Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Mamoru Inoue

Takashi Ando

Kiyoshi Mayahara

Kiyokazu Imanishi

Hideo Suzuki

Keniti Matumura

Morimichi Hasegawa

Akira Kabeshita

Takaaki Higashida

Naoyuki Kitamura

Kazuyuki Sawada

Shigeru Namiki

Toshiyuki Fujioka

Tetsuo Imada

Shoji Hara

Osamu Okuda

Takeshi Takeda

Tokuhito Hamane

Hitoshi Minabe

Shuji Ueda

Yoshihiro Yoshida

Shuuichi Kubota

Kazuo Mori

Takeo Takayanagi

Tomohiro Gawa

Yoshiyuki Kubota

Kazuhiko Fujino

Satoshi Kuwano

Teruo Kawaguchi

Haruhiko Kitagawa

Shozi Hara

Kunio Nakata

Yuji Nagasawa

Fujio Kataoka

Shunichi Yabuzaki

A component suction method including feeding components accommodated in component storage spaces of a tape base to a predetermined position, lowering a nozzle capable of sucking the components supplied to the predetermined position, stopping the nozzle at a predetermined distance from an upper surface of the tape base, pushing an undersurface of the component up when the nozzle is at a bottom dead center position or a position adjacent to the center, vacuum-sucking the component by the nozzle at the bottom dead center position or at the position adjacent to the center, and moving the component sucked by the nozzle to a predetermined position of a board after the vacuum-sucking.

Component suction method

Process and apparatus of producing optical disk and process of producing substrate

A component installing device comprises: a tray component supply section ( ) having a plurality of conjointly provided tray component supply mechanisms ( ) for moving selected trays ( ) from a storage position ( ) to a component supply position ( ), according to need, thereby providing the components ( ) accommodated therein for use; and a cassette component supply section ( ) having a plurality of mutually aligned component supply cassettes ( ) for carrying components in a tape cassette or a bulk cassette, and transporting said components to a component supply position ( ), one at a time, thereby providing said components for use. Components ( ) accommodated in the respective trays ( ) located at the component supply positions ( ) of the respective tray component supply mechanisms ( ) in the tray component supply section ( ), and components ( ) transported to the component supply positions ( ) of the respective component supply cassettes ( ) in the cassette component supply section ( ), are variously handled and installed at prescribed positions on a circuit board ( ) by means of an installing head ( ).

Part mounting apparatus and part supply apparatus

A component feeding apparatus for pitch-feeding taping components ( ) to a component feed position ( ), peeling a cover tape ( ) short of the component feed position ( ) and taking out and feeding a component ( ) from an accommodation portion ( ) at the component feed position ( ), wherein the component is supplied stably in an appropriate posture to the component feed position ( ). A slit ( ) is formed in a shutter ( ) capable of moving between a position at which the upper surface of the taping component ( ) is covered and a position at which the component feed position is opened so that a cover tape ( ) peeled from the taping component ( ) can be passed through the slit ( ) and can be pulled up, and the peeling step of the cover tape ( ) and the pitch-feeding step of the taping component ( ) can be separated from each other to prevent the component ( ) from greatly moving and assuming an irregular posture inside the accommodation portion ( ).

Component feeding method and device

A component suction method including feeding components ( ) accommodated in component storage spaces ( ) of a tape base ( ) to a predetermined position, lowering a nozzle ( ) capable of sucking the components supplied to the predetermined position, stopping the nozzle ( ) at a predetermined distance from an upper surface of the tape base, pushing an undersurface of the component up when the nozzle is at a bottom dead center position or a position adjacent to the center, vacuum-sucking the component by the nozzle at the bottom dead center position or at the position adjacent to the center, and moving the component sucked by the nozzle to a predetermined position of a board after the vacuum-sucking.

A component suction method including feeding components (,) accommodated in component storage spaces (,) of a tape base (,) to a predetermined position, lowering a nozzle (,) capable of sucking the components supplied to the predetermined position, stopping the nozzle (,) at a predetermined distance from an upper surface of the tape base, pushing an undersurface of the component up when the nozzle is at a bottom dead center position or a position adjacent to the center, vacuum-sucking the component by the nozzle at the bottom dead center position or at the position adjacent to the center, and moving the component sucked by the nozzle to a predetermined position of a board after the vacuum-sucking.

Cartesian coordinates robot

Part supplying device

An apparatus for grinding spherical surfaces of workpieces includes a grinding section having a grindstone rotating mechanism for rotating around an axis of a shaft thereof with a grindstone held at an end of the shaft, a feeding mechanism for feeding the grindstone rotating mechanism toward the workpiece in a direction along the shaft, and a fixing mechanism for holding the grindstone rotating mechanism and the feeding mechanism and determining an angle 1 inclination of the short of the grindstone rotating mechanism with respect to the workpiece. A plurality of workpiece holding mechanisms are provided for holding the workpieces at ends of shafts thereof, the workpiece held by at least one of the workpiece holding mechanisms being opposed to the grindstone. A workpiece rotating mechanism is provided for rotating the workpiece holding mechanism which holds the workpiece opposed to the grindstone. A workpiece positioning section is provided for holding the workpiece holding mechanisms and being rotated and stopped so that an unground workpiece held by at least one of the workpiece holding mechanisms is placed at a workpiece replacing position when a ground workpiece held by the other of the workpiece holding mechanisms has been placed at a grinding position of the grindstone rotating mechanism.

Apparatus for grinding spherical surface

An apparatus for polishing spherical surfaces of workpieces includes a polishing device rotating on a shaft thereof while holding a polishing tool at an end of the shaft. A pivoting device pivots the polishing device around a polishing position of the tool. A plurality of workpiece holders each hold a workpiece at an end thereof so that one of the workpieces is opposed to the tool. Workpiece holder-holding devices hold the workpiece holders so as to be rotatably and vertically movably. A workpiece holder-pressing device presses at least one of the workpiece holders held by the workpiece holder-holding device against the tool. A rotary table rotates while holding the workpiece holders and the workpiece holder-holding devices, thus placing at least one of the workpiece holders at a workpiece replacing position when the other of the workpiece holders is placed at the polishing position of the polishing device.

Apparatus for polishing a spherical surface

A wire winding apparatus for connecting a plurality of fine wires and a surface-insulated solid wire such as an enamel coated wire. Clamp members clamp an end of the solid wire. Then a winding mechanism pinches an end of the plurality of fine wires with a predetermined force and rotate around the clamped solid wire. During the winding operations, a moving mechanism moves the winding mechanism in a direction of the clamped end of the solid wire. Prior to winding, any excess of the solid wire and plurality of fine wires is trimmed away. After the winding, the solid wire and plurality of fine wires are mechanically and electrically connected.

Wire winding apparatus

A fluid circuit for a work handling apparatus having a suction holder adapted to be selectively communicated with a vacuum source and a compressed air source, an having a first electromagnetic valve having first, second and third ports which are fluid-connected with the vacuum source, the compressed air source and the suction holder, respectively. The first electromagnetic valve is operable, when in a suction position, to communicate the first and third ports with each other and, when in a release position, to communicate said second and third ports with each other. The fluid circuit also has a first passage communicating the suction holder and the third port of the first electromagnetic valve with each other, a pressure sensor, a second electromagnetic valve operable to selectively establish and open a fluid circuit between the pressure sensor and the first passage. The fluid circuit is provided with a gas-liquid separating element disposed in the first passage for separating a liquid component, sucked into the suction holder and then into the first passage, from air. A parallel fluid circuit extends between the compressed air source and the second port of the first electromagnetic valve and including first and second flow regulators, and a switching valve is provided in the parallel fluid circuit for selectively connecting one or both of the first and second flow regulators into the parallel fluid circuit.

Fluid circuit for work handling apparatus

An apparatus for automatically performing plural sequential spherical grinding operations on workpieces such as optical lenses includes a machine base, an index table mounted on the machine base for rotation about an axis, a plurality of chuck units supported by the index table at positions equally spaced about the axis for grasping respective work pieces, and a conveyor for sequentially moving the workpieces adjacent the index table. A positioning device is located adjacent the conveyor for positioning sequentially workpieces to be ground at a selected position on the conveyor. A transfer device is positioned adjacent the conveyor and the index table to sequentially grasp individual workpieces at the selected position and transfer such workpieces sequentially to respective of the chuck units as the index table is rotated about the axis. The chuck units grasp or chuck the respective workpieces. A plurality of grinding units are mounted on the machine base at positions above the chuck units. A plurality of workpiece feed units are mounted on the machine base beneath the index table at positions corresponding to and aligned with positions of respective grinding units. Each feed unit clamps a respective chuck unit, rotates the same, and moves the same upwardly from the index table toward the respective grinding unit.

Apparatus for automatically performing plural sequential spherical

Spindle device

Growing community of inventors

Hirakata, Japan

Mamoru Inoue