Jcet Group Co., Ltd.

Man Bao

Yi Liu

Zhen Gong

The present invention discloses an electromagnetic shielding package structure and a package method thereof. The package method for the electromagnetic shielding package structure includes: providing a base plate of a copper raw material, and forming a transition layer after two photoresist film operations, wherein the transition layer includes conductive connecting ribs connecting functional pins to an outer side wall; mounting a chip. performing first encapsulating, and etching off the conductive connecting ribs connecting the functional pins to the outer side wall; performing secondary encapsulating on an etched part; and after forming a singulated body by cutting, blocking the connection between the functional pins and the outer side wall by a plastic package material, and only reserving grounding pins to be connected to the outer side wall through the conductive connecting ribs. In this way, after a metal protective layer is sputtered, only the conductive connecting ribs and the shielding cover are enabled to be conducted to form the electromagnetic shielding package structure. According to the present invention, the performance of the package is improved, and the manufacturing cost and the use cost are reduced.

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Wuxi, China

Man Bao