Murata Manufacturing Co., Ltd.

Mamoru Ogawa

Jiro Inoue

Takashi Noji

Hiroaki Kaida

Satoshi Ishino

Toshio Nishimura

Shoichi Kawabata

Michinobu Maesaka

Toshiyuki Baba

Kenji Kubota

Tsuyoshi Saito

Toshihiko Unami

Tetsuo Takeshima

Shigemasa Kusabiraki

Takeshi Yamazaki

Takashi Mizuguchi

Miyuki Mizukami

Toshiyuki Yasugi

Tatsuya Todo

Keiichi Inoue

Yuji Fujino

Takashi Yoshikawa

A method of producing a piezoeIectric resonator includes the steps of forming first to third internal electrodes by printing an electrically conductive paste onto a green sheet, punching out portions of the green sheet having the first to third internal electrodes formed thereon, so that at least three types of green sheets are punched out with a location of the internal electrode serving as a reference location, in which the first sheet is punched out by shifting a punching location by a first shift amount in a first direction with respect to the reference location, the second sheet is punched out by shifting a punching location by the first shift amount in a direction opposite to the first direction, and the third sheet is punched out at the reference location, forming a layered body by stacking the punched out green sheets, and forming a unit by cutting the layered body.

Method of producing multilayer piezoelectric resonator

A method of forming an electronic component includes laminating ceramic green sheets on a support film to obtain a ceramic green sheet laminate, forming through holes through the ceramic green sheet laminate at positions where via hole electrodes are to be located, applying conductive material into the through holes so as to fill the through holes and so as to be located on the upper surface of the ceramic green sheet laminate to form via hole electrodes, and sintering the ceramic green sheet laminate to form a substrate and so as to form protruding portions of the via hole electrodes which protrude upward from the upper surface of the substrate.

Method of forming an electronic component located on a surface of a package member with a space therebetween

An electronic component includes a package member; a via hole electrode extending through the package member and protruding from a first surface of the package member; an electronic component located on the first surface of the package member with a space located between the package member and the electronic component. The space between the electronic component and the first surface of the package member is provided by a protruding portion of the via hole electrode which extends from the surface of the package member and a joining member joining the electronic component with the via hole electrode.

Apparatus having an electronic component located on a surface of a package member with a space therebetween

A piezoelectric resonator having a small spurious resonance and a large difference .DELTA.F between the resonant frequency and the antiresonant frequency has a compact size and an external electrode has a structure which prevents damage or breaking of the external electrode. The piezoelectric resonator has a substantially rectangular-parallelepiped base member which includes a plurality of laminated piezoelectric layers. A middle portion of the piezoelectric layers is polarized in opposite directions relative to each other. On main surfaces of the middle part of the piezoelectric layers, first and second groups of inner electrodes and are exposed alternately at both side surfaces of the base member. On both side surfaces of the base member, first and second external electrodes are arranged so as to alternately connect to the first and second groups of inner electrodes.

Piezoelectric resonator and electronic component including same

A piezoelectric resonator includes a piezoelectric resonator element vibrating in a longitudinal vibration mode and having a mounting surface, wherein a resin material is provided on the mounting surface of the piezoelectric resonator element, and the resin material has a hardness of about 0 to about 50 in units defined in the JIS-A standards and/or an elastic modulus of about 0.1 to 10 MPa.

A highly reliable multi-layer ceramic electronic part in which is compact, in which cracks tend not to occur in the ceramic element even in cases where it is handled in bulk by a chip mounting device. A plurality of electrodes (internal electrodes) are disposed within a ceramic element whose length L.ltoreq.1.0 mm, height H.ltoreq.0.5 mm and width W.ltoreq.0.5 mm. The thickness t.sub.1 of a ceramic outer layer portion of the multi-layer ceramic electronic part, is 0.15 mm or less. The thickness of the ceramic outer layer portion t.sub.1 and the thickness t.sub.2 of the portion where the internal electrodes are disposed have the relationship 1/4 t.sub.2 .ltoreq.t.sub.1.ltoreq.1/3 t.sub.2.

Multi-layer ceramic electronic part

In a plating apparatus 10, a known control signal for detection is supplied from a computer 50 to a motor 13 in advance; the motor 13 is rotated at a variable speed within a predetermined range; and the displacement of a basket 18 is detected by a displacement sensor 30 to obtain displacement characteristics data. Next, the computer 50 controls the rotating operation of the motor 13 through a motor controller 60 to put the basket 18 in a desired optimum state of vibration using the obtained displacement characteristics data and data of an optimum amplitude for the plating process obtained in advance.

Vibrational processing apparatus and method

A method for fabricating ceramic electronic parts allows external electrodes to be baked onto the electronic parts without overlaying powder on the sagger. An adhesive material layer is provided on a surface of a sagger on which electronic parts are placed. The sagger is inserted into a firing oven with the electronic parts adhesively fixed onto the adhesive material layer, whereby the external electrodes of the electronic parts are baked. The adhesive layer burns away during the firing process. The method including such steps eliminates the need of overlaying powder onto the sagger, so that no powder sticks to the external electrodes after baking, so that the process of removing powder is no longer necessitated.

Method for fabricating ceramic electronic parts

A highly reliable ceramic electronic part that can be reliably attracted by a vacuum attraction type nozzle without inviting cracks or breaks. The ceramic electronic part comprises a ceramic body and external electrodes attached around the end surfaces of the ceramic body. The ceramic body has a length (L).ltoreq.1.0 mm, a height (H).ltoreq.0.5 mm, and a width.ltoreq.0.5 mm. The external electrodes have rounded portions extending from the end surfaces of the ceramic body to their adjacent outer surfaces of the ceramic body. The thickness t of these rounded portions is set so that t.ltoreq.10 .mu.m and t.ltoreq.H/30. The thickness t of these rounded portions may further be set so that t.ltoreq.W/30.

Ceramic electronic part

According to a method of manufacturing a multilayer capacitor, the accuracy of the capacitance of the capacitor is improved. After internal electrodes 2 are printed on ceramic green sheets 1, the area of the internal electrodes on all of the ceramic green sheets is measured on a block-by-block basis. The number of the green sheets having main patterns provided thereon to be stacked to obtain a set capacitance for the capacitor is obtained from the area of the electrodes. A predetermined number of sheets are stacked to create a block. Thus, the accuracy of the capacitance of the multilayer capacitors is improved.

Method of manufacturing a multilayer capacitor

In order to suppress deviation of conductor films and to effectively remove voids when a laminate obtained by stacking a plurality of ceramic green sheets provided with the conductor films is pressed in the direction of stacking, a pressing step is divided into a preliminary pressing step and a main pressing step which is carried out subsequently thereto. In the preliminary pressing step, a temperature of at least 40.degree. C. is applied to the laminate of the plurality of ceramic green sheets by a heater, while a press head is driven toward the laminate, thereby applying a pressure of not more than 50 kgf/cm.sup.2 to the same. The preliminary pressing step may be further divided into first and second preliminary pressing steps. In the first preliminary pressing step, the laminate is pressed by a press surface having projections on regions corresponding to those provided with the conductor films, so that voids are removed from the regions provided with the conductor films. In the second preliminary step, the laminate is pressed by a press surface having projections on regions corresponding to those provided with no conductor films, so that at least the regions provided with no conductor films are pressed.

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Moriyama, Japan

Mamoru Ogawa