Nuflare Technology, Inc.

Manabu Isobe

Takafumi Inoue

Hiroteru Akiyama

Hideo Tsuchiya

Nobutaka Kikuiri

Shusuke Yoshitake

Thomas Scheruebl

Kazuhiro Nakashima

Dirk Beyer

Eiji Matsumoto

Makoto Yabe

Sven Heisig

A pattern inspection apparatus includes an optical image acquisition mechanism to acquire optical image data of a plurality of regions from a substrate where a plurality of figure patterns are formed, a plurality of comparison circuits each of which performs one of die-to-die inspection processing for comparing the optical image data with each other and die-to-database inspection processing for comparing the optical image data with reference image data generated from design pattern data, and an inspection circuit to individually output, for each region of the plurality of regions, the optical image data of a region concerned to comparison circuits, whose number is variably set for each region, in the plurality of comparison circuits, and to control each comparison circuit, serving as an output destination of the optical image data in the plurality of comparison circuits, to perform one of the die-to-die inspection processing and the die-to-database inspection processing.

Pattern inspection apparatus and pattern inspection method

To include generating a reference image based on a comparison between design data of a mask having patterns and an optical image of the mask in a first region of the mask designated in advance, and confirming whether the generated reference image has effectiveness, the generating and the confirming being performed by a reference circuit, in which the confirmation on whether the reference image has effectiveness includes adding, as a confirmation region in which whether the reference image has effectiveness is to be confirmed, a second region of the mask in addition to the first region set in advance as the confirmation region, the adding being performed by an addition circuit, and confirming whether the reference image has effectiveness in the confirmation region including the first region and the second region, the confirming being performed by the reference circuit.

Reference-image confirmation method, mask inspection method, and mask inspection device

A pattern inspection apparatus includes: an optical image acquiring mechanism to acquire optical image data of a corresponding divided pattern for each of masks for multiple patterning has been formed; a position deviation map generating processing circuitry to generate position deviation maps regarding the corresponding divided pattern; a difference position value map generating processing circuitry to generate one difference position value map defining a difference value between relative position deviation amounts of the each minimum element of the position deviation maps; a region specifying processing circuitry to specify at least one region having the difference value exceeding a threshold of distance between patterns laying side-by-side by using the difference position value map; and an output mechanism to output at least coordinates, a type of defect, and information of a reference image of each region specified for the each region specified.

Pattern inspection apparatus, pattern position measurement apparatus, aerial image measurement system, method for measuring aerial image, pattern position repairing apparatus, method for repairing pattern position, aerial image data processing apparatus, method for processing aerial image data, pattern exposure apparatus, method for exposing pattern, method for manufacturing mask, and mask manufacturing system

An inspection method comprising, virtually dividing a sample, in which a plurality of chip patterns are formed, into a plurality of strip-shaped stripes along a predetermined direction to acquire an optical image of the chip pattern in each of the stripes, performing filtering based on design data of the chip pattern to produce a reference image corresponding to the optical image, comparing the chip pattern using a die-to-database method and comparing a repetitive pattern portion in the chip pattern using a cell method, obtaining at least one of a dimension difference and a dimension ratio between a pattern of the optical image and a pattern of the reference image compared to the pattern of the optical image by the die-to-database method; and obtaining a dimension distribution of the plurality of chip patterns from at least one of the dimension difference and the dimension ratio.

Inspection method

Growing community of inventors

Hiratsuka, Japan

Manabu Isobe