Atmel Corporation

Honeywell G.m.b.h.

Microchip Technology Inc.

Man K Lam

Milton W Mathias

Methods are provided for forming an IC power package including a power MOSFET device, a microprocessor/driver, and/or other discrete electronics. A lead frame may be etched to form a half-etch lead frame defining component attach structures at the top side of the lead frame. A power MOSFET may be mounted to a die attach pad defined in the half-etch lead frame, and the structure may be overmolded. The top of the overmolded structure may be grinded to reduce a thickness of the power MOSFET and expose a top surface of the MOSFET through the surrounding mold compound. A conductive contact may be formed on a top surface of the MOSFET. Selected portions of the half-etch lead frame may be etched from the bottom-up to separate the MOSFET from other package components, and to define a plurality of package posts for solder-mounting the package to a PCB.

High performance multi-component electronics power module

An integrated circuit (IC) package, e.g., a power MOSFET package, may include a lead frame including (a) a main lead frame structure including a plurality of leads and defining or lying in a main lead frame plane, and (b) an offset lead frame die-attach pad (DAP) defining or lying in an offset plane that is offset from the main lead frame plane. The power IC package may further include a semiconductor die having a first side attached to the offset lead frame DAP, and a conductive element attached to both (a) a second side of the semiconductor die and (b) the main lead frame structure. The lead frame including the offset DAP may emulate the functionality of a copper clip, thus eliminating the need for the copper clip. The power IC package may also exhibit enhanced heat dissipation capabilities.

Integrated circuit (IC) die attached between an offset lead frame die-attach pad and a discrete die-attach pad

An integrated circuit package and method of making the package which allows an integrated circuit die to be bonded to a substrate without need of a carrier. The integrated circuit die has opposed active and passive surfaces and has lateral surfaces. An electrically insulative layer of material is deposited on the passive and lateral surfaces. A metal mask is formed to cover the active surface and the coated lateral surfaces. The metal mask includes slots which extend up the lateral surfaces and onto the active surface. The array of slots corresponds to an array of input/output contact pads on the active side. Metal is sputtered into the slots, whereafter the mask is removed to provide L-shaped conductive traces from the contact pads along the active and lateral sides. The assembly can then be rested on a substrate on the passive surface and the L-shaped traces bonded to contact pads on the substrate. The assembly allows testing at the die level.

Carrierles surface mounted integrated circuit die

A method of manufacturing a repairable multi-chip module including providing a plurality of tape automated bonded chips secured to a corresponding number of substrates by a first bonding material. A second bonding material having a melting point below that of the first bonding material is used to mechanically attach the substrates to a multi-chip package. However, the second bonding material is not melted until after all of the chips have been properly tested. Electrical attachment is provided prior to mechanical attachment by bonding leads of the tape automated bonding frame to the multi-chip module. Removing a defective chip requires only the detachment of the leads. A replacement chip and a replacement substrate are then inserted in the position previously maintained by the defective chip. After the entire module is tested positively, the second bonding material is melted to mechanically attach the substrates to the module. Hermetical sealing of the module is also by means of the second bonding material.

Method of manufacturing a repairable multi-chip module

Method of forming a carrierless surface mounted integrated circuit die

A pressure sensing device comprising a body member and a cap member constructed with a simple snap-fit for assembly and disassembly. The assembled device permits non-bonded contact of conductive leads with electrically conductive elements of a pressure-responsive transducer die for sensing pressure and transmitting signals generated by the force of a pressurized medium in hollow a chamber of the body member. A seal provides for functional reliability independent of thermal cycling stresses.

Snap-fit construction low cost pressure sensing device

A wet-to-wet pressure sensor package (10) having a housing (12) with a pressure sensitive semiconductor die (34) supported within a resilient mounting (44) including continuous beads (46, 48) of elastomeric adhesive on the same portion of the housing to provide a protective seal with less stress so that improved sensitivity and repeatability of the wet-to-wet pressure sensor is achieved.

Growing community of inventors

Colorado Springs, CO, United States of America

Man K Lam