Sharp Kabushiki Kaisha Corporation

Mamoru Okanishi

Toshihiko Yoshida

Hideki Ichikawa

Terumitsu Santo

Masao Yamazaki

Junichi Naemura

There is provided is a semiconductor laser device capable of simplifying fabricating processes with a simple construction and easily mounting two semiconductor laser elements and a monitoring PD on a compact package and a wire bonding method for the semiconductor laser device. There are provided a stem provided with a plurality of lead pins through , a sub-mount that is die-bonded onto the stem and has its surface formed integrally with a monitoring PD and two semiconductor laser elements and that are die-bonded onto the sub-mount and have emission light monitored by the monitoring PD . A first bonding surface i.e. anode electrode of the monitoring PD and a second bonding surface i.e. end surface of a lead pin that is approximately perpendicular to the first bonding surface are wire-bonded to each other.

Semiconductor laser device and wire bonding method capable of easily performing reliable wire bonding

A semiconductor chip position detector including a transparent film on which semiconductor chips are placed, a film table on which the film is placed, a light source, optical fiber cables provided in the vicinity of the film table, by which light beams from the light source are radiated onto the semiconductor chips through the film having the semiconductor chips placed thereon, and a position recognition device provided above the film for recognizing the positions of the semiconductor chips based on shadow shapes of the semiconductor chips generated by the radiated light.

Growing community of inventors

Shiki-gun, Japan

Mamoru Okanishi