Sony Corporation

Kabushiki Kaisha Toshiba

Mamoru Sasaki

Hideo Suyama

Chiaki Takubo

Takuji Shibata

Akio Takada

Norio Saito

Shuichi Haga

Hiroshi Tazawa

Yoshiharu Tsuboi

Kenichiro Tsunewaki

Jin Sato

Yoichi Hiruta

Nobuhiro Sugawara

Chizuru Ohshima

Mikiya Kurosu

In a magnetoresistance thin film magnetic head, a bias conductor and a magnetoresistive magnetic sensing section are electrically connected to each other in series. Further, the bias conductor (7) is formed in such a pattern as to have a width and distance from a magnetic recording medium facing surface which become larger as it is away from a portion transversing the magnetoresistive magnetic sensing section.

Magnetoresistance thin film magnetic head having reduced terminal count;

A magneto-resistance effect magnetic head having a uniform bias distribution and adapted for avoiding shorting between a magneto-resistance device and a bias conductor wherein a magneto-resistance device 5 and a bias conductor 6 for applying a bias magnetic field to the magneto-resistance device 5 are interposed between a lower shielding magnetic member 1 and an upper shielding magnetic member 2. The bias conductor is embedded in a groove formed in the shielding magnetic member provided on the opposite side of forward and rear electrodes with respect to the magneto-resistance effect device.

Magneto-resistance effect head with insulated bias conductor embedded in

In bonding the connecting electrodes of adjacent semiconductor chips to each other, a solder layer shaped like a bump is formed on that portion of the connecting electrode which is positioned on the upper surface of the semiconductor chip. The semiconductor chips are positioned close to each other such that the connecting electrodes of these chips are aligned with each other. Then, the solder layer is melted to cause the molten solder to flow along the entire region of the connecting electrode and, thus, to achieve mutual bonding of the connecting electrodes in the entire regions including the upper surface region and the side surface region. The method permits stably bonding semiconductor chips to each other with a high bonding strength, leading to an improved reliability of electric connection in the bonded portion.

Method of manufacturing a semiconductor device

A semiconductor assembly comprises first and second containers which contain respective semiconductor chips and are stacked one over another. First and second external leads extending from the insides of the respective containers to outside thereof are bent so as to be connected to each other. The first and the second containers may be provided at corresponding positions with a recess and a projection to be engaged each other for positional alignment. There may be provided first and second heat radiating plates extending from the insides of the respective containers to outside thereof are bent so as to be connected to each other.

Semiconductor assembly having laminated semiconductor devices

A magneto-resistance effect type magnetic head incorporates a grounded conductive layer, a second thin film magnetic core and an MR sensing part, the conductive layer being located near the thin film magnetic core, the layer and the core being electrically connected. The conductive layer is further connected electrically to an electrode of the MR sensing part, the electrode facing an air bearing surface. This setup protects the MR sensing part from static electricity destruction, thus providing a magneto-resistance effect type magnetic head of high reliability.

Magneto-resistance effect magnetic head with static electricity

A magneto-resistance effect type thin film magnetic head which does not produce significant Barkhausen noises and has stabilized characteristics even where the track width is smaller than, for example, 10 .mu.m. The magnetic head comprises a base member, a lower layer thin film magnetic core and an upper layer thin film magnetic core layered on the base member in such a manner that a magnetic gap is formed between front ends thereof, the gap being open to an opposing face of the magnetic head which is in contact with or opposed to a magnetic record medium, and a magneto-resistance effect magnetic sensing section disposed in the magnetic gap between the lower and upper layer thin film magnetic cores. The front end of the lower layer thin film magnetic core which defines the magnetic gap has a width selected to be smaller than the width of the front end of the upper layer thin film magnetic core which defines the magnetic gap so as to define a track width of the magnetic gap.

Growing community of inventors

Tokyo, Japan

Mamoru Sasaki