Mitsubishi Electric Corporation

Mamoru Togami

Hiroyuki Nakamura

Teruaki Nagahara

Kosuke Yamaguchi

Kazuhiro Kawahara

Toshitaka Sekine

Toshihiko Miyauchi

Shota O

A semiconductor device includes: a package to seal a semiconductor element; a lead frame having one end portion connected to the semiconductor element and the other end portion protruding from a side surface of the package; a plurality of threaded holes formed in the package to enable the package to be fixed to the substrate; and a resin part capable of closing each of the plurality of threaded holes. A type name of the semiconductor device is represented by open and closed states of the respective threaded holes.

Semiconductor device having at least one resin part that closes one or more corresponding ones of a plurality of threaded holes

The invention includes an output circuit that outputs an operation signal to a direct current breaker that interrupts a direct current main circuit, and a processor that samples, at predetermined time intervals, digital data wherein a value detected by a direct current transformer that detects a current of the direct current main circuit is measured as an input current, calculates a computed measurement value to be output to a display circuit, and outputs control information for executing a protection process using measurement value sampling data obtained by the sampling to the output circuit, and executes a protection process of the direct current main circuit at every sampling.

Digital relay

Growing community of inventors

Tokyo, Japan

Mamoru Togami