Hosiden Corporation

Hosiden Electronics Co., Ltd.

Sanyo Electric Co., Ltd.

Tokyo Electron Limited

Mitsubishi Denki Kabushiki Kaisha

Mamoru Yasuda

Yoshiaki Ohbayashi

Shinichi Saeki

Toshiyuki Ohkoda

Shigeaki Okawa

Shuji Osawa

Takao Kawamura

Kenichi Kagawa

Yasuo Sugimori

Masatsugu Komai

Hitoshi Toda

Takahisa Ohtsuji

Takanobu Takeuchi

Junichi Tamamura

Kazuo Ono

Yasuhiro Shigeno

Shuzo Isogami

Motomi Hosoda

Kouji Nishikawa

Toshirou Izuchi

Kiyoshi Ohta

Naoki Toyoda

A sound detecting mechanism capable of forming a diaphragm and a back electrode on a substrate by a simple process includes acoustic holes corresponding to perforations formed on a front surface of a substrate. A second protective film, a sacrificial layer and a metal film are laminated on the front surface in a portion corresponding to the acoustic holes. The substrate is etched from the back surface thereof to a depth reaching the acoustic holes to form an acoustic opening. Subsequently, by effecting an etching from the back surface of the substrate through the acoustic holes, the sacrificial layer is removed and a void area is formed between the diaphragm made of the metal film, the substrate and the formed perforations. The sacrificial layer that remains after the etching is used as a spacer for maintaining a gap between the back electrode and the diaphragm.

Sound detecting mechanism

A vibration sensor capable of preventing a diaphragm electrode from being damaged without lowering sensitivity as well as realizing a satisfactory assembling process. The vibration sensor includes a fixed electrode, and a diaphragm electrodehaving a weight memberattached to a membrane surface facing away from the fixed electrodeand fixedly supported at peripheries thereof, the vibration sensor being capable of outputting variation of capacitance between the fixed electrode and the diaphragm electrode as vibration signals. The vibration sensor further includes projecting portionsformed on parts of an end portion of the weight memberto project along the direction of the membrane surface and spaced from the membrane surface of the diaphragm electrode, and a restricting memberfor contacting the projecting portionsof the weight memberdisplaced along the direction of the membrane surface of the diaphragm electrode, thereby to restrict displacement of the weight member

Vibration sensor

A sound detecting mechanism is provided which forms a diaphragm with a required thickness by thickness control and yet restrains distortion of the diaphragm to provide high sensitivity. The sound detecting mechanism comprises a pair of electrodes forming a capacitor on a substrate A in which one of the electrodes is a back electrode C forming perforations Ca therein corresponding to acoustic holes and the other of the electrodes is a diaphragm B. The diaphragm B is mounted on the substrate A while the back electrode C is mounted in a position opposed to the diaphragm B across a void F to be supported by the substrate A, the back electrode C being formed by polycrystal silicon of 5 &#x3bc;m to 20 &#x3bc;m in thickness.

An electret-condenser microphone according to the present invention includes a vibrating diaphragm and a back electrode which compose a condenser; a cylindrical case which houses the vibrating diaphragm and the back electrode; a circuit board which is housed in an opening of the cylindrical case, is fixed to the opening by crimping a crimp edge formed by bending an opening end of the cylindrical case inward, and covers the opening; and a substrate fastened to an outer surface of the circuit board. A circular pattern and annular pattern are formed on the outer surface of the circuit board and a circular pattern and annular pattern are formed on that surface of the substrate which is farther from the circuit board. The circular pattern and annular pattern are connected with the circular pattern and annular pattern via thru-holes in the substrate, and that surface of the substrate on which and are formed serves as a reflow-soldering surface.

Electret-condenser microphone

The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensorand a casefor accommodating the acoustic sensor, the acoustic sensorhas a semiconductor chipforming necessary electronic circuitsA toC, and opening a through holeaway from the electronic circuitsA toC, an electrode layerformed on the surface of the semiconductor chipaway from the through hole, an electret memberlaminated away from part of the electrode layerand through hole, and a diaphragmprovided with a spacingto the electret member, in which the electrode layerexposed from the electret memberis connected to the electrodeof the electronic circuitA through the case(FIG.).

Manufacturing method of acoustic sensor

A semiconductor electret capacitor microphone includes a vibration membrane, a semiconductor chip on which are formed a necessary electronic circuit, a fixed electrode, a spacer for preserving a predetermined space between the fixed electrode and the vibration membrane, and a case for enclosing the semiconductor chip and the vibration membrane in such a configuration that the fixed electrode is connected to the ground and the vibration membrane is connected to an input electrode of the semiconductor chip.

Semiconductor electret capacitor microphone

First, a stationary electrode layer is formed over a semiconductor substrate and an integrated network is composed in a circuit element area around the stationary electrode layer by electrode wiring forming each circuit element. A spacer is arranged on a passivation film in plural places. A dummy island is formed in an area between the circuit element area and the stationary electrode layer area. Supply potential Vcc is applied to the dummy island and ground potential GND is applied to a P -type separated area.

Semiconductor device

A stationary electrode layer is formed on a semiconductor substrate and a vibrating diaphragm is disposed on spacers The vibrating diaphragm is placed so as to protrude from an end of the semiconductor substrate and terminal pads to are placed with being exposed from the vibrating diaphragm

Semiconductor device and semiconductor electret condenser microphone

A stationary electrode layer is formed on a semiconductor substrate , and a vibrating diaphragm is disposed on spacers . The vibrating diaphragm is placed so as to protrude from an end of the semiconductor substrate , and terminal pads to are placed with being exposed from the vibrating diaphragm

Method of producing semiconductor electret condenser microphone

A fixed electrode layer is formed on a semiconductor substrate . A vibrating film is formed on the fixed electrode layer through a spacer . Since the vibrating film is a light-permeable film, in order to prevent the malfunction of an electronic circuit formed in the semiconductor substrate by incident light, the region where the electronic circuit is to be formed is covered with a shield metal

An electret film is formed on the rear side of a front face plate of a cylindrical capsule made of aluminum . Closely in spaced opposition thereto, an electrically conductive diaphragm is held by an electrically conductive holding member. A wiring board provided behind the holding member closes the rear end of the capsule. The rear end of the capsule is bent on the rear periphery of the wiring board, and calked thereat. In the capsule, an impedance conversion IC device is connected to the electrically conductive holding member and the wiring board.

Electret condenser microphone unit

A one-piece diaphragm unit for a condenser microphone fabricated by gripping a diaphragm with predetermined tension, between metallic first and second rings, and electron beam welding the two rings and diaphragm together. Preferably, one of the first and second rings is provided with an edge flange which is raised about its inner periphery and extends inwardly of the other ring, biasing thereinto the diaphragm. When the diaphragm unit is built in the condenser microphone, a support plate of an insulating material is disposed in engagement with the first ring.

Method of fabricating the diaphragm unit of a condenser microphone by

Diaphragm unit of a condenser microphone, a method of fabricating the

A condenser microphone in which a back electrode, disposed oppositely to the rear surface of a diaphragm, and a circuit assembling plate disposed oppositely to the rear surface of the back electrode, are held in a holder. Electronic circuit elements are attached to only one surface of the circuit assembling plate, and the other surface thereof is faced toward the rear surface of the back electrode with a predetermined distance provided therebetween. A back chamber, defined by a space between the back electrode and the circuit assembling plate, and enclosed by the holder improves the characteristics of microphone frequency response.

Growing community of inventors

Osaka, Japan

Mamoru Yasuda