Asm Assembly Automation Limited

Man Chung Ng

Wing Fai Lam

Keung Chau

Chung Wai Ku

Wai Lik Chan

Ching Yuen To

Plastic container

An array of semiconductor components, comprising a first plurality of semiconductor components and a second plurality of semiconductor components held on a carrier, is bonded onto one or more substrates. The first plurality of semiconductor components is first located for pick-up by a transfer device, and each semiconductor component comprised in the first plurality of semiconductor components is picked up with the transfer device and is bonded onto a respective bonding position on the one or more substrates. After the first plurality of semiconductor components have been picked up and bonded, the carrier is rotated and the second plurality of semiconductor components is located for pick-up by the transfer device. Thereafter, each semiconductor component comprised in the second plurality of semiconductor components is picked up with the transfer device and is bonded onto a respective bonding position on the one or more substrates.

Die bonding method utilizing rotary wafer table

Multiple types of adhesives contained in separate containers are transferred from a supply of adhesives to a substrate. A first stamping pin is moved to a position of a first container containing a first adhesive, and the first adhesive is transferred with the first stamping pin from the first container to the substrate before bonding a first die onto the first adhesive. A second stamping pin is then moved to a position of a second container containing a second adhesive, and the second adhesive is transferred with the second stamping pin from the second container to the substrate before bonding a second die onto the second adhesive.

Transfer apparatus for multiple adhesives

A bonding apparatus for conducting bonding on substrates comprises a first substrate holding device for clamping a first substrate during bonding and a second substrate holding device for clamping a second substrate during bonding. Each substrate holding device is operative to move sequentially between its respective onloading position for receiving substrates, bonding position whereat substrates are bonded and offloading position whereat bonded substrates are removed from the substrate holding device. A first actuator is operative to drive the first substrate holding device along a first feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a first return path. A second actuator is operative to drive the second substrate holding device along a second feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a second return path.

Apparatus for transporting substrates for bonding

Multiple connector clips are bondable onto an electronic device simultaneously with a rotary clip bonder, wherein a pick head comprising a plurality of collets is positioned at a clip supply channel. A plurality of connector clips are picked up from the clip supply channel in a fixed orientation with the pick head and are conveyed to a clip bonding area where the electronic device is located. The pick head is rotated with a rotary motor about a rotational axis passing through a shaft connecting the rotary motor to the pick head in order to change the orientation of the plurality of connector clips, before the connector clips are bonded at the clip bonding area.

Growing community of inventors

Hong Kong, China

Man Chung Ng