Freescale Semiconductor,inc.

Motorola Corporation

Man Hon Cheng

Wai Wong Chow

Wai Keung Ho

Fei Ying Wong

An image sensor device includes a QFN type leadframe having a central die attach flag and an outer bonding pad area having a plurality of bonding pads. A sensor IC is attached to the flag. The IC has a first surface with an active area and a peripheral bonding pad area that includes bonding pads. Wires are wirebonded to respective ones of the IC bonding pads and corresponding ones of the leadframe bonding pads, thereby electrically connecting the IC and the leadframe. Stud bumps are formed on the first surface of the IC and a transparent cover is disposed over the IC active area and resting on the stud bumps. The cover allows light to pass therethrough onto the IC active area. A mold compound is formed over the leadframe, wirebonds and a peripheral portion of the cover.

Optical sensor package

A semiconductor deviceincludes a base carrier, an adhesive material layerand an integrated circuit die. The base carrierhas a top side and a bottom side, the top side having a central area for receiving the dieand a peripheral area surrounding the central area. The adhesive material layeris disposed on the top side of the base carrier in an 'X' shaped pattern. The 'X' shaped pattern includes two bisecting lines. The two bisecting lines extend well beyond the central area and into the peripheral area of the base carrier top surface. The dieis attached to the base carrierwith the adhesive material layerat the central area. Even after attachment of the die, the adhesive materialextends well beyond the dieand the central area into the peripheral area.

Method of attaching a die to a substrate

A leadframe () for a semiconductor device includes a paddle ring () having an inner perimeter (), an outer perimeter (), and a cavity () located within the inner perimeter () for receiving an integrated circuit die (). A first row of terminals () surrounds the outer perimeter () and a second row of terminals () surrounds the first row of terminals (). Each of the terminals of the first row of terminals () is individually connected to the paddle ring () and each of the terminals of the second row of terminals () is connected to one side of a connection bar (), which is connected to one of the terminals of the first row () or to the paddle ring ().

Multi-row leadframe

A semiconductor device includes a base carrier , an adhesive material layer and an integrated circuit die . The base carrier has a top side and a bottom side, the top side having a central area for receiving the die and a peripheral area surrounding the central area. The adhesive material layer is disposed on the top side of the base carrier in an &ldquo;X&rdquo; shaped pattern. The &ldquo;X&rdquo; shaped pattern includes two bisecting lines. The two bisecting lines extend well beyond the central area and into the peripheral area of the base carrier top surface. The die is attached to the base carrier with the adhesive material layer at the central area. Even after attachment of the die , the adhesive material extends well beyond the die and the central area into the peripheral area.

Growing community of inventors

Hong Kong, China

Man Hon Cheng