Tohoku University

Mamoru Mori

Shuji Tanaka

Masayoshi Esashi

Sakae Matsuzaki

By forming a metal layeron at least one of a connecting electrodeof a first substrateand a connecting electrodeof a second substrate, placing the first substrateand the second substratetogether in order that the connecting electrodeand the connecting electrodeface opposite to each other via the metal layer, increasing temperature up to anodic bonding temperature, and applying DC voltage between the first substrateand the second substratewhile maintaining that temperature, the first substrateand the second substrateare anodically bonded, and at the same time by melting the metal layer, the connecting electrodeand the connecting electrodeare electrically connected. The method achieves anodic bonding of substrates with high yield and at the same time establishes wiring connection, effective for packaging.

Growing community of inventors

Ishikawa, Japan

Mamoru Mori