Kabushiki Kaisha Toshiba

Mami Yamamoto

Yoshio Noguchi

Satoshi Shimizu

Teruo Takeuchi

Kazuhisa Iwashita

Kazuhiro Inoue

Naoya Takai

Tetsuro Komatsu

Tatsuo Tonedachi

Hiroaki Oshio

Gen Watari

Hidenori Egoshi

A mounting member includes: an insulating substrate, a first die pad unit, first and second terminals. The insulating substrate has a rectangular first surface, a second surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. A through hole is provided from the first surface to the second surface. The first die pad unit is provided on the first surface. The first terminal has a conductive region covering the first side surface, the first surface, and the second surface. The second terminal has a conductive region covering the second side surface and the second surface, connected to the first die pad unit by conductive material provided in the through hole or on a side wall of the through hole. The first die pad unit, the first terminal, and the second terminal are apart from one another.

Photocoupler having light receiving element, light emitting element and MOSFET on a die pad unit of a mounting member that includes terminals with multiplied conductive regions

A photocoupler includes: a support substrate; a MOSFET; a light receiving element; a light emitting element; and a bonding layer. The support substrate includes an insulating layer, input and output terminals. The MOSFET is bonded to the support substrate. The MOSFET has a first surface having an operation region. The light receiving element includes p-n junction and is bonded to the MOSFET. The light receiving element has first and second surfaces. The first surface includes a light reception region, a first electrode, and a second electrode. The light emitting element is connected to the input terminal. The light emitting element has first and second surfaces. The first surface includes first and second electrodes. The second surface has a light emitting region. The bonding layer is configured to bond the light emitting element to the light reception region.

Photocoupler

Semiconductor device having a mounting member that includes a die pad unit and terminals with multiple conductive regions

Mounting member having die pad unit and terminals, and photocoupler having the mounting member

According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 &#x3bc;m or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface.

LED package, method for manufacturing LED package, and packing member for LED package

Portion of a light-emitting diode

Light-emitting diode

Growing community of inventors

Oita-ken, Japan

Mami Yamamoto