoki Aoyama

Masao Tomioka

Yoshiko Irie

Tetsuya Atsumi

Yasuyuki Fujii

Masahiro Hata

Kazuki Koga

Hisashi Mori

Yukihiro Harada

Kenichi Ohkubo

Norifumi Hirota

Takayuki Kiriyama

Takeshi Nii

Hisaya Ushiyama

Masami Kato

Michiko Nagato

Hiroyuki Nakao

Yuusuke Shinmen

Naoto Niizuma

Sanae Kita

Harumi Matsuda

Teppei Miura

Tomoko Ishimoto

Naomasa Matsuyama

Tomoo Sano

Akira Miyauchi

Naoko Nakajima

Atsushi Nohara

Shouhei Mori

Masaki Kusumi

Shigekazu Takeda

Miyuki Hagiwara

Toshiyuki Itou

Hiroki Hamagami

Akiyoshi Kogame

This prepreg comprises reinforcing fibers and a matrix resin composition. The matrix resin composition comprises at least an epoxy resin (component (A)), a radical polymerizable unsaturated compound (component (B)), and a polymer formed by radical polymerization of the component (B) (component (E)).

Prepreg and method for producing same

Provided are an epoxy resin composition which contains an epoxy resin and a curing agent, and satisfies the following (1), (2), and (3):

Epoxy resin composition, and film, prepreg, and fiber-reinforced plastic using same

To provide an epoxy-resin composition and prepreg for producing a fiber-reinforced composite material which exhibits excellent curability and has excellent flame retardance and heat resistance, as well as to provide fiber-reinforced composite materials produced using the prepreg and to provide housing for electronic/electrical devices. The epoxy resin composition contains component (A): a phosphorus compound; component (B): an epoxy resin which has at least three epoxy groups in the molecule, and which does not correspond to component (A) nor include component (A); component (C): an epoxy resin curing agent which does not have a urea structure in the molecule; and component (D): a dimethylurea compound represented by formula (a) (in formula (a), 'R' is a hydrogen atom or an alkyl group having any number of 1 to 10 carbons). 

Epoxy resin composition, prepreg, fiber-reinforced composite material, and housing for electrical or electronic equipment

The present invention pertains to a prepreg containing reinforcing fibers and an epoxy resin composition. Said prepreg is sandwiched between dies preheated to 140.degree.C. and pressurized to MPa and held for five minutes at this temperature to obtain a cured article having a G'Tg of at least 150.degree.C. The present invention also pertains to a fiber-reinforced composite material and a method for producing same. According to this invention, it is possible to provide a prepreg which is well suited to press-molding, particularly to high-cycle press-molding. It is also possible to provide a fiber-reinforced composite material which can be heat-cured at a lower temperature and over a shorter time than conventional methods, with which it is possible to minimize excessive flow of resin in hot-press curing, and which is resistant to performance defects such as fiber meandering and defects in surface appearance. A method for producing the same can also be provided.

Prepreg, fiber-reinforced composite material, method for producing same, and epoxy resin composition

The present invention is an epoxy resin composition characterized by containing component A (epoxy resin containing sulfur atoms in the molecule thereof); and component B (an epoxy resin composition containing an imidazole compound represented by formula (1), and at least one of the following components: component C (an imidazole compound represented by formula (2) below) or component D (an epoxy resin composition having at least one sulfur atom in the molecule. According to the present invention, it is possible to provide an epoxy resin composition which has outstanding stability when stored at room temperature, and which can be heat-cured at a relatively low temperature and over a short time, to give a resin with a high heat resistance when cured. (In formula (1), Rrepresents a straight-chain or branched-chain alkyl group having 1 to 5 carbon atoms, or a hydroxymethyl group, Rrepresents a straight-chain or branched-chain alkyl group having 1 to 5 carbon atoms, or a hydrogen atom.) (In formula (2), Rrepresents an organic group having 1 or more carbon atoms, and Rto Rrepresent hydrogen atoms, methyl groups or ethyl groups.) 

Epoxy resin composition, prepreg, fiber-reinforced composite material, and method for producing same

An epoxy-resin composition of the components (A), (B), (D) and (E), where component (A) is an epoxy resin having an oxazolidone-ring structure, (B) is a bisphenol bifunctional epoxy resin with a number-average molecular weight of at least 600 but no more than 1300, which does not have an oxazolidone-ring structure, (D) is a triblock copolymer, and (E) is a curing agent. A film made of the epoxy-resin composition, a prepreg and a fiber-reinforced plastic is also disclosed. The epoxy resin composition is capable of achieving both a processability of a prepreg at room temperature and a suppression of voids in the molded product. A fiber-reinforced plastic having excellent mechanical properties, especially excellent fracture toughness and heat tolerance, is also obtained by using the epoxy-resin composition.

Epoxy-resin composition and film, prepreg, and fiber-reinforced plastic using same

A resin composition that has good heat resistance and handleability and that can produce a prepreg which has a good balance between tackyness and drapability and which causes little resin flow during prepreg molding, a prepreg that is manufactured using the resin composition, and a fiber-reinforced composite are provided. A resin composition that contains a maleimide compound, diallyl bisphenol A, and a diallyl isophthalate polymer, a prepreg in which reinforcing fibers are impregnated with the resin composition, and a fiber-reinforced composite material that is obtained by molding the prepreg are provided.

Resin composition, prepreg using the same, and fiber-reinforced composite material

The present invention relates to an epoxy-resin composition comprising the following components (A), (B), (C) and (D), a film made of the epoxy resin composition, a prepreg and a fiber-reinforced plastic. The present invention can provide an epoxy-resin composition that cures at a low temperature in a short period of time. Also, the present invention can provide a fiber-reinforced plastic having excellent mechanical characteristics, especially excellent fracture toughness and heat tolerance, is made from the epoxy-resin composition. 

Epoxy-resin composition, and film, prepreg and fiber-reinforced plastic using the same

The present invention relates to a method for producing a prepreg which contains reinforcing fibers and a matrix resin composition with the weight per square meter of the reinforcing fibers being 250-2,000 g/m. The production method comprises the following steps (1)-(3): (1) a matrix resin composition blending step for obtaining a matrix resin composition by mixing an epoxy resin, a radically polymerizable unsaturated compound, an epoxy resin curing agent and a polymerization initiator that generates radicals, in said step the content of the radically polymerizable unsaturated compound relative to 100% by mass of the total of the epoxy resin and the radically polymerizable unsaturated compound being 10-25% by mass; (2) a matrix resin composition impregnating step; and (3) a surface viscosity increasing step.

Matrix resin composition, prepreg and method for producing the same, and fiber-reinforced composite material

Provided is an RTM moldable chain curing resin composition which can be molded with less energy in a short time, and which makes it possible to obtain a cured product that is superior in mechanical strength. A chain curing resin composition of the present invention includes an alicyclic epoxy compound (A) having two cyclohexene oxides in a molecule and a specific modified bisphenol A-type epoxy resin (B), and the content of the alicyclic epoxy compound (A) is 25 to 90% by mass, when the total of the component (A) and the component (B) is taken as 100% by mass.

Chain curing resin composition and fiber-reinforced composite material

Provided is an inkjet ink which can form high-quality images with high abrasion resistance and adhesiveness on a non-absorptive recording medium and which exhibits high ejection properties and excellent storage stability. Also provided is an inkjet recording method. An inkjet ink which comprises water, a pigment, a water-soluble resin, a water-soluble or Panic solvent and a surfactant, characterized in that: the water-soluble resin comprises a water-soluble resin consisting of a copolymer resin which has an acid value of 50 to 130 mgKOH/g, a glass transition temperature (Tg) of 30 to 100&#xb0; C., and a weight-average molecular weight (Mw) of 20,000 to 80,000, said copolymer resin being a resin which is synthesized from a monomer component that comprises methyl methacrylate, an alkyl acrylate or methacrylate, and an acid monomer and in which the total mass of methyl methacrylate and the alkyl acrylate or methacrylate is 80 to 95% relative to the total mass of all of the monomers constituting the copolymer resin; and the surfactant comprises a fluorochemical surfactant and a polyoxyethylene alkyl ether.

Inkjet ink and inkjet recording method

A method for producing a fiber-reinforced composite material having high mechanical properties and high heat resistance, and allowing the use of a gypsum die in primary curing, wherein a fiber-reinforced prepreg, obtained by impregnating reinforcing fibers with an epoxy resin composition comprising a triphenylmethane-type epoxy resin, N,N,N',N&#x2032;-tetraglycidyldiaminodiphenylmethane (B) and diaminodiphenylsulfone (C), is subjected to primary curing at 110-130&#xb0; C., and then to secondary curing at a temperature which is at least as high as the primary curing temperature.

Method for producing fiber-reinforced composite material, and heat-resistant mold material and heat-resistant structural material using the fiber-reinforced composite material

Provided is an inkjet ink including at least water, a pigment, a resin, a water-soluble organic solvent, and a surfactant, wherein the resin consist of a copolymer resin synthesized from only a (meth)acrylic monomers, and the copolymer resin has an acid value of not less than 50 mgKOH/g and not more than 200 mgKOH/g, a glass transition temperature (Tg) not less than 20 and not more than 100&#xb0; C., and a weight-average molecular weight (Mw) not less than 20,000 and not more than 100,000, and as a result, a high-quality image is formed in that abrasion resistance and adhesiveness on a non-absorptive recording medium are high, glossiness is high, and there is no ink mixing, and ejection performance is good and recovery through maintenance is excellent. Also provided is an inkjet recording method that uses the same.

Disclosed is an inkjet ink which provides a high-quality image in that whitening of the recorded image film is inhibited, durability of the image is good, and there is no banding, and the like; inkjet injection stability and ink shelf life are excellent; and head maintenance returnability is excellent. Also disclosed are a method for producing an inkjet printed product using the same, and a method for producing a water-based inkjet ink. This inkjet ink comprises at least a) a pigment, b) a polymer dispersant comprising polyethylene oxide groups having an acid value of less than 50 mgKOH/g (c) acrylic copolymer resin, and (d) at least one water-soluble organic solvent selected from glycol ethers and 1,2-alkanediols having 4 or more carbons.

Water-based inkjet ink, method for producing inkjet printed product using the same, and method for producing water-based inkjet ink

Provided is a method for forming an image using an ink-jet recording method which forms the image with a single pass printing method employing an ink comprising water in an amount of 20 to 90 weight % based on the total weight of the ink, a pigment and a water soluble resin containing an acidic group which is neutralized with ammonia or an amine compound, the method containing the steps of: applying a processing solution on a coated paper for printing; and ejecting droplets of the ink on the coated paper for printing, wherein the processing solution is capable of aggregating an ingredient of the ink or increasing a viscosity of the ink, and the coated paper for printing is heated from 40 to 60&#xb0; C. during the step of ejecting the droplets of the ink.

Image forming method

Growing community of inventors

Toyohashi, Japan

Manabu Kaneko