Dell Products Inc.

Mallikarjun Vasa

Bhyrav M Mutnury

Umesh Chandra

Arun Reddy Chada

William Andrew Smith

Vijendera Kumar

Vijender Kumar

James Chen

Sunil Pathania

Sukumar Muthusamy

Ashish Shrivastava

Seema P K

An information handling system includes a memory device and a processor. The memory device includes first data representing a thermal profile of a motherboard, and second data representing a circuit trace of the motherboard. The circuit trace provides a high-speed data interconnection between two or more circuit devices. The processor determines an average temperature of the circuit trace on the motherboard based upon the first data and the second data, and models a trace layout for the circuit trace on the motherboard based upon the average temperature.

Integrated thermal-electrical co-simulation

An information handling system includes a printed circuit board, a surface mount connector including first and second surface mount connector portions, first and second different pairs, and a ground plane. The first and second surface mount connector portions are mounted on the printed circuit board. The first differential pair is located on the first surface mount connector portion, and the second differential pair is located on the second surface mount connector portion. The ground plane is located in between the first and second surface mount connector portions within the printed circuit board. The first ground via is in physical communication with the ground plane and a first ground pad on a surface of the printed circuit board. The second ground via is in physical communication with the ground plane and a second ground pad on the surface of the printed circuit board.

Micro-ground vias for improved signal integrity for high-speed serial links

A circuit board may include a first signal via electrically coupled to multiple layers of the circuit board, a second signal via electrically coupled to multiple layers of the circuit board, and a pair of ground vias configured to provide electrical shielding between the first signal via and the second signal via, the pair of ground vias comprising a first ground via electrically coupled to a ground or power plane of the circuit board and a second ground via electrically coupled to the ground or power plane of the circuit board. The first signal via, the first ground via, and the second ground via may be arranged such that they form an angle of approximately 50 degrees having a vertex at the first signal via, a first ray extending from the first signal via through the first ground via and a second ray extending from the first signal via through the second ground via.

Circuit board ground via patterns for minimizing crosstalk between signal vias

A printed circuit board includes a differential signal via pairs to route differential signal between layers of the printed circuit board. A first differential signal via pair is oriented in a first orientation and a second differential signal via pair is oriented perpendicular to the first orientation. The second differential signal via pair is located such that a midpoint of a first line segment drawn between centers of first and second vias of the second differential signal pair intersects a first ray drawn from a center of a first via of the first differential signal via pair through a center of a second via of the first differential signal via pair. Further, the second differential signal via pair is located such that the midpoint of the first line segment is at a characteristic via-to-via pitch distance for the printed circuit board from the center of the second via of the first differential signal via pair.

Printed circuit board having vias arranged for high speed serial differential pair data links

A signal trace on a printed circuit board (PCB) includes a first trace segment on a first layer of the PCB, the first trace segment having a first end coupled to a transmitter, having a second end, and having a first characteristic impedance that is matched to the transmitter. The signal trace further includes a signal via passing from the first layer of the PCB to a second layer of the PCB, the signal via having a first contact connected to the second end of the first trace segment, having a second contact on the second layer, and having a second characteristic impedance different from the first characteristic impedance. The second characteristic impedance is determined based upon a first distance between the transmitter and the first via.

System and method for via optimization in a printed circuit board

A circuit board assembly of an information handling system has stepped diameter vias that carry communication signals through printed circuit board (PCB) substrates. Each stepped diameter via has a first barrel portion of a first diameter that is drilled through a first portion of the PCB substrates and that is at least lined with a conductive material to electrically conduct a selected one of: (i) a direct current and (ii) a communication signal from an outer layer to an internal layer of the more than one PCB substrate. Each stepped diameter via further includes a second barrel portion that extends from the first barrel portion deeper into the PCB substrates. The second barrel portion has a second diameter that is less than the first diameter and the smaller second diameter improves signal integrity (SI).

Stepped vias for next generation speeds

A stubbed differential trace pair system includes a circuit board having a first differential trace pair with a first trace and a second trace, and a second differential trace pair with a third trace and a fourth trace, where the first trace located opposite the second trace and the third trace from the fourth trace. Second trace stubs extend in a spaced apart orientation relative to each other and from a side of the second trace that is opposite the second trace from the first trace. Third trace stubs extend in a spaced apart orientation relative to each other and from a side of the third trace that is opposite the third trace from the fourth trace. The second trace stubs and the third trace stubs are configured to reduce crosstalk generated by the transmission of signals through the first differential trace pair and the second differential trace pair.

Stubbed differential trace pair system

An information handling system includes a stripline transmission line, the stripline transmission line including a plurality of conductors, each one of the conductors having a mitigation conductor section and a non-mitigation conductor section. The mitigation conductor section includes a first linear section having a first side surface and a second side surface, and a plurality of substantially semi-circular stubs extending from the first side surface of the first liner section. The mitigation conductor section is configured to mitigate near end cross talk between the mitigation conductor section and adjacent conductors.

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Secunderabad, India

Mallikarjun Vasa