Asm Assembly Automation Limited

Other

Man Wai Chan

Chi Ming Chong

Yuk Cheung Au

Kwok Wai Wong

Srikanth Narasimalu

Kin Yik Hung

Cheuk Wah Tang

Jin Hui Meng

Siu Ping Yip

Kai Chiu Wu

Wei Ling Chan

A wave powered generating device includes a floating vessel with onboard pendulum mechanism, an anchor with a mooring chain connected with the vessel, a lever arm, an upstanding post having a tip connected with the lever arm and a foot coupled with a universal coupler, a pendulum moveably mounted on the lever arm being erected above a platform deck of the vessel by the upstanding post, a gear mechanism incorporating with a centrifugal flywheel coupled with the universal coupler via a transmission mechanism for delivery of momentum of the pendulum, and a power generating mechanism driven by the gear mechanism. Under undulating waves, the pendulum, being mounted on the lever arm, sways laterally around an axis of the upstanding post, causing the upstanding post to rotate hence delivering the momentum of the pendulum to drive the power generating mechanism via a transmission shaft and the gear mechanism.

Floating wave powered generator

A die detachment apparatus for partially delaminating a die from an adhesive tape on which it is mounted comprises a cover having a support surface that is operative to support the adhesive tape, the support surface including a set of cover holes. A movable pin chuck is positioned below the support surface and includes a set of pin holes that are arranged coaxially with the cover holes. The movable pin chuck is configured for detachably inserting a set of pins in a first desired configuration on some of the pin holes, and the pins are also operable to be relocated on the pin chuck to form another desired configuration. The pins are operative to protrude from the cover by passing through the cover holes to contact and lift the die.

Universal die detachment apparatus

A die detachment device for delaminating a die which is mounted at a position on an adhesive film comprises a plurality of movable plates having quadrilateral-shaped contact surfaces which are arranged adjacent to one another. The plurality of movable plates comprises an intermediate movable plate and outer movable plates on opposite sides of the intermediate movable plate. The contact surfaces of the movable plates together form a combined contact surface for supporting the adhesive film at the position of the die, each movable plate being movable relative to the other movable plates towards and away from the die.

Device for thin die detachment and pick-up

During detachment of a die from an adhesive tape, the inner and outer portions of a first side of the die which is in contact with the adhesive tape is supported with a support surface. A collet contacts the inner and outer portions of a second side of the die opposite to the first side. Support is withdrawn from the outer portion of the die such that the outer portion of the second side of the die bends away from the collet while the support surface only supports the inner portion of the die. Vacuum suction from the collet is applied to attract the outer portion of the die towards the collet and the vacuum suction pressure is monitored until a threshold pressure is reached indicating that the outer portion of the die is contacting the collet. Thereafter, the collet is lifted while holding the die with vacuum suction to completely separate the die from the adhesive tape.

Control and monitoring system for thin die detachment and pick-up

An oven is provided for curing or reflowing compounds on objects, such as lead frames or other substrates. The oven comprises a heating chamber, a heating assembly mounted in thermal communication with the heating chamber to provide heat thereto, and a support assembly for supporting the object in the heating chamber for heating. The heating assembly and support assembly are configured to be movable relative to one another for controllably positioning the object at variable distances with respect to the heating assembly. Heating of the object according to a heating profile can thus be achieved by controlled heating of the object at different temperatures by positioning the object at different distances with respect to the heating assembly during the heating process although there is a single heating zone.

Oven for controlled heating of compounds at varying temperatures

Fluid dispensing apparatus for dispensing small precise metered quantities of fluid, for example in a semiconductor manufacturing process, comprises two metering chambers disposed in series. Each metering chamber has an associated piston rod and fluid is dispensed therefrom alternately. Twice the volume of fluid is displaced from the upstream metering chamber so that when it dispenses fluid at the same time it can refill the second downstream metering chamber.

Growing community of inventors

Hong Kong, China

Man Wai Chan