Industrial Technology Research Institute

Man-Lin Chen

Hsien-Kuang Lin

Sue-May Chen

Tien-Shou Shieh

Su-Huey Chen

Der-Jaw Chan

Chuang-Shin Chiou

Jing-Pin Pan

Tsung-Hsiung Wang

Shur-Fen Liu

Pei-Ching Liu

Jauder Jeng

Chun-Neng Ku

Yu-Lin Liu

Wen-Kuo Weng

Pa-Yen Lu

Pey-Ching Liou

Pei-Wen Ding

Ming-Shun Chan

A wood adhesive, a method for adhering wood materials using the same, and a composite wood structure using the same are disclosed. The wood adhesive comprises a first agent and a second agent, wherein the first agent comprises sodium carboxymethyl cellulose having a molecular weight from about 15,000 to about 500,000 and a degree of substitution from about 0.4 to about 2, and the second agent comprises polymeric quaternary amine.

Wood adhesive, method for adhering wood materials using the same, and composite wood structure using the same

A wood adhesive is provided. The wood adhesive includes a first agent and a second agent. The first agent includes a sodium carboxymethyl cellulose and a styrene-butadiene rubber polymer. The sodium carboxymethyl cellulose has a molecular weight between 15,000 and 500,000 and a degree of substitution of from 0.4 to 2.00 of the sodium salt. The second agent includes a polymeric quaternary amine.

Wood adhesive

A method of forming a biomass photosensitive material is provided, which includes () polymerizing (a) itaconic anhydride and (b) acrylate to form a copolymer, and () mixing the copolymer and (c) monomer with a single hydroxy group and a carbon-carbon double bond for a ring-opening addition reaction, wherein the (a) itaconic anhydride and the single hydroxy group of the (c) monomer with the single hydroxy group and the carbon-carbon double bond are reacted in the ring-opening addition reaction.

Biomass photosensitive material and method for manufacturing the same, and printed circuit board

A sealant composition is provided. The sealant composition includes (a) an oligomer including an unsaturated mono-carboxylic acid modified bisphenol A epoxy resin and an unsaturated mono-carboxylic acid modified bisphenol F epoxy resin, wherein an equivalence ratio of the bisphenol A epoxy resin to the bisphenol F epoxy resin is 0.05:0.95 to 0.3:0.7, the bisphenol A epoxy resin has a melting point higher than 40&#xb0; C. and the bisphenol F epoxy resin has a melting point lower than 40&#xb0; C.; (b) an epoxy resin having at least two or more than two epoxy groups; and (c) a photoinitiator.

Sealant composition

Fabrication device of organic light emitting diode (OLED) includes a Substrate, a transparent conductive layer, an insulating film layer, an organic light-emitting layer, and a conductive layer; when a suitable potential is applied thereto, an organic light-emitting layer emits a visible light, however, it usually occurs breakdown between cathode and anode or bad signal, therefore, the present invention provides a positive insulating film photoresist with an easily inclining obtuse angle, smooth surface, and easily controlled fabrication condition to cover the edge of a transparent electrode (anode) in order to avoid that when the edge of ITO transparent electrode is sharp it causes an organic light-emitting layer film breakdown and results from signal lost or weaken to increase the yields.

Photosensitive insulating film of organic light emitting diode (OLED)

The invention discloses a method of forming via-holes in multilayer circuit boards. The process includes forming covering substances in predetermined spots in a multilayer circuit board and thereafter applying an insulating layer upon the circuit board. The predetermined spots are then uncovered and the covering substances are removed to form via-holes.

Method of forming via-holes in multilayer circuit boards

The present invention discloses a photo-sensitive composition, used as a solder resist or a photosensitive material for insulation layers in the production of printed circuit boards. The photo-sensitive composition comprises a prepolymer containing carboxylic groups and unsaturated vinyl groups; photoinitiator; unsaturated photo-monomer; and the reaction adduct of bismaleimide derivative, barbituric acid derivative and epoxy compounds. The obtained photosensitive composition exhibits high adhesion towards PI substrates, in addition, it can be developed with alkaline water. The photosensitive composition obtained in the invention is very useful in packaging substrates, such as P-BGA, T-BGA and F-CSP due to its high heat resistance and solder resistance.

Photosensitive composition

A method for making high-density multilayer printed circuit boards is disclosed. It includes the steps of: (a) forming a pair of first conductive layers on top and bottom sides of a dielectric substrate; (b) forming first via holes through one of the first electrically conductive layers; (c) forming a blind hole through the dielectric substrate using a conformal laser drilling technique and filling the blind hole with an electrically conductive material; (d) forming a circuit pattern from the first electrically conductive layer; (e) forming a first electrically insulating layer on the first electrically conductive layer; (f) forming second via holes through the first electrically insulating layer using a non-conformal laser drilling technique; (g) forming a second electrically conductive layer covering the top surface of the circuit pattern, the first electrically insulating layer, and the side surface of the second via holes by electroplating; (h) forming a second electrically insulating layer on the first electrically conductive layer and filling the second via hole with the same electrically insulating material; (i) removing the second electrically insulating layer and the second electrically conductive layer above the second via hole; (j) forming a third electrically conductive layer on the first electrically insulating layer, wherein the third electrically conductive layer is in contact with the top edges of the second electrically conductive layer remaining on the cylindrical surface of the second via; (k) forming another circuit pattern on the third electrically conductive layer. Steps(e) through (k) can be repeated for more circuit patterns.

Growing community of inventors

Miaoli County, Taiwan

Man-Lin Chen