Shinko Electric Industries Co., Ltd.

Mamoru Hayashi

Kiyokazu Sato

Fumio Kuraishi

Hirofumi Uchida

Kazuhito Yumoto

Yoshinori Miyajima

There is provided a tape carrier in which the degree of freedom of a fine wiring pattern is enhanced by reducing the diameter of a via pad so that the pitch of the wiring pattern can be made fine, and a metallic ball can be positively joined to the via pad even if the diameter of the metallic ball is extended to as large as possible. A tape carrier comprises: a metallic wiring,formed on one side of a tape base material,through an adhesive layer,; and a plurality of via holes,formed on the other side of the tape base material,, via pads,of the metallic wiring,being exposed to the plurality of via holes,, wherein internal wall surfaces of the via holes, which have been formed by punching the tape material,, on one side of which the adhesive layer,is formed, are subjected to coining-press from the other side of the tape base material,so that the via holes,are formed into tapered holes,, the diameters of the opening portions,of which are extended.

Tape carrier and manufacturing method therefor

In a lead frame adapted to be used for a semiconductor device, a plurality of inner leads are made of a thin conductive material for easily forming a fine pattern of the inner leads. A plurality of outer leads are integrally formed with the respective inner leads. The outer leads are coated with metal layers to increase the thickness thereof, so that a desired strength of the outer leads is obtained. A semiconductor chip is electrically connected to the inner leads. The semiconductor chip and a part of the lead frame including the inner leads are hermetically sealed with a resin and, thus, a semiconductor device is obtained.

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Nagano, Japan

Mamoru Hayashi