Hitachi-High-Technologies Corporation

Lintec Corporation

Texas Instruments Japan Limited

Showa Denko K.k.

Hitachi High-Tech Corporation

Mamoru Kobayashi

Koichi Nagoya

Yoshio Morishige

Hisashi Hatano

Hiroyuki Yamashita

Hideki Fukushima

Eiji Imai

Toshifumi Honda

Masazumi Amagai

Kazuyoshi Ebe

Takahiro Urano

Norito Umehara

Shin Kubota

Hironori Sakurai

Kazuya Katoh

Masahito Nakabayashi

Kazuyoshi Gbe

The present invention aims at providing a defect inspection technique capable of setting parameters used for detecting a defect with a less burden to a user. A defect inspection device according to the present invention receives multiple reference values input by the user and calculates a defect extraction condition so as to optimize an evaluation value calculated with the use of the reference values, the number of actual reports, and the number of false reports.

Flaw inspection device and flaw inspection method

The present invention aims at providing a defect inspection technique capable of setting parameters used for detecting a defect with a less burden to a user. A defect inspection device according to the present invention receives multiple reference values input by the user and calculates a defect extraction condition so as to optimize an evaluation value calculated with the use of the reference values, the number of actual reports, and the number of false reports (refer to FIG.).

A defect inspection device is provided with an illumination optical system that irradiates light or an electron beam onto a sample, a detector that detects a signal obtained from the sample through the irradiation of the light or electron beam, a defect detection unit that detects a defect candidate on the sample through the comparison of a signal output by the detector and a prescribed threshold, and a display unit that displays a setting screen for setting the threshold. The setting screen is a two-dimensional distribution map that represents the distribution of the defect candidates in a three dimensional feature space having three features as the axes thereof and includes the axes of the three features and the threshold, which is represented in one dimension.

Defect inspection device, display device, and defect classification device

In a foreign matter inspection apparatus comprising: irradiating unit for irradiating inspection light to an inspection area of an article to be inspected; intensity detecting unit for detecting intensity of either reflected light or scattered light, which is generated from the inspection area by irradiating thereto the inspection light; position detecting unit for detecting a position of either the reflected light or the scattered light within the inspection area; and deciding unit for deciding whether or not a foreign matter is present within the inspection area; the foreign matter inspection apparatus is comprised of: display unit capable of displaying thereon both a threshold image in which the threshold value is indicated over an entire area of the inspection area, and a detection sensitivity image indicated by being converted from the threshold image.

Foreign matter inspection method and foreign matter inspection apparatus

The present invention provides a resin composition containing a reactive monomer and/or oligomer having allyl ester groups, a film of the resin composition which is excellent in transparency and heat resistance and has a high thickness precision, and a process for producing such a film. The resin composition includes (A) a reactive oligomer having allyl ester groups and represented by the general formula (1): wherein Rrepresents an alkanediyl or alkenediyl group having 1 to 4 carbon atoms with the proviso that a plurality of Rgroups may be the same or different, Rrepresents a cycloalkanediyl, cycloalkenediyl or arenediyl group with the proviso that a plurality of Rgroups may be the same or different, and n represents an average degree of polymerization and is a number of 1 to 30; (B) a polyfunctional (meth)acrylic monomer and/or oligomer; and (C) a thermal polymerization initiator.

Resin compositions, films using the same and process for producing the films

The objective is to provide a surface protecting film for polycarbonate which is easy to laminate on polycarbonate and remove from the polycarbonate, the peel adhesive strength change to polycarbonate with times is small and there is no adhesive transferring to the backside of the film substrate in the case of storage for a long period or at a high temperature in the roll shape made of the long length tape. There provided a surface protecting film for polycarbonate, wherein a film substrate having Young's modulus of 1 GPa or more and an adhesive layer are comprised, the glass transition temperature (Tg) of the adhesive composing of the pressure sensitive adhesive layer being between 40 to 90&#xb0; C. and the initial 180&#xb0; peel adhesive strength to polycarbonate being between 10 to 300 mN/25 mm.

Surface protecting film for polycarbonate

A stamper reception layerof an optical disk producing sheetis composed of a polymeric material that has energy-curing properties and possesses a pre-curing storage elastic modulus of 10to 10Pa. The number of deposits on a stamper can thus be reduced with this optical disk producing sheet

Optical disk producing sheet

The wafer dicing/bonding sheet of the present invention comprises a soft film, a pressure sensitive adhesive layer formed on the soft film, a processing film for polyimide type resin composed of a heat resistant resin which has been formed on the pressure sensitive adhesive layer and a polyimide adhesive layer formed on the processing film. It is preferred that the processing film be a polyethylene naphthalate film whose surface has been subjected to an alkyd release treatment. The present invention facilitates expansion to be conducted after the wafer dicing.

Wafer dicing/bonding sheet and process for producing semiconductor device

A process for manufacturing a wafer dicing/bonding sheet of the present invention comprises a soft film, a pressure sensitive adhesive layer formed on the soft film, a processing film for polyimide type resin composed of a heat resistant resin which has been formed on the pressure sensitive adhesive layer and a polyimide adhesive layer formed on the processing film. It is preferred that the processing film be a polyethylene naphthalate film whose surface has been subjected to an alkyd release treatment. The present invention facilitates expansion to be conducted after the wafer dicing.

Growing community of inventors

Tokyo, Japan

Mamoru Kobayashi