Lg Innotek Co., Ltd.

Lg Innotekco., Ltd.

Man Hue Choi

Hyun Gyu Park

In Hee Cho

Min Jae Kim

Se Woong Na

Seung Kwon Hong

Bi Yi Kim

Jong Min Lee

Ji Hye Kim

Hyung Kyu Yoon

Yong Sang Cho

Se Woon Lee

Sang Won Lee

Seok Bae

Hyung Eui Lee

Yong Hwa Park

Sue Kyung Oh

A thermoelectric device according to one embodiment of the present invention includes a substrate, a first insulating layer disposed on the substrate, a second insulating layer disposed on the first insulating layer and having an area smaller than an area of the first insulating layer, a plurality of first electrodes disposed on the second insulating layer, a plurality of semiconductor structures disposed on the plurality of first electrodes, and a plurality of second electrodes disposed on the plurality of semiconductor structures, wherein the second insulating layer includes an overlapping region in which the plurality of first electrodes, the plurality of second electrodes, and the plurality of semiconductor structures overlap vertically and a protruding pattern protruding from the overlapping region toward a first outer side the substrate.

Thermoelectric device

A thermoelectric element according to an embodiment of the present invention comprises: a first substrate; an insulation layer disposed on the first substrate; a first electrode disposed on the insulation layer; a bonding layer disposed on the first electrode; a semiconductor structure disposed on the bonding layer; a second electrode disposed on the semiconductor structure; and a second substrate disposed on the second electrode, wherein the upper surface of the insulation layer includes a first concave surface vertically overlapping the first electrode, the bonding layer includes a first area vertically overlapping the first concave surface and the semiconductor structure and a second area which vertically overlaps the first concave surface and does not vertically overlap the semiconductor structure, and a void density of the first area is smaller than that of the second area.

Thermoelectric element

A thermoelectric device according to an embodiment of the present invention comprises: a first substrate; an insulating layer disposed on the first substrate; a first electrode unit disposed on the insulating layer; a first terminal electrode and a second terminal electrode disposed on the insulating layer and protruding from the first electrode unit toward the first outer side of the first substrate; a semiconductor structure disposed on the first electrode unit; a second electrode unit disposed on the semiconductor structure; and a second substrate unit disposed on the second electrode unit. The second substrate unit comprises a plurality of second substrates disposed away from one another. The first electrode unit comprises: a plurality of electrode groups respectively overlapping the plurality of second substrates vertically; and a first connection electrode connecting two different electrode groups among the plurality of electrode groups. The long side of the first connection electrode is longer than the long side of the first electrode included in the plurality of electrode groups. At least a part of the first connection electrode does not overlap the plurality of second substrates vertically.

A thermoelectric element according to one embodiment of the present disclosure includes a first metal substrate including a first through-hole formed therein, a first insulating layer disposed on the first metal substrate and including a second through-hole formed at a position corresponding to the first through-hole, a first electrode part disposed on the first insulating layer and including a plurality of first electrodes, a semiconductor structure disposed on the first electrode part, a second electrode part disposed on the semiconductor structure and including a plurality of second electrodes, a second insulating layer disposed on the second electrode part, and a second metal substrate disposed on the second insulating layer, wherein the first metal substrate includes a first outer periphery, a second outer periphery, a third outer periphery, and a fourth outer periphery which define a shape of the first metal substrate, the first outer periphery and the fourth outer periphery are opposite to each other, the second outer periphery and the third outer periphery are opposite to each other between the first outer periphery and the fourth outer periphery, the first electrode part includes a first region vertically overlapping the plurality of second electrodes, at least one of the plurality of first electrodes includes an extension portion extending toward the first outer periphery from the first region, the first through-hole is formed in an inside of the first region, and a shortest distance between the second outer periphery and a first electrode, which is closest to the second through-hole among the plurality of first electrodes, is within ±10% of a shortest distance between the second outer periphery and the extension portion.

A pressure detecting sensor according to an embodiment of the present invention comprises: a first electrode layer including a plurality of signal electrodes arranged in a first region and a plurality of wiring electrodes arranged in a second region and connected to the plurality of signal electrodes, the first electrode layer being made of a conductive fiber; an elastic dielectric layer arranged in the first region; and a second electrode layer arranged in the elastic dielectric layer, the second electrode layer being made of a conductive fiber.

Pressure detecting sensor

A pressure detection sensor according to one embodiment of the present invention includes a first electrode layer including a channel portion configured to output a sensing signal and a wiring portion connected to the channel portion, a first elastic dielectric layer disposed on the first electrode layer, a second electrode layer disposed on the first elastic dielectric layer at a position corresponding to the channel portion, a second elastic dielectric layer disposed on the second electrode layer, and a third electrode layer disposed on the second elastic dielectric layer, wherein, when a pressure is applied to the third electrode layer, capacitances of the first elastic dielectric layer and the second elastic dielectric layer are changed.

Pressure detection sensor having a plurality of dielectric layers and a plurality of electrode layers with conductive paths and wiring portions

Provided is a wireless charging board including: a coil pattern; a soft magnetic layer having one side on which the coil pattern is disposed; and a heat dissipation layer disposed on the other side of the soft magnetic layer and including a first uneven pattern portion.

Wireless charging substrate and device

A light source circuit unit and a lighting device including the light source circuit unit that are configured such that a bent-type metal substrate is formed on an upper surface of the printed circuit board so that the occurrence of a defect due to circuit damage at a bent part upon bending the substrate can be prevented, and slimness and a heat-dissipation property of a device can be improved. The light source circuit board includes: a substrate having a first part with at least one opening portion, and a second part bent from the first part; a printed circuit board on one surface of the substrate; and a light source element mounted to the printed circuit board and inserted into the opening portion, the light source element emitting light to an opposing side of the substrate.

Light source circuit unit and lighting device comprising same

A circuit board, and a lighting device and board housing module having the circuit board. The circuit board includes a support substrate having a first region and a second region bent from the first region, light emitting devices disposed on the first region, and a protective support portion protruding more than the light emitting devices from the support substrate of the first region.

Circuit board and lighting device and board housing module having the circiut board

Provided is a lighting unit, including: a support substrate; a light guide plate for guiding light generated from a light source; and a first stopper fixed to the support substrate and configured to support the light guide plate.

Lighting unit

Provided is a circuit board including: a supporting substrate including a first region to which light emitting elements are mounted and a second region extending to be bent from the first region, wherein the second region comprises: a connector mounting portion to which a connector for supplying an electric current to the light emitting elements is mounted; and a non-mounting portion of a connector separated and spaced apart from the connector mounting portion, wherein the connector mounting portion is formed lower than the non-mounting portion of the connector.

Circuit board and lighting device having the circuit board

Provided is a circuit board including: a support substrate; a plurality of light emitting devices mounted on the support substrate; and a device protection portion surrounding one of the light emitting devices, or three or more surfaces of the plurality of light emitting devices.

Provided are a lighting device and a flat panel display having the lighting device, the lighting device, including: a support substrate; a circuit board on the support substrate; light emitting devices mounted on the circuit board; and a light guide plate having a protruding portion protruding to a remaining region except for a region in which the light emitting devices are disposed.

Lighting device and flat panel display having the lighting device

Provided is a printed circuit board, including: a support substrate including a first region in which light emitting elements are mount, a second region extending from the first region, and a bending portion between the first region and the second region, an insulating substrate on the support substrate, wiring portions on the insulating substrate, and a protective layer on the wiring portions.

Printed circuit board

Provided is a circuit board including: a support substrate including a first region and a second region extending to be bent from the first region; light emitting devices mounted to the first region of the support substrate; and a bending portion bent between the first region and the second region, wherein the bending portion comprises: an interconnection line arrangement portion that crosses an interconnection line; and an interconnection line protection portion disposed on the periphery of the interconnection line, wherein the interconnection line protection portion protrudes more than the interconnection line arrangement portion.

Growing community of inventors

Seoul, South Korea

Man Hue Choi