Samsung Electro-mechanics Co., Ltd.

Man Su Byun

Soo Hwan Son

Ho Yoon Kim

Min Kyoung Cheon

Dae Heon Jeong

Kyung Hwa Yu

Young Ghyu Ahn

Sang Soo Park

Jae Yeol Choi

Woo Chul Shin

Taek Jung Lee

Won Chul Sim

Se Hun Park

Ho Young Kim

Gu Won Ji

The present disclosure provides a multilayer capacitor and a board component having the same. The multilayer capacitor includes: a capacitor body including dielectric layers, and first and second internal electrodes that are alternately disposed with the dielectric layers interposed therebetween, and having first to sixth surfaces; first and second external electrodes disposed on opposite end portions of the capacitor body in a direction perpendicular to the third and fourth surfaces, and connected to the first and second internal electrodes, respectively; an insulator disposed on the first surface of the capacitor body; a first conductive resin layer covering the first external electrode and one end portion of the insulator in the direction; and a second conductive resin layer covering the second external electrode and the other end portion of the insulator in the direction.

Multilayer capacitor and board component having the same

A multilayer capacitor includes: a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked on each other having at least one dielectric layer interposed therebetween in a first direction; first and second external electrodes disposed on the body while being spaced apart from each other to be respectively connected to first internal electrode and second internal electrode; and first and second bumps respectively having one surfaces disposed on the first or second external electrode and including at least one hole positioned in the one surface or the other surface, wherein Aindicates a total area of the at least one hole, Aindicates an area of the one surface of the first or second bump, facing the first or second external electrode, and A/Ais greater than 0.012 and less than 0.189.

Multilayer capacitor

A multilayer capacitor includes a capacitor body including a dielectric layer and first and second internal electrodes; first and second external electrodes; and an insulator disposed on a first surface of the capacitor body. The capacitor body includes an active region in which first and second internal electrodes overlap each other in a first direction, and upper and lower covers disposed above and below the active region in the first direction. A length of the active region in the second direction is defined as 'La', a length of one margin of the capacitor body in the second direction is defined as 'Lm', a height of the active region in the first direction is defined as &#x2018;Ta&#x2019;, a thickness of the lower cover of the capacitor body is defined as &#x2018;Tc&#x2019;, and a thickness of the insulator is defined as &#x2018;Te&#x2019;. A relative displacement index, ((La/Lm)&#x2212;(Ta/Tc))/Te), ranges from 0.003 to 0.055.

Multilayer ceramic capacitor and board having the same mounted thereon

An electronic component includes a substrate including electrode pads disposed on an upper surface; and a plurality of multilayer capacitors mounted on the substrate and including external electrodes connected to the electrode pads. At least one multilayer capacitor among the plurality of multilayer capacitors is a multilayer capacitor of a horizontally stacked structure.

Electronic component

An electronic component includes a multilayer capacitor, including a capacitor body and first and second external electrodes disposed on both ends of the capacitor body, respectively, in a first direction, and a interposer including an interposer body and first and second external terminals in a second direction. The capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes exposed through the both ends of the capacitor body, respectively. The first and second external terminals each include a first layer including CuNi, a second layer covering the first layer and including copper (Cu), a third layer covering the second layer and including nickel (Ni), and a fourth layer covering the third layer and including tin (Sn), which are sequentially disposed from a respective inner side of the first and second external terminals.

A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.

Composite electronic component and board having the same

An electronic component includes a multilayer capacitor including a capacitor body and an external electrode disposed at an end of the capacitor body, and an interposer including an interposer body and an external terminal disposed at an end of the interposer body. The external terminal includes a bonding portion disposed on a first surface of the interposer body and connected to the external electrode, a mounting portion disposed on a second surface of the interposer body opposing the first surface, and a connection portion disposed on an end surface of the interposer body to connect the bonding portion and the mounting portion and having an uneven surface, and a conductive bonding agent is disposed between the external electrode and the bonding portion of the external terminals, and an adhesive extends to a portion of the uneven surface.

A multilayer electronic component include a multilayer capacitor including a capacitor body and first and second external electrodes disposed on ends of the capacitor body, respectively; an alumina chip including a chip body and first and second external terminals disposed on ends of the chip body, respectively, the first and second external terminals being in contact with the first and second external electrodes, respectively; a first plating layer covering the first external electrode and the first external terminal; and a second plating layer covering the second external electrode and the second external terminal. The first and second plating layers each include a nickel plating layer a tin plating layer disposed on the first external electrode and the first external terminal and on the second external electrode and the second external terminal, respectively.

Multilayer electronic component and board having the same mounted thereon

A complex electronic component includes a body including a first external electrode and a second external electrode, disposed on an external surface thereof and a laminate; a plurality of first electrodes and a plurality of second electrodes, disposed in the laminate and electrically connected to the first external electrode and the second external electrode, respectively; a third electrode and a fourth electrode, disposed on the laminate to be spaced apart from each other and electrically connected to the first external electrode and the second external electrode, respectively; and an ESD discharge layer disposed between the third electrode and the fourth electrode. In addition, a distance between the third electrode and the fourth electrode is within a range of 30 &#x3bc;m to 60 &#x3bc;m.

Complex electronic component

A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a body having internal electrodes stacked to face each other and a plurality of dielectric layers interposed therebetween, and first and second external electrodes disposed on both end portions of the body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor, wherein the ceramic chip has a double-step shape and includes two ceramic chips having different lengths to each other and coupled in a thickness direction of the ceramic chip.

A composite electronic component includes a composite body including: a multilayer ceramic capacitor including a first ceramic body including a plurality of dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween and stacked to be perpendicular to a lower surface of the first ceramic body, and a ceramic chip being coupled to the multilayer ceramic capacitor and disposed on a lower portion of the multilayer ceramic capacitor, the ceramic chip including a second ceramic body, first and second terminal electrodes disposed on upper and lower portions of the second ceramic body and connected to the first and second external electrodes, respectively.

A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes and having first to sixth surfaces, the first and second internal electrodes being exposed through the third and fourth surfaces, respectively; first and second external electrodes including first and second connected portions respectively disposed on the third and fourth surfaces of the capacitor body and first and second band portions respectively extending from the first and second connected portions to portions of the first surface of the capacitor body, respectively; a first connection terminal disposed on the first band portion; and a second connection terminal disposed on the second band portion, wherein 0.05&#x2264;A1/A1&#x2264;0.504, where A1 is an area of the first or second connection terminal in a thickness-width direction, and A2 is an area of the first or second band portion in a width-length direction.

Multilayer electronic component and board having the same

The composite electronic component includes: the capacitor including a body in which a plurality of dielectric layers and internal electrodes facing each other, with the dielectric layer interposed therebetween, are stacked, and the ESD protection device including first and second lead electrodes disposed on the body of the capacitor, a discharge part disposed between the first and second lead electrodes, and a protection layer disposed on the first and second lead electrodes and the discharge part; an input terminal connected to the internal electrode of the capacitor and the first lead electrode of the ESD protection device; and a ground terminal connected to the internal electrode of the capacitor and the second lead electrode of the ESD protection device. G2/G1&#x3c;4.0 is satisfied, in which G1 is a distance between the internal electrodes adjacent to each other and G2 is a distance between the first and second lead electrodes.

A composite electronic component includes a multilayer capacitor including a capacitor body, which includes first and second internal electrodes facing each other and a plurality of dielectric layers each interposed therebetween and first and second external electrodes disposed on opposing ends of the capacitor body, a high-rigidity chip including a substrate disposed on a lower side of the multilayer capacitor and first and second discharge electrodes disposed on the substrate and spaced apart from each other, the first and second discharge electrodes being connected to the first and second external electrodes, respectively, and extending to an upper or lower surface of the substrate, and an sealing part covering the first and second discharge electrodes and including a space portion, which is provided between the first and second discharge portions.

Growing community of inventors

Suwon-si, South Korea

Man Su Byun