Fujitsu Corporation

Mami Nakadate

Nobutaka Itoh

Tetsuyuki Kubota

Makoto Sakairi

Akira Tamura

Shigeo Ishikawa

Yoshiteru Ochi

Akiyoshi Saitou

A board design aid device includes a calculating and correcting units. The calculating unit groups a plurality of layers in a multi-layer board into a plurality of pairs of layers based on design information of the multi-layer board, the plurality of layers being stacked and derives a difference of total amounts in respect to a board design element, each of the total amounts being related to each layer of a pair of layers of the plurality of pairs of layers, the board design element being related to a warp of the multi-layer board. The correcting units, based on the difference of the total amounts, corrects an amount of the board design element for at least one of layers among at least one of the plurality of the pairs of layers so that the difference of the total amounts of the board design element is maintained within a certain range.

Circuit board design and correction method determining a difference between groupings of layers

A bonding surface extraction unit extracts, with reference to bonding information, data of a first bonding surface corresponding to a bottom surface of a bonding model from data of a first partial model and data of a second bonding surface corresponding to a top surface of the bonding model from data of a second partial model. The first partial model is a model of a pad included in a circuit board. The second partial model is a model of an electrode included in a component. The electrode is to be bonded to the pad with a bonding material. A bonding model generation unit generates a side surface establishing a link between outlines of the first bonding surface and the second bonding surface, and obtains data of the bonding model on the basis of a shape formed with the side surface, the first bonding surface, and the second bonding surface.

Bonding model generation apparatus and bonding model generation method

A substrate includes a first plate member; a plurality of first electrodes provided on the major surface of the first plate member, the first electrodes including at least one electrode for circuit connection and at least one monitor electrode separate from the electrode for circuit connection; a second plate member; a plurality of second electrodes provided on the major surface of the second plate member; a plurality of solder members provided between the first electrodes and the second electrodes for electrical connection therebetween, repeatedly; and a detector for detecting an electrical disconnection between at least one of the monitor electrode and the second electrode.

Substrate structure

A structural analysis method that saves analysis time without lowering the prediction accuracy is provided. The structural analysis method has dividing up the analysis target into a plurality of finite elements; defining a plurality of meshes that divide up the analysis target into units larger than the finite elements and calculating, for each mesh, the proportion of one material among the plurality of materials that occupy the finite element contained in the mesh; specifying a mesh in which the calculated proportion of the one material exceeds a predetermined threshold value and generating mesh data by substituting material information specifying materials other than the one material with material information of the materials of the finite elements contained in the specified mesh; and calculating the physical amount yielded in the analysis target on the basis of the generated mesh data.

Structural analysis method employing finite element method

The present invention provides a peel strength simulating apparatus which simulates peel strength between a semiconductor integrated circuit chip and a resin package bonded to each other. The apparatus includes a storage section which stores plural types of parameters. The apparatus also includes a parameter specifying section which specifies a changeable parameter whose numerical value is changeable from the plural types of parameters stored in the storage section and specifies change priorities when specifying plural types of changeable parameters. The apparatus further includes a simulating section which repeats simulation of the peel strength until the peel strength exceeding a predetermined threshold value is obtained while changing the numerical values of the specified changeable parameters according to the specified priorities.

Peel strength simulating apparatus, peel strength simulating program storage medium, and peel strength simulating method

The present invention relates to optimization analysis achieving a target value and provides a device, method and program ensuring improved analysis efficiency and analysis accuracy. The device includes an analysis unit (CPU), an evaluation unit (CPU) and a condition modification unit (CPU). The analysis unit executes an analysis with analysis conditions imparted thereto. The evaluation unit evaluates the analysis results. The condition modification unit modifies the analysis conditions imparted to the analysis unit, based on the evaluation results. An optimum solution is thus derived by performing one or more analyses through the modification of the given analysis conditions.

Growing community of inventors

Kawasaki, Japan

Mami Nakadate