Rohm Co., Ltd.

Mamoru Yamagami

Kenji Fujii

Isamu Nishimura

Shoji Yasunaga

Motoharu Haga

Yasumasa Kasuya

Yasuhiro Fuwa

Naoki Kinoshita

Yusuke Harada

Chojiro Kuriyama

Taro Nishioka

Hideaki Yanagida

Makoto Aoyama

Motohiro Toyonaga

Takafumi Okada

A semiconductor device includes a semiconductor chip, a plurality of leads that each includes a lead body portion which has a mounting portion which includes an upper surface whereon a semiconductor chip is bonded, and a lead connecting portion for external connection which projects downward from a lower surface of the lead body portion, a first sealing resin that seals a space that is defined by each lead body portion and each lead connecting portion of the plurality of leads in a region below the upper surface of each lead body portion of the plurality of leads, and a second sealing resin that seals the semiconductor chip in a region above the upper surface of each lead body portion of the plurality of leads.

Semiconductor package with plurality of leads and sealing resin

A semiconductor device includes a substrate having a main surface, a plurality of first wirings, each having a first embedded part embedded in the substrate and exposed from the main surface, and a mounted part which is in contact with the main surface and is connected to the first embedded part, a semiconductor element having an element rear surface and a plurality of electrodes bonded to the mounted parts, a plurality of second wirings, each having a second embedded part embedded in the substrate and exposed from the main surface and a columnar part protruding from the second embedded part in the thickness direction, and being located outward from the semiconductor element as viewed in the thickness direction; and a passive element located on the side facing the main surface in the thickness direction more than the semiconductor element, and electrically connected to the plurality of second wirings.

Semiconductor device including passive element

Semiconductor device having distinguishable electrodes

A semiconductor device includes a semiconductor element, an internal electrode connected to the semiconductor element, a sealing resin covering the semiconductor element and a portion of the internal electrode, and an external electrode exposed from the sealing resin and connected to the internal electrode. The internal electrode includes a wiring layer and a columnar portion, where the wiring layer has a wiring layer front surface facing the back surface of the semiconductor element and a wiring layer back surface facing opposite from the wiring layer front surface in the thickness direction. The columnar portion protrudes in the thickness direction from the wiring layer front surface. The columnar portion has an exposed side surface facing in a direction perpendicular to the thickness direction. The external electrode includes a first cover portion covering the exposed side surface.

Method of manufacturing semiconductor device with internal and external electrode

A semiconductor device includes a semiconductor chip, a plurality of leads that each includes a lead body portion which has amounting portion which includes an upper surface whereon a semiconductor chip is bonded, and a lead connecting portion for external connection which projects downward from a lower surface of the lead body portion, a first sealing resin that seals a space that is defined by each lead body portion and each lead connecting portion of the plurality of leads in a region below the upper surface of each lead body portion of the plurality of leads, and a second sealing resin that seals the semiconductor chip in a region above the upper surface of each lead body portion of the plurality of leads.

Semiconductor device

Semiconductor device with internal and external electrode and method of manufacturing

The present invention provides a semiconductor device capable of being miniaturized and preventing reduction of mountability to a wiring substrate. The semiconductor device includes a conductive support having a support surface and a mounting surface facing opposite sides in a thickness direction z, and an end surface intersecting with the mounting surface and facing outside; a semiconductor element having an element back surface facing the support surface and an electrode formed on the element back surface, in which the electrode is connected to the support surface; and an external terminal conducted to the mounting surface and exposed to the outside; wherein the external terminal includes a Ni layer having P and an Au layer, and respectively connected to and laminated with at least one portion of each of the mounting surface and the end surface.

Semiconductor device with external terminal

A multi-chip module includes a plurality of chip parts with each chip part having an electrode, a sealing resin for sealing the plurality of chip parts, and an external connection terminal secured to the sealing resin so as to be exposed from the outer surface of the sealing resin and electrically connected to the electrode of at least one of the chip parts.

Multi-chip module and method for manufacturing same

[Object] A semiconductor device is configured to release heat from semiconductor chips more efficiently. [Means for Solution] A semiconductor device includes: a die padwhich has a die pad main surfaceand a die pad rear surface; a semiconductor chipmounted on the die pad main surface; a sealing resin portionformed with a recessfor exposure of the die pad rear surfaceand covering the die padand the semiconductor chip; and a heat releasing layerdisposed in the recess. The recesshas a recess grooveoutside the die padin a direction in which the die pad rear surfaceextends, and the recess grooveis closer to the die pad main surfacethan to the die pad rear surface. The heat releasing layerhas a junction layer which is in contact with the die pad rear surfaceand having part thereof filling the recess groove

An inventive semiconductor device includes: a semiconductor chip including an integrated circuit; a plurality of electrode pads provided on the semiconductor chip and connected to the integrated circuit; a rewiring to which the electrode pads are electrically connected together, the rewiring being exposed on an outermost surface of the semiconductor chip and having an exposed surface area greater than the total area of the electrode pads; and a resin package which seals the semiconductor chip.

An electronic component includes a substrate including a first principal surface, a second principal surface positioned on a side opposite to the first principal surface, a first side surface that connects the first principal surface and the second principal surface and that extends along a first direction, a second side surface that connects the first principal surface and the second principal surface and that extends along a second direction intersecting the first direction, and a corner portion that connects the first side surface and the second side surface and that has a curved surface curved outwardly, and a chip arranged at the first principal surface of the substrate.

Electronic component and manufacturing method thereof

A semiconductor device includes a semiconductor chip, a terminal layer, an insulation layer with an opening, a protection layer with an opening, an inner conductive member, an outer conductive member, and a conductive bonding member. The insulation layer includes a first insulation layer, and a second insulation layer opposite to the functional surface of the chip with respect to the first insulation layer. The second insulation layer includes a shield portion overlapping with the terminal layer in plan view, and a retracted portion not overlapping with the terminal layer in plan view. A back surface of the retracted portion of the second insulation layer is more distant from the functional surface in a z-direction than is the main surface of the terminal layer that is opposite to the functional surface.

Semiconductor device with insulation layers

The present invention provides a semiconductor device and a method for manufacturing a semiconductor device. The method comprises: Preparing a semiconductor chipwith a first electrode layerformed on an element-forming surface. Prepared a support memberhaving a conductorformed on a pattern-forming surface. The first electrode layeris bonded to the conductorby a solder, and thus the semiconductor chipis fixed on the support member. While the semiconductor chipis fixed on the support member, the semiconductor chipis coated by the sealing resinto form a sealing structure. By removing the support memberfrom the sealing structure, the conductorformed on the support memberis transferred to the sealing structure. The conductortransferred to the sealing structureis an external electrode exposed from the sealing structure

Growing community of inventors

Kyoto, Japan

Mamoru Yamagami