Disco Corporation

Mamoru Kawana

Satoshi Yamanaka

A polishing apparatus includes a polishing unit having a spindle having an axial bore defined therein, a housing by which the spindle is rotatably supported, a polishing pad mounted on an end of the spindle and having an opening defined therein that is held in fluid communication with the axial bore, a slurry supply pipe inserted in the axial bore in the spindle and having a supply port supplying a slurry to the workpiece held on the chuck table and an inlet port remote from the supply port, introducing the slurry into the slurry supply pipe, a slurry introducing unit connected to the inlet port of the slurry supply pipe, introducing the slurry into the inlet port, and a cleaning water introducing unit connected to the inlet port of the slurry supply pipe, introducing cleaning water into the inlet port.

Polishing apparatus

A grinding apparatus includes a holding table for holding a wafer, a support table for supporting the holding table, a motor for rotating the support table, a frame member supporting the support table for rotation, and at least three support poles for supporting the frame member from the base. Each of the support poles has formed in the inside thereof a through-hole, a supply port which communicates the through-hole and an air supply source with each other, and an exhaust port which exhausts air having flowed through the through-hole toward the support table. Air is supplied into the through-hole to cool the support pole, and the air having flowed through the through-hole is exhausted toward the support table.

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Tokyo, Japan

Mamoru Kawana