Hitachi, Ltd.

Hitachi Computer Engineering Co., Ltd.

Mamoru Kobayashi

Hideaki Sasaki

Shinichi Kazui

Yutaka Hashimoto

Yasuhiko Hara

Kazuo Kato

Akio Kojima

Yoshihisa Tsuji

Sigeru Ninomiya

Ryohei Satoh

Kaoru Katayama

Tateoki Miyauchi

Mitugu Shirai

Koichi Karasaki

Hideyuki Fukasawa

Mitsukiyo Tani

Kanji Ishige

Tetsuhiro Yokoyama

Masahiro Wanami

Yashuhiko Kawakami

A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be good.

Solder bump measuring method and apparatus

A method of measuring solder bumps formed on a substrate mounting a semiconductor element thereon includes mounting a work to be measured on a work position mechanism, and scanning the work by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be satisfactory.

A method of supplying parts in a system for assembling a printed circuit board by mounting the parts on a substrate at corresponding predetermined positions thereof. One or more kinds of substrates and at least one group of parts, to be mounted on the corresponding substrates, are introduced into the system lot by lot. The introduced parts on one or more previously prepared parts containers are placed so as to correspond to the substrates on which the individual parts are to be mounted, thereby providing one or more sets of the parts, each set corresponding to a respective one of the substrates. The sets of parts are supplied to a parts mounting station of the system.

Printed circuit board assembling system

A production management system for managing production by using a plurality of working devices arranged in the production processes includes a host management device for managing control data necessary for producing a product, working device managing terminals provided in correspondence with working devices used for the production for processing information necessary in managing the working devices, and a terminal information management device for integrally managing information items which are processed at individual working device management terminals. Each working device management terminal is connected with the terminal information management device through a network to enable transfer of information between each working device terminal and the terminal information management device and between individual working device terminals. Further, working device terminals which require transfer of control data held by the terminal information management device and the host management device are connected to the host management device to enable exchanges of information between the connected devices.

Computer-integrated manufacturing system and method

A metal layer other than gold is formed on a ceramic substrate, a gold layer is further formed on said metal layer, and then a high density beam is applied to the treated substrate member. Thereby, the metal of the underlayer diffused through the grain boundaries of gold up to the surface of the gold layer by heat treatment or the like is uniformly mixed with gold to form an alloyed layer excellent in wettability to a solder. At the same time, nonmetallic impurities such as carbon adhering onto the surface of the gold layer are melted and removed.

Printed circuit board with a uniform conductive layer formed by

Solder balls are supplied onto an aligning plate having aligned through-holes formed therein. Air is sucked from the bottom of the above described aligning plate to fit and attract solder balls into the above described through-holes. Solder balls are thus aligned with high work efficiency.

Method and apparatus for aligning solder balls

A method for the alignment of electronic components to be mounted on a printed board. The alignment is accomplished by illuminating the surface of the printed board to cause emission of fluorescent light from the substrate of the printed board, detecting the fluorescent light by optical means to detect an image of the conductor pattern of the printed board as a negative picture, taking an image of leads of an electronic component by optical means as a positive or negative picture, and correcting the deviation of the leads of the electronic component from the conductor pattern on the basis of picture data obtained from both images.

Component alignment method

An apparatus for the alignment of electronic components to be mounted on a printed board. The alignment is accomplished by illuminating the surface of the printed board to cause emission of a fluorescent light from the substrate of the printed board, detecting the fluorescent light by optical means to detect an image of the conductor pattern of the printed board as a negative picture, taking an image of the electronic component leads through a different optical route and calculating the amount of deviation in position of the leads of an electronic component in accordance with the picture data obtained by both images, in order to correct the deviation.

Component alignment apparatus

A machine for automatically wiring an insulated fine wire as thin as a hair on the printed circuit board of wiring patterns are set up between adjacent conductor printed circuit board to be applied with wirings is carried by an X-Y table which is movable in X and Y directions, and the X-Y table is moved in accordance with wiring sites. A wire guide unit, a bonding unit and a wire cutter unit mounted, above the X-Y table, to a head rotatably supported about an axis perpendicular to the X-Y table surface are rotated along with the head so as to be oriented in various directions an optical device is supported for optical monitoring of the operations from above along the rotational axis of the bonding head. The wire guide unit sequentially pays out the insulated fine wire onto the printed circuit board carried by the X-Y table, the bonding unit exposes the core of the payed-out insulated wire and fuses the wire for connection thereof to the conductor pad of the printed circuit board by heating and depressing the payed-out wire, and the wire cutter unit cuts away the wire after completion of wiring.

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Hadano, Japan

Mamoru Kobayashi